Comparison of Different Bio-based Polymers for Electronic Substrates

2018 ◽  
Author(s):  
Carolin Henning ◽  
Anna Schmid ◽  
Sophia Hecht ◽  
Kathrin Harre ◽  
Reinhard Bauer
Keyword(s):  
Electronic Substrates

Plasma Process Routes to Synthesis of Carbide, Boride and Nitride Ceramic Powders

1987 ◽  
Vol 98 ◽  
Author(s):  
Aaron J. Becker ◽  
Thomas N. Meyer ◽  
Frances N. Smith ◽  
Jon F. Edd
Keyword(s):  
Silicon Carbide ◽  
Titanium Diboride ◽  
Cost Effective ◽  
Future Application ◽  
Rf Plasma ◽  
Labor Costs ◽  
Plasma Process ◽  
Ceramic Powders ◽  
Conversion Efficiencies ◽  
Electronic Substrates

ABSTRACTAn iterative technique to develop plasma processing, consisting of identifying materials with unique properties, calculating conversion efficiencies, product purity and power from thermodynamic data for the chemical reactions selected to produce it and modeling the process mathematically and physically to determine capital and labor costs is illustrated with production of silicon carbide and titanium diboride in Alcoa's DC plasma facility. The work shows that submicron silicon carbide and titanium diboride containing less than 0.2% oxygen can be produced with plasmas at costs competitive with traditional processes. It has also been reported that aluminum nitride, a material which has the high thermal conductivity needed for high power electronic substrates, can be satisfactorily produced by reacting aluminum powder with nitrogen in an RF plasma system. Future application of plasmas for production of ceramics will depend on discovery of unique properties and cost effective process optimization.

Interdiffusion behavior at the interfaces between deposits of Au nanoparticles and electronic substrates

2007 ◽  
Vol 18 (43) ◽  
pp. 435708 ◽  
Author(s):  
Tzu-Hsuan Kao ◽  
Jenn-Ming Song ◽  
In-Gann Chen ◽  
Teng-Yuan Dong ◽  
Weng-Sing Hwang
Keyword(s):  
Au Nanoparticles ◽  
Electronic Substrates

Film Processing and Applications for Rigid-Rod Polymers

1988 ◽  
Vol 134 ◽  
Author(s):  
Richard W. Lusignea
Keyword(s):  
High Temperature ◽  
Coefficient Of Thermal Expansion ◽  
High Strength ◽  
High Viscosity ◽  
Barrier Films ◽  
Thin Walled Structures ◽  
Planar Orientation ◽  
Rigid Rod ◽  
Nematic Polymer ◽  
Electronic Substrates

ABSTRACTHigh strength, high modulus (2 GPa, 270 GPa, respectively) films have been produced with controllable planar orientation. Films were extruded from high viscosity nematic polymer solutions using rigid-rod aromatic heterocyclic polymers. Novel solution processing and treatment were used to control orientation, microfibrillar structure and texture, and physical properties. The coefficient of thermal expansion of these films was tailored by orientation and addition of secondary materials. This resulted in applications for dimensionally stable electronic substrates and structures for spacecraft. Other applications include high temperature barrier films, thin-walled structures, lightweight capacitors, high temperature insulation and cryogenic tanks.

Mechanical Behavior and Damage of Tridimensional Multilayered Ceramics-Tungsten Power Electronic Substrates

2012 ◽  
Author(s):  
Charlotte Robert ◽  
Sylvie Pommier ◽  
Stephane Lefebvre ◽  
Marion Ortali ◽  
Michel Massiot
Keyword(s):  
Stress Concentration ◽  
Mechanical Behavior ◽  
Brittle Material ◽  
Fracture Behavior ◽  
Weibull Model ◽  
Power Electronic ◽  
Stress Singularities ◽  
Statistic Model ◽  
New Applications ◽  
Electronic Substrates

Since few years a 3D electric lines is developed. But new applications will be to expose this circuit to high variation of temperature and use them for electronic power. Circuits lines are made of tungsten and insulation in alumina. These materials have different behavior. That difference implies mechanics stress and stress singularities. Some stress concentration can fracture materials or interface between them. Alumina is a brittle material. We need to know his fracture behavior. A statistic model is already used: Weibull model. The idea is to break about hundred samples and to related the probabilities to break of alumina used in the circuit versus stress.

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