Packaging process induced retention degradation of 256 Mbit DRAM with negative wordline bias

2005 ◽  
Author(s):  
Minchen Chang ◽  
Jengping Lin ◽  
Ruey Dar Chang ◽  
S.N. Shih ◽  
Chao-Sung Lai ◽  
...  
Keyword(s):  
Packaging Process

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size

Detecting the 10 Angstroms That Change MEMS Performance

2004 ◽  
Author(s):  
Erika Schutte ◽  
Jack Martin
Keyword(s):  
Thin Films ◽  
Device Performance ◽  
Processing Conditions ◽  
Packaging Process ◽  
Mems Sensor ◽  
Process Characterization ◽  
Measurement Protocol ◽  
Mems Device

Abstract An ellipsometry based measurement protocol was developed to evaluate changes to MEMS sensor surfaces which may occur during packaging using unpatterned test samples. This package-level technique has been used to measure the 0-20 Angstrom thin films that can form or deposit on die during the packaging process for a variety of packaging processing conditions. Correlations with device performance shows this to be a useful tool for packaged MEMS device and process characterization.

Multipurpose quick 3D packaging process

2011 ◽  
Author(s):  
Zhao Yongrui ◽  
Ma Hongbo ◽  
Bi Minglu ◽  
Huang Zhanwu ◽  
Jia Jun ◽  
...  
Keyword(s):  
Packaging Process ◽  
3D Packaging

Deep Learning-Based Bottle Caps Inspection in Beverage Manufacturing and Packaging Process

2021 ◽  
Author(s):  
Pinkaew Horputra ◽  
Rateepat Phrajonthong ◽  
Phisan Kaewprapha
Keyword(s):  
Deep Learning ◽  
Packaging Process

scholarly journals Utilizing an Adaptive Grey Model for Short-Term Time Series Forecasting: A Case Study of Wafer-Level Packaging

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Che-Jung Chang ◽  
Der-Chiang Li ◽  
Wen-Li Dai ◽  
Chien-Chih Chen
Keyword(s):  
Semiconductor Manufacturing ◽  
Manufacturing System ◽  
Grey System Theory ◽  
Grey Model ◽  
Grey System ◽  
Wafer Level ◽  
Short Term ◽  
Packaging Process ◽  
Wafer Level Packaging

The wafer-level packaging process is an important technology used in semiconductor manufacturing, and how to effectively control this manufacturing system is thus an important issue for packaging firms. One way to aid in this process is to use a forecasting tool. However, the number of observations collected in the early stages of this process is usually too few to use with traditional forecasting techniques, and thus inaccurate results are obtained. One potential solution to this problem is the use of grey system theory, with its feature of small dataset modeling. This study thus uses the AGM(1,1) grey model to solve the problem of forecasting in the pilot run stage of the packaging process. The experimental results show that the grey approach is an appropriate and effective forecasting tool for use with small datasets and that it can be applied to improve the wafer-level packaging process.

Characterisation of the opening behavior of multilayer films with cohesive failure mechanism by in situ peel tests in the ESEM

2021 ◽  
pp. 875608792110255
Author(s):  
M Heuser ◽  
A Zankel ◽  
C Mayrhofer ◽  
K Reincke ◽  
B Langer ◽  
...  
Keyword(s):  
Multilayer Structure ◽  
Peel Test ◽  
Multilayer Films ◽  
Cohesive Failure ◽  
Packaging Process ◽  
Flexible Packaging ◽  
Alignment Angle ◽  
Peel Tests ◽  
Bulge Formation

In this work, peel tests inside the chamber of an ESEM ( in situ peel tests) are described with heat-sealed test specimens of packaging systems made of multilayer films that simulate different flexible packaging types, according to the packaging line used. The in situ peel tests provided evidence to describe the influence of three different main aspects of the packaging process in relation to the opening behavior of the sealing packages. The investigated aspects are the peel angle, the alignment angle between the orientation of the multilayer films and the seal, and the bulge formation as a consequence of inadequate sealing parameters. In situ peel tests enabled the differentiation between peel angle and local (micro) peel angle, which results from the overall stiffness of the multilayer structure film. Alignment angles of 90° and 45° were found to produce similar opening forces. Images showing the formation of various new local micro fissures on new planes during the in situ peel test explained how the opening force can be dramatically increased during the tearing of two sealed multilayer films.

scholarly journals A review on nanocellulosic fibres as new material for sustainable packaging: Process and applications

2016 ◽  
Vol 64 ◽  
pp. 823-836 ◽  
Author(s):  
H.P.S. Abdul Khalil ◽  
Y. Davoudpour ◽  
Chaturbhuj K. Saurabh ◽  
Md. S. Hossain ◽  
A. S Adnan ◽  
...  
Keyword(s):  
Packaging Process ◽  
Sustainable Packaging ◽  
New Material

Current sustainable solutions for extending the shelf life of meat and marine products in the packaging process

2021 ◽  
Vol 29 ◽  
pp. 100722
Author(s):  
Arturo B. Soro ◽  
Shaba Noore ◽  
Shay Hannon ◽  
Paul Whyte ◽  
Declan J. Bolton ◽  
...  
Keyword(s):  
Shelf Life ◽  
Packaging Process ◽  
Sustainable Solutions ◽  
Marine Products

Simplified vacuum packaging process by gas gettering using the Au/Ta/Ti metal bonding layer

2021 ◽  
Author(s):  
S. Kariya ◽  
T. Matsumae ◽  
Y. Kurashima ◽  
H. Takagi ◽  
M. Hayase ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Bonding Layer ◽  
Packaging Process ◽  
Metal Bonding
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