Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

The use of flexible electronics wearable applications has prompted the need to understand the stresses imposed during human motion for a range of activities. Wearable applications may involve situations in which the electronics may be flexed-to-install, stretched or subjected to thousands cycles of dynamic flexing. In order to develop meaningful test-levels, a better understanding is needed of the use-cases, variance, and the acceleration factors. In this study, the human body motion data for walking, jumping, squats, lunges, and bicep curls were measured using a set of ten Vicon cameras to measure the position, velocity, and accelerations of a standard full-body sensor location of the human body. In addition, reliability data has been gathered on test vehicles subjected to dynamic flexing. Continuous resistance data have been gathered on circuits subjected to dynamic flexing till failure for some of the commonly used trace geometries in electronic circuits. Experimental measurements during the accelerated tests of the boards were combined with the human body motion data to model the acceleration factor for different human activities based on the flexing angles. Human motion for multiple subjects and multiple joints has been correlated to the test levels for the development of acceleration factors. Statistical analysis on the variation of the joint angles with hypothesis testing has been conducted for different subjects and for different human body actions. Acceleration factors models have been developed for walking, jumping, squats, lunges, and bicep curls.

Manufacturing pure cellulose films by recycling ionic liquids as plasticizers

Recycling ionic liquids as plasticizers, a green manufacturing method of pure cellulose films which can be used as electronic substrates is successfully demonstrated.

Bio-electronic aggregates on Neon-Paleolitikos strata

Electronic machinic phenomena yield fascinating links with biological processes. Either in the macro-micro-structure of binary encoded information ‐ bytes on media ‐ to the processual flow programs execute on hardware while operating it. Observing micro-electronic worlds akin to living entities: electronic voltages running throughout electronic architectures pipelining data to memory registers; operating systems executing programs on electronic substrates; data flows taking place in machines and in communications protocols within networks. Static art-sci constructs explore and visualize these observations as 2D drawings (Neon Paleolitikos Drawings, 2017‐present) or 3D sculptures (Binary and Biological Sculpture Series, 2018‐present), creatively exposing their inherent rhythmic organization of information, while dynamic installations (Phoenix.Wolfanddotcom.info, Wolfanddotcom, Half-Plant, 2017, Ant Ennae Labyrinths, 2019‐present) propose immersive interference mechanisms that attempt user entanglement in non-human environments. Seven aesthetic case examples are introduced and explored, observing and seeking resonances between micro-granular electronic, biological and hybrid data as source synthesis. This research proposes a look at bio-electronic aggregates on Neon Paleolitikos strata. After the Anthropocene, Neon Paleolitikos is an imaginary epoch dating since the decline of mankind until the zenith of bio-electronic life forms: operational symbioses combined among ruins of silica, transistors, algorithms, cells, plants, animals and electricity.

Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing Processes

This paper reveals a study on Selective Laser Melting (SLM) as an alternative technology for producing power electronic substrates, and shows the possibility of producing a stable interface between alumina and copper through SLM technique. Additive Manufacturing (AM) has not yet been established in the manufacturing of electronic devices. The prevalent benefits of the generative manufacturing sector such as material efficiency, product customization/–flexibility, elimination of the usage of tools, constructional freedom and less process steps in contrast to the conventional fabrication methods of ceramic substrates for power electronic applications like DBC or AMB, are pointed out. Moreover, AM reduces energy costs due to the elimination of the necessary firing, etching and washing processes. The realized study focuses on the examination of adhesion strengths of copper structures, melted on different Al2O3 ceramics with and without pre-copper and -glass paste coating. The melting process was categorized for different laser parameters (1–3) based on the same energy input. Maximum shear values of the substrate probes reached were at about 30 N/mm2 for copper coated ceramic, and at 20 N/mm2 for conventional and glass paste coated substrates. All results were determined in a full factorial design of experiment (DoE) with 54 combinations and a sample size of six samples per parameter combination. Furthermore, several cross sections of the probes produced were illustrated to better understand the melting and joining behavior of the copper powder applied on the ceramic substrates. For improved mechanical adhesion, the ceramic substrates were roughened by laser radiation, with roughness values measured, and the cracking behavior of the exposed ceramics explained.