Compact model for the characterization of a piezoelectric bend-mode droplet generator

Author(s):  
Dominik Rumschoettel ◽  
Markus Kagerer ◽  
Franz Irlinger ◽  
Tim C. Lueth
2007 ◽  
Vol 24 (5) ◽  
pp. 745-760 ◽  
Author(s):  
Dagmar Nagel ◽  
Uwe Maixner ◽  
Walter Strapp ◽  
Mohammed Wasey

Abstract Advancements in techniques for the operational calibration and characterization of instrument performance of the Particle Measuring Systems, Inc. (PMS), forward scattering spectrometer probe (FSSP) and optical array probes (OAPs) are presented, which also can be used for most in situ particle-measuring optical probes on the market. These techniques include the determination of a distortion matrix to correct for instrumental broadening of the measured particle size distribution. A new version of a monodisperse droplet generator is introduced for absolute calibration in the size range between 10 and 100 μm. In addition, a high-speed technique was employed for the determination of airspeed influence on the sample volume and the sizing of particles. The calibration of a PMS FSSP with real water droplets may be significantly different from the usual calibration with glass beads. High-speed measurements simulate particles at speeds of up to about 250 m s−1. Particle undersizing and the decrease of the sample volume with increasing airspeed are described. The use of the modular tools, built for this work, is discussed for probe alignment, functionality checks, and general characterization and diagnostics both in laboratory and field environments.


Nature ◽  
1993 ◽  
Vol 366 (6452) ◽  
pp. 265-268 ◽  
Author(s):  
S. Brenner ◽  
G. Elgar ◽  
R. Sanford ◽  
A. Macrae ◽  
B. Venkatesh ◽  
...  

2015 ◽  
Vol 62 (11) ◽  
pp. 3554-3559 ◽  
Author(s):  
Francisco J. Garcia-Sanchez ◽  
Adelmo Ortiz-Conde ◽  
Juan Muci ◽  
Andrea Sucre Gonzalez
Keyword(s):  

Author(s):  
Jacob N. Rohan ◽  
Pingping Zhuang ◽  
SS Teja Nibhanupudi ◽  
Sanjay K. Banerjee ◽  
Jaydeep P. Kulkarni
Keyword(s):  

Author(s):  
P. Szabo ◽  
M. Rencz ◽  
V. Sze´kely ◽  
A. Poppe ◽  
G. Farkas ◽  
...  

The main issues in the thermal characterization and modeling of stacked die packages are the appropriate model generation, and the qualification of the die attach quality between the different layers of the stacked die structures. The first part of the paper gives a short introduction of stacked die packages. The next chapter describes the main issues of steady state and transient compact model generation for the thermal behavior of stacked die packages. The third large part of the paper gives an overview of the different methodologies applied today for the quality characterization of the different die attach layers, as a major indicator of the reliability of the package.


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