A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds

2019 ◽  
Vol 943 ◽  
pp. 3-7
Author(s):  
Bin Hong ◽  
Zhen Dong Gao ◽  
Jian Ye Gao ◽  
Ya Ji ◽  
Shun Ya Lv
Keyword(s):  
Thermal Stability ◽  
Structural Features ◽  
Vacuum Packaging ◽  
Experimental Results ◽  
Packaging Technology ◽  
Molding Compounds ◽  
Slip Ring

Due to its specific structural features, the packaging technology is quite essential for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology has been proposed which includes a pouring process and a followed soaking process. Based on the experimental results; the reliability of the CSR packaged obtains a significant improvement as its thermal stability and electric insulating property are obviously advanced, comparing with that fabricated by the normal vacuum packaging method.

The Pouring Process Optimization for the Conductive Slip-Rin

2019 ◽  
Vol 943 ◽  
pp. 48-52
Author(s):  
Kun Liang Zhang ◽  
Bin Hong ◽  
Li Peng Zhang ◽  
Ya Ji ◽  
Zhen Dong Gao ◽  
...  
Keyword(s):  
Process Optimization ◽  
Structural Features ◽  
Vacuum Packaging ◽  
Differential Pressure ◽  
Experimental Results ◽  
Concentric Ring ◽  
Packaging Technology ◽  
Molding Compounds ◽  
Slip Ring

Based on its specific structural features, the packaging technology is extraordinary significant for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology has been proposed which includes a pouring process.By the construction of the relevant models, the packaging technology was calculated by MATLAB and discussed. It indicates that the EMC can be easily poured into the concentric ring slit of the CSR only with a differential pressure of 200 Pa between the outside pressure and the inside pressure. On the bases of the experimental results; the EMC can easily flow up from the bottom to the top of the CSR packaging mold vertically.

The Soaking Process Optimization for the Conductive Slip-Ring

2019 ◽  
Vol 943 ◽  
pp. 53-57
Author(s):  
Li Peng Zhang ◽  
Bin Hong ◽  
Kun Liang Zhang ◽  
Jian Ye Gao ◽  
Ya Ji ◽  
...  
Keyword(s):  
Process Optimization ◽  
Structural Features ◽  
Vacuum Packaging ◽  
Soaking Time ◽  
Packaging Technology ◽  
Molding Compounds ◽  
Slip Ring

Due to its specific structural features, the packaging technology is extraordinary significant for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology was put forward for which includes a soaking process.By the construction of the soaking models, the packaging technology was calculated by MATLAB and discussed. The soaking model reveals that the soaking time is strongly influenced by the space of the exhaust vent and the added pressure. When the soaking pressure is set at 6 atm with the vent of 0.02 mm width, the EMC can be completely soaked into the tiny spaces of the CSR in 5 min.

scholarly journals Vacuum Packaging Technology of AC-PDP using Direct-Joint Method

2001 ◽  
Vol 2 (4) ◽  
pp. 34-38 ◽  
Author(s):  
Duck-Jung Lee ◽  
Yun-Hi Lee ◽  
Gwon-Jin Moon ◽  
Jun-Dong Kim ◽  
Won-Do Choi ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Packaging Technology ◽  
Joint Method

SEGMENTATION OF HANDWRITTEN CHINESE CHARACTERS FROM DESTINATION ADDRESSES OF MAIL PIECES

2002 ◽  
Vol 16 (01) ◽  
pp. 85-96 ◽  
Author(s):  
YUE LU ◽  
CHEW LIM TAN ◽  
PENGFEI SHI ◽  
KEHUA ZHANG
Keyword(s):  
Hough Transform ◽  
Structural Features ◽  
Experimental Results ◽  
Chinese Characters ◽  
Topological Relations ◽  
Destination Address

In this paper, we illustrate a method to segment handwritten Chinese characters from destination addresses of mail pieces. Fast Hough transform is utilized to detect the reference lines preprinted on the mail piece. In the segmentation, subassemblies of Chinese characters are merged based on the structural features of Chinese characters and the subassemblies' topological relations, viz. upper–lower, inside–outside and left–right relations. The width of subassemblies and the spacing between neighboring subassemblies in the whole image of the destination address are analyzed to guide the merging of the left–right subassemblies. Experimental results with real mail piece images show that the proposed approach has achieved a promising performance for segmenting handwritten Chinese characters.

Nanocomposite Epoxy Resin for SiC Module

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000196-000200 ◽  
Author(s):  
Kenji Okamoto ◽  
Yuji Takematsu ◽  
Miyako Hitomi ◽  
Yoshinari Ikeda ◽  
Yoshikazu Takahashi
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Epoxy Resin ◽  
Molecular Motion ◽  
Experimental Results ◽  
Power Module ◽  
Operation Temperature ◽  
Thermal Stability Of

There is a demand to improve the thermal stability of epoxy molding resins used in the power module of SiC power chips operating at temperatures of 200°C or more. This paper describes a technique for increasing the thermal stability of the resin by decreasing molecular motion through the addition of nanofiller. The experimental results showed that the glass transition temperature (Tg) of the epoxy resin increased by approximately 30°C when the silica nanofiller was added. The epoxy resin added nanofiller was investigated in order to achieve the operation temperature 200°C of power module.

Thermal stability of the structural features in the superhydrophobic boehmite films on austenitic stainless steels

2008 ◽  
Vol 254 (16) ◽  
pp. 5129-5133 ◽  
Author(s):  
Xiaoxue Zhang ◽  
Mari Honkanen ◽  
Mikael Järn ◽  
Jouko Peltonen ◽  
Viljami Pore ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Stainless Steels ◽  
Austenitic Stainless Steels ◽  
Structural Features ◽  
Thermal Stability Of

The Design and Simulation of Vibratory Ring Gyroscope

2014 ◽  
Vol 609-610 ◽  
pp. 1029-1032 ◽  
Author(s):  
Mei Yu Meng ◽  
Wen Dong Zhang
Keyword(s):  
Modeling And Simulation ◽  
Quality Factor ◽  
Resonant State ◽  
Vacuum Packaging ◽  
Q Factor ◽  
Wafer Level ◽  
Temperature Drift ◽  
High Quality ◽  
Small Temperature ◽  
Packaging Technology

This paper deals with design and simulation of vibratory ring gyroscope which has good performance as resisting vibration, resisting impact, small temperature drift because of the inherent symmetry of structure. The good performance of gyroscope has verified by detailed modeling and simulation. The manufacture of gyroscope using wafer level vacuum packaging technology making the gyroscope has high quality factor .At last we test the gyroscope and the Q factor is 20300 by detecting the resonant state of the gyroscope.

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