Bond wire lift-off in IGBT modules due to thermomechanical induced stress

2012 3rd IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG) ◽

10.1109/pedg.2012.6254052 ◽

2012 ◽

Author(s):

K. B. Pedersen ◽

K. Pedersen

Keyword(s):

Induced Stress ◽

Igbt Modules ◽

Bond Wire ◽

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A Novel Bond Wire Fault Detection Method for IGBT Modules based on Turn-on Gate Voltage Overshoot

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2020.3047135 ◽

2020 ◽

pp. 1-1

Author(s):

Yanyong Yang ◽

Pinjia Zhang

Keyword(s):

Fault Detection ◽

Gate Voltage ◽

Detection Method ◽

Turn On ◽

Igbt Modules ◽

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Thermal Mitigation and Optimization via Multi-Tier Bond Wire Layout for IGBT Modules Considering Multicellular Electro-Thermal Effect

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2022.3140766 ◽

2022 ◽

pp. 1-1

Author(s):

Yu Chen ◽

Qiang Wu ◽

Chengmin Li ◽

Haoze Luo ◽

Yuanye Xia ◽

...

Keyword(s):

Thermal Effect ◽

Igbt Modules ◽

Bond Wire ◽

Thermal Mitigation

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Separation and Validation of Bond-Wire and Solder Layer Failure Modes in IGBT Modules

IEEE Transactions on Industry Applications ◽

10.1109/tia.2022.3141034 ◽

2022 ◽

pp. 1-1

Author(s):

Wenzhao Liu ◽

Dao Zhou ◽

Francesco Iannuzzo ◽

Michael Hartmann ◽

Frede Blaabjerg

Keyword(s):

Failure Modes ◽

Igbt Modules ◽

Bond Wire ◽

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Online Condition Monitoring for Bond Wire Degradation of IGBT Modules in Three-Level Neutral-Point-Clamped Converters

IEEE Transactions on Industrial Electronics ◽

10.1109/tie.2020.3005073 ◽

2020 ◽

pp. 1-1

Author(s):

Xulong Wang ◽

Pengju Sun ◽

Lin Sun ◽

Quanming Luo ◽

Xiong Du

Keyword(s):

Condition Monitoring ◽

Neutral Point ◽

Igbt Modules ◽

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Method for electrical detection of bond wire lift-off for power semiconductors

ISPSD '03. 2003 IEEE 15th International Symposium on Power Semiconductor Devices and ICs, 2003. Proceedings. ◽

10.1109/ispsd.2003.1225295 ◽

2004 ◽

Author(s):

J. Lehmann ◽

M. Netzel ◽

R. Herzer ◽

S. Pawel

Keyword(s):

Electrical Detection ◽

Power Semiconductors ◽

Bond Wire ◽

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Bond wire lift-off monitoring based on intersection point movement characteristic in IGBT module

Microelectronics Journal ◽

10.1016/j.mejo.2021.105202 ◽

2021 ◽

pp. 105202

Author(s):

Mingxing Du ◽

Jinlei Xin ◽

Hongbin Wang ◽

Ziwei Ouyang ◽

Kexin Wei

Keyword(s):

Intersection Point ◽

Igbt Module ◽

Movement Characteristic ◽

Bond Wire ◽

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A Lifetime Prediction Method for IGBT Modules Considering the Self-accelerating Effect of Bond Wire Damage

IEEE Journal of Emerging and Selected Topics in Power Electronics ◽

10.1109/jestpe.2020.2992311 ◽

2020 ◽

pp. 1-1 ◽

Author(s):

Fei Qin ◽

Xiaorui Bie ◽

Tong An ◽

Jingru Dai ◽

Yanwei Dai ◽

...

Keyword(s):

Prediction Method ◽

The Self ◽

Lifetime Prediction ◽

Igbt Modules ◽

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Detection of aging related IGBT bond-wire lift-off using spread spectrum time domain reflectometry (SSTDR)

2017 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec.2017.7930785 ◽

2017 ◽

Author(s):

Swagat Das ◽

Faisal Khan ◽

Mohammed Khorshed Alam ◽

Preetham Goli

Keyword(s):

Time Domain ◽

Spread Spectrum ◽

Time Domain Reflectometry ◽

Bond Wire ◽

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Investigation of Bond Wire Lift-Off by Analyzing the Controller Output Voltage Harmonics for the Purpose of Condition Monitoring

2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe) ◽

10.23919/epe20ecceeurope43536.2020.9215692 ◽

2020 ◽

Author(s):

Firat Yuce ◽

Marc Hiller

Keyword(s):

Condition Monitoring ◽

Output Voltage ◽

Bond Wire ◽

Lift Off ◽

Voltage Harmonics

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Condition monitoring IGBT module bond wire lift-off using measurable signals

Proceedings of The 7th International Power Electronics and Motion Control Conference ◽

10.1109/ipemc.2012.6258981 ◽

2012 ◽

Author(s):

Du Mingxing ◽

Wei Kexin ◽

Li Jian ◽

Xie Linlin

Keyword(s):

Condition Monitoring ◽

Igbt Module ◽

Bond Wire ◽

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