A March-Based Algorithm for Location and Full Diagnosis of All Unlinked Static Faults

Author(s):  
T.A. Gyonjyan ◽  
G. Harutunyan ◽  
V.A. Vardanian
Keyword(s):  

2009 ◽  
Vol 56 (5) ◽  
pp. 419-423 ◽  
Author(s):  
Jaehoon Song ◽  
Juhee Han ◽  
Hyunbean Yi ◽  
Taejin Jung ◽  
Sungju Park


2009 ◽  
Vol 56 (1) ◽  
pp. 56-60 ◽  
Author(s):  
Jaehoon Song ◽  
Juhee Han ◽  
Hyunbean Yi ◽  
Taejin Jung ◽  
Sungju Park


Author(s):  
Daniel Scheit ◽  
Heinrich Theodor Vierhaus

The reliability of interconnects on ICs has become a major problem in recent years, due to the rise of complexity, low-k-insulating material with reduced stability, and wear-out-effects due to high current density. The total reliability of a system on a chip is more and more dependent on the reliability of interconnects. The growing volume of communication due to the increasing number of integrated functional units is the main reason. Articles have been published, which predict that static faults due to wear-out effects will occur more often. This will harm the reliability and decrease the mean-time-to-failure. Most of the published techniques are aimed at the correction of transient faults. Built-in self-repair has not been discussed as much as the other techniques. In this chapter, the authors will provide an overview over the state of the art for fault-tolerant interconnects. They will discuss the use of built-in self repair in combination with other approved solutions. The combination is a promising way to deal with all kinds of faults.



Author(s):  
Sultan M. Al-Harbi ◽  
Fadel Noor ◽  
Fadi M. Al-Turjman
Keyword(s):  


Author(s):  
P. Min ◽  
H. Yi ◽  
J. Song ◽  
S. Baeg ◽  
S. Park


2021 ◽  
Author(s):  
Mayuri Kunchwar

Modeling the dynamic behaviour of resistive shorts and opens at switch-level dictates the characterization o enhanced delay attributable to these faults with referenc to the input combinations, fault sites, defect resistance and CMOS technology variation. Resistive physical failures make the output voltage fluctuate between intermediate ranges by disturbing the propagation time of the logic, without adversely changing the functional output. To determine the impact of logic propagation delay (tp) on the output voltage (Vout) of a gate, a switch-level fault analysis on CMOS primitive gates is executed for CMOS technologies 350 nm, 180 nm, and 90 nm in comparison with nanometre technologies 45 nm and 32 nm. To understand the nature and effect of actual resistive faults in silicon, static faults in static primitive gates are reviewed after altering the defect resistance. Delay and output voltage changes induced by these variations are determined for CMOS 32 nm technology.





2021 ◽  
Author(s):  
Mayuri Kunchwar

Modeling the dynamic behaviour of resistive shorts and opens at switch-level dictates the characterization o enhanced delay attributable to these faults with referenc to the input combinations, fault sites, defect resistance and CMOS technology variation. Resistive physical failures make the output voltage fluctuate between intermediate ranges by disturbing the propagation time of the logic, without adversely changing the functional output. To determine the impact of logic propagation delay (tp) on the output voltage (Vout) of a gate, a switch-level fault analysis on CMOS primitive gates is executed for CMOS technologies 350 nm, 180 nm, and 90 nm in comparison with nanometre technologies 45 nm and 32 nm. To understand the nature and effect of actual resistive faults in silicon, static faults in static primitive gates are reviewed after altering the defect resistance. Delay and output voltage changes induced by these variations are determined for CMOS 32 nm technology.



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