Interfacial Fracture Analysis of CMOS Cu/Low-$k$ BEOL Interconnect in Advanced Packaging Structures

2009 ◽  
Vol 32 (1) ◽  
pp. 53-61 ◽  
Author(s):  
Chang-Chun Lee ◽  
Chien-Chia Chiu ◽  
Chin-Chiu Hsia ◽  
Kuo-Ning Chiang
Keyword(s):  
Interfacial Fracture ◽  
Fracture Analysis ◽  
Advanced Packaging ◽  
Low K

Effect of Mode-Mixity and Porosity on Interfacial Fracture of Low-k Dielectrics

2004 ◽  
Vol 812 ◽  
Author(s):  
Caroline C. Merrill ◽  
Paul S. Ho
Keyword(s):  
Shear Stress ◽  
Crack Propagation ◽  
Interfacial Adhesion ◽  
Pure Shear ◽  
Interfacial Fracture ◽  
Mode Ii ◽  
Mode Mixity ◽  
Pure Tension ◽  
Low K

AbstractIn this study, we developed a system allowing interfacial adhesion measurements as a function of mode-mixity, from pure tension to pure shear. Results show that the debonding energy increases, by a factor of 3 to 10, as the amount of shear stress increases, approaching mode II conditions. For low k dielectrics, the debonding energy was found to decrease with increasing porosity and increase with increasing plasticity. The crack propagation is also dependent on mode-mixity.

Interfacial Fracture Analysis of a Semicircular Cylindrical Guide Rail#

2010 ◽  
Vol 38 (2) ◽  
pp. 190-203 ◽  
Author(s):  
Hong-Xing Wei ◽  
Yong-Dong Li ◽  
Kang Yong Lee
Keyword(s):  
Interfacial Fracture ◽  
Fracture Analysis ◽  
Guide Rail
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