Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

2002 ◽  
Author(s):  
Y.T. Cheng ◽  
W.T. Hsu ◽  
L. Lin ◽  
C.T. Nguyen ◽  
K. Najafi
Keyword(s):  
Vacuum Packaging ◽  
Packaging Technology ◽  
Aluminum Silicon

Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

2002 ◽  
Vol 11 (5) ◽  
pp. 556-565 ◽  
Author(s):  
Y.-T. Cheng ◽  
Wan-Tai Hsu ◽  
K. Najafi ◽  
C.T.-C. Nguyen ◽  
Liwei Lin
Keyword(s):  
Vacuum Packaging ◽  
Packaging Technology ◽  
Aluminum Silicon

scholarly journals Vacuum Packaging Technology of AC-PDP using Direct-Joint Method

2001 ◽  
Vol 2 (4) ◽  
pp. 34-38 ◽  
Author(s):  
Duck-Jung Lee ◽  
Yun-Hi Lee ◽  
Gwon-Jin Moon ◽  
Jun-Dong Kim ◽  
Won-Do Choi ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Packaging Technology ◽  
Joint Method

The Design and Simulation of Vibratory Ring Gyroscope

2014 ◽  
Vol 609-610 ◽  
pp. 1029-1032 ◽  
Author(s):  
Mei Yu Meng ◽  
Wen Dong Zhang
Keyword(s):  
Modeling And Simulation ◽  
Quality Factor ◽  
Resonant State ◽  
Vacuum Packaging ◽  
Q Factor ◽  
Wafer Level ◽  
Temperature Drift ◽  
High Quality ◽  
Small Temperature ◽  
Packaging Technology

This paper deals with design and simulation of vibratory ring gyroscope which has good performance as resisting vibration, resisting impact, small temperature drift because of the inherent symmetry of structure. The good performance of gyroscope has verified by detailed modeling and simulation. The manufacture of gyroscope using wafer level vacuum packaging technology making the gyroscope has high quality factor .At last we test the gyroscope and the Q factor is 20300 by detecting the resonant state of the gyroscope.

A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds

2019 ◽  
Vol 943 ◽  
pp. 3-7
Author(s):  
Bin Hong ◽  
Zhen Dong Gao ◽  
Jian Ye Gao ◽  
Ya Ji ◽  
Shun Ya Lv
Keyword(s):  
Thermal Stability ◽  
Structural Features ◽  
Vacuum Packaging ◽  
Experimental Results ◽  
Packaging Technology ◽  
Molding Compounds ◽  
Slip Ring

Due to its specific structural features, the packaging technology is quite essential for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology has been proposed which includes a pouring process and a followed soaking process. Based on the experimental results; the reliability of the CSR packaged obtains a significant improvement as its thermal stability and electric insulating property are obviously advanced, comparing with that fabricated by the normal vacuum packaging method.

Vacuum Packaging Technology for Uncooled Infrared Sensor

2010 ◽  
Vol 5 (2) ◽  
pp. 175-180 ◽  
Author(s):  
Masafumi Kimata ◽  
Takayuki Tokuda ◽  
Akinobu Tsuchinaga ◽  
Takeshi Matsumura ◽  
Hideyuki Abe ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Infrared Sensor ◽  
Packaging Technology

Vacuum-Packaging Technology for IRFPAs

2010 ◽  
Vol 130 (6) ◽  
pp. 212-218 ◽  
Author(s):  
Takeshi Matsumura ◽  
Takayuki Tokuda ◽  
Akinobu Tsutinaga ◽  
Masafumi Kimata ◽  
Hideyuki Abe ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Packaging Technology

The Pouring Process Optimization for the Conductive Slip-Rin

2019 ◽  
Vol 943 ◽  
pp. 48-52
Author(s):  
Kun Liang Zhang ◽  
Bin Hong ◽  
Li Peng Zhang ◽  
Ya Ji ◽  
Zhen Dong Gao ◽  
...  
Keyword(s):  
Process Optimization ◽  
Structural Features ◽  
Vacuum Packaging ◽  
Differential Pressure ◽  
Experimental Results ◽  
Concentric Ring ◽  
Packaging Technology ◽  
Molding Compounds ◽  
Slip Ring

Based on its specific structural features, the packaging technology is extraordinary significant for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology has been proposed which includes a pouring process.By the construction of the relevant models, the packaging technology was calculated by MATLAB and discussed. It indicates that the EMC can be easily poured into the concentric ring slit of the CSR only with a differential pressure of 200 Pa between the outside pressure and the inside pressure. On the bases of the experimental results; the EMC can easily flow up from the bottom to the top of the CSR packaging mold vertically.

Wafer-level vacuum packaging technology based on selective electroplating

2004 ◽  
Author(s):  
Patrice A. Topart ◽  
Sebastien Leclair ◽  
Christine Alain ◽  
Hubert Jerominek
Keyword(s):  
Vacuum Packaging ◽  
Wafer Level ◽  
Packaging Technology
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