Thermal improvement of press-pack packages: Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip

2017 ◽  
Author(s):  
Zsolt Toth-Pal ◽  
Yafan Zhang ◽  
Tag Hammam ◽  
Hans-Peter Nee ◽  
Mietek Bakowski
Keyword(s):  
Silicon Carbide ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Molybdenum Substrate ◽  
Thermal Improvement

Investigation of Pressure Dependent Thermal Contact Resistance between Silver Metallized SiC Chip and Molybdenum Substrate and between Molybdenum Substrate and Bulk Copper

2016 ◽  
Vol 858 ◽  
pp. 1061-1065
Author(s):  
Zsolt Toth-Pal ◽  
Ya Fan Zhang ◽  
Hans Peter Nee ◽  
Mietek Bakowski
Keyword(s):  
Heat Transfer ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Cfd Simulation ◽  
Thermal Contact ◽  
Transfer Experiment ◽  
Transfer Path ◽  
Molybdenum Substrate ◽  
Specific Contact ◽  
Computational Fluid Dynamics Cfd

– Thermal contact resistances between a silver metallized SiC chip and a Molybdenum substrate and between the Molybdenum substrate and bulk Copper were measured in a heat transfer experiment. An experimental method to separate thermal contact resistances in a multilayer heat transfer path was used to extract the layer-specific contact resistances. The experimental results were compared with analytical calculations and also with 3-D computational fluid dynamics (CFD) simulation results. The results show significant pressure dependence of the thermal contact resistance and the results show higher thermal contact resistance per unit area between the bulk SiC chip and Molybdenum than between Molybdenum and bulk Copper.

THERMAL CONTACT RESISTANCE MATCHING TO OPTIMIZE PERFORMANCE IN THERMOELECTRIC GENERATORS

2020 ◽  
Vol 27 (7) ◽  
pp. 617-627
Author(s):  
Yuanyuan Tian ◽  
Mengjun Zhang ◽  
Junli Wang ◽  
Anbang Liu ◽  
Huaqing Xie ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermoelectric Generators

High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

Small ◽  
2021 ◽  
pp. 2102128
Author(s):  
Taehun Kim ◽  
Seongkyun Kim ◽  
Eungchul Kim ◽  
Taesung Kim ◽  
Jungwan Cho ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Trade Off
Sign in / Sign up

Export Citation Format

Share Document