Ceramic engineer and manufacturing executive, Philip E. Rogren will explain why molded array packages such as QFNs promise significant cost advantages compared to competitive packaging techniques. He will also describe why there are significant limitations for array packaging techniques based on lead frames. Audiences will learn about the feature of lead frame based packages that is responsible for virtually all of these limitations: Every package terminal and die paddle is a portion of the continuous metal structure that is the lead frame. Every terminal and die paddle is connected to, and held in proper position by, otherwise useless metal projections extending out of the package site to supporting portions of the lead frame. This planer, unitary structure presents limitations in the design of packages, limiting lead counts to around 70 leads and impacting performance because of increased lead to lead parasitic. The structure also adds process steps and cost to the assembly operation. In this presentation Rogren will describe a novel MAP substrate that features print formed, discrete terminal structures and die paddles arrayed on a sacrificial steel substrate. This structure eliminates the disadvantages of the interconnected lead frame based technology. In addition, this manufacturing process substantially reduces the pollution-causing process steps and it eliminates non-recyclable waste.
DEVELOPMENT OF A METHOD FOR IDENTIFYING THE STATE OFHEALTH IN AUTOMOTIVE BATTERIES OF THE LEAD-ACID TYPE
