High-frequency signal transmission characteristics of coplanar waveguides with cone bump interconnections

2010 ◽  
Author(s):  
A Ikeda ◽  
K Kajiwara ◽  
N Watanabe ◽  
T Asano
Keyword(s):  
High Frequency ◽  
Signal Transmission ◽  
Coplanar Waveguides ◽  
Transmission Characteristics ◽  
Frequency Signal ◽  
High Frequency Signal

Development of Novel Non-Destructive Inspection Technique Using High-Frequency Signal Transmission Characteristics

2004 ◽  
Vol 261-263 ◽  
pp. 949-954 ◽  
Author(s):  
Toshimitsu Baba ◽  
Kazuhiro Ogawa ◽  
Tetsuo Shoji
Keyword(s):  
High Frequency ◽  
Fatigue Cracks ◽  
Signal Transmission ◽  
Detection Sensitivity ◽  
Transmission Characteristics ◽  
Frequency Signal ◽  
High Frequency Signal ◽  
Significant Difference ◽  
Paramagnetic Materials ◽  
Non Destructive

A novel non-destructive inspection (NDI) technique that utilizes high-frequency signal transmission characteristics was developed as a more reliable, faster and cheaper NDI technique. This technique forms a transmission circuit that includes the specimen, and detects the signals generated by any surface breaking-defect. In this research, quantitative measurement of closed fatigue cracks was implemented via a newly developed probe. The greatest advantage of this technique is that there is no significant difference in detection of defects in either paramagnetic materials or in ferromagnetic materials. Therefore, the potential effects of corrosion, ferrite content, or deformation martensite on the measurement signals are minimized, and a better S/N ratio can be expected. This technique can also be used to measure the size of defects in components, including welded components, and its detection sensitivity is less than 1 mm for surface breaking-defects.

Impedance Matching Using the Smith Chart

2014 ◽  
Vol 701-702 ◽  
pp. 1158-1161
Author(s):  
Jie Yu ◽  
Wen Dong
Keyword(s):  
Circuit Design ◽  
High Frequency ◽  
Signal Transmission ◽  
Impedance Matching ◽  
Basic Requirement ◽  
Frequency Signal ◽  
High Frequency Signal ◽  
Fast Calculation ◽  
Matching Structure ◽  
Smith Chart

Impedance matching is a basic requirement for high frequency signal transmission, but also a relatively complicated aspect in circuit design. In this article, from the perspective of impedance matching, structure principle and characteristics of Smith chart are introduced. On the basis of Smith chart software, its process of impedance matching is described with a simple example to show the advantages of convenient and fast calculation of Smith chart for impedance matching.

High Speed Signal Transmission using Through-Si Vias and Coplanar Waveguides in a 3D IC Test Structure

2013 ◽  
Vol 2013 (1) ◽  
pp. 000228-000232
Author(s):  
Min Xu ◽  
Robert Geer ◽  
Pavel Kabos ◽  
Thomas Wallis
Keyword(s):  
Integrated Circuits ◽  
High Frequency ◽  
High Speed ◽  
Signal Transmission ◽  
Coplanar Waveguides ◽  
Scattering Parameter ◽  
High Frequency Signal ◽  
3D Integrated Circuits ◽  
High Bandwidth ◽  
Silicon Vias

High frequency signal transmission through silicon substrates is critical for 3D heterogeneous integration. This paper presented fabrication, testing, and simulation of high-frequency interconnects based on through-silicon vias (TSVs) and coplanar waveguides (CPWs) for stacked 3D integrated circuits (3D ICs). Our simulation results showed that adding ground TSVs can improve signal transmission by 6× at 50GHz. We further investigated signal/ground TSV (1SXG) configurations for high-bandwidth signal transmission links. Scattering parameter measurements of fabricated 1SXG TSV structures for frequencies from 100MHz to 50GHz show low insertion loss (S21 less than −1dB up to 50GHz) and return loss (S11 lower than −15dB). These results indicate that these vertical interconnects exhibit good performance for high speed signal transmission. To understand the RF signal transmission in 3D interconnects, we used full wave electromagnetic simulation to investigate the electromagnetic field distribution associated with the ground TSV placement. We observed that the ground TSVs induced substantial overall field confinement, consistent with the experimental observation of improved signal transmission. Simulations also provided design guidance with respect to the substrate conductivity's impact on EM confinement and signal transmission.

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