Cooling Heat Sinks by Natural and Forced Convection in Microelectronic Packages: Numerical Modeling and Experimental Thermal Studies

Author(s):  
Papa Momar Souare ◽  
Mamadou Kabirou Toure ◽  
Benoit Foisy ◽  
Eric Duchesne ◽  
Julien Sylvestre
Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2041
Author(s):  
Eva C. Silva ◽  
Álvaro M. Sampaio ◽  
António J. Pontes

This study shows the performance of heat sinks (HS) with different designs under forced convection, varying geometric and boundary parameters, via computational fluid dynamics simulations. Initially, a complete and detailed analysis of the thermal performance of various conventional HS designs was taken. Afterwards, HS designs were modified following some additive manufacturing approaches. The HS performance was compared by measuring their temperatures and pressure drop after 15 s. Smaller diameters/thicknesses and larger fins/pins spacing provided better results. For fins HS, the use of radial fins, with an inverted trapezoidal shape and with larger holes was advantageous. Regarding pins HS, the best option contemplated circular pins in combination with frontal holes in their structure. Additionally, lattice HS, only possible to be produced by additive manufacturing, was also studied. Lower temperatures were obtained with a hexagon unit cell. Lastly, a comparison between the best HS in each category showed a lower thermal resistance for lattice HS. Despite the increase of at least 38% in pressure drop, a consequence of its frontal area, the temperature was 26% and 56% lower when compared to conventional pins and fins HS, respectively, and 9% and 28% lower when compared to the best pins and best fins of this study.


2002 ◽  
Vol 25 (2) ◽  
pp. 283-292 ◽  
Author(s):  
K.K. Sikka ◽  
K.E. Torrance ◽  
C.U. Scholler ◽  
P.I. Salanova

2021 ◽  
Author(s):  
Mohamed Ali ◽  
Oraib Al-Ketan ◽  
Mohamad Khalil ◽  
Nada Baobaid ◽  
Kamran Khan ◽  
...  

2021 ◽  
pp. 591-599
Author(s):  
Amra Hasečić ◽  
Armin Hadžić ◽  
Siniša Bikić ◽  
Ejub Džaferović

1990 ◽  
Vol 112 (3) ◽  
pp. 234-240 ◽  
Author(s):  
G. L. Lehmann ◽  
S. J. Kosteva

An experimental study of forced convection heat transfer is reported. Direct air cooling of an electronics packaging system is modeled by a channel flow, with an array of uniformly sized and spaced elements attached to one channel wall. The presence of a single or complete row of longitudinally finned heat sinks creates a modified flow pattern. Convective heat transfer rates at downstream positions are measured and compared to that of a plain array (no heat sinks). Heat transfer rates are described in terms of adiabatic heat transfer coefficients and thermal wake functions. Empirical correlations are presented for both variations in Reynolds number (5000 < Re < 20,000) and heat sink geometry. It is found that the presence of a heat sink can both enhance and degrade the heat transfer coefficient at downstream locations, depending on the relative position.


Author(s):  
Mohamed I. Hassan Ali ◽  
Oraib Al-Ketan ◽  
Mohamad Khalil ◽  
Nada Baobaid ◽  
Kamran Khan ◽  
...  

Abstract In this work, we extend our heat transfer performance study on our proposed new and novel 3D printable architected heat sinks with geometrically complex structures based on triply periodic minimal surfaces (TPMS). Computational fluid dynamics (CFD) modeling is used to assess the effect of porosity distribution, heat load, and isothermal boundary condition on the performance of the proposed TPMS-based heat sinks in active cooling using natural and forced convection heat transfer environments. The convection heat transfer coefficient, surface temperature, pressure drop are predicted using CFD method. The CFD model is validated using experimental results for the pressure drop and is verified by standard analytical results. Three TPMS structures are investigated in different orientations. Dimensionless heat transfer groups are developed to globalize the heat transfer performance of the proposed heat sinks.


2000 ◽  
Vol 10 (04) ◽  
pp. 253-261 ◽  
Author(s):  
P. TEERTSTRA ◽  
M. M. YOVANOVICH ◽  
J. R. CULHAM
Keyword(s):  

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