High Speed Signal Transmission using Through-Si Vias and Coplanar Waveguides in a 3D IC Test Structure

2013 ◽  
Vol 2013 (1) ◽  
pp. 000228-000232
Author(s):  
Min Xu ◽  
Robert Geer ◽  
Pavel Kabos ◽  
Thomas Wallis
Keyword(s):  
Integrated Circuits ◽  
High Frequency ◽  
High Speed ◽  
Signal Transmission ◽  
Coplanar Waveguides ◽  
Scattering Parameter ◽  
High Frequency Signal ◽  
3D Integrated Circuits ◽  
High Bandwidth ◽  
Silicon Vias

High frequency signal transmission through silicon substrates is critical for 3D heterogeneous integration. This paper presented fabrication, testing, and simulation of high-frequency interconnects based on through-silicon vias (TSVs) and coplanar waveguides (CPWs) for stacked 3D integrated circuits (3D ICs). Our simulation results showed that adding ground TSVs can improve signal transmission by 6× at 50GHz. We further investigated signal/ground TSV (1SXG) configurations for high-bandwidth signal transmission links. Scattering parameter measurements of fabricated 1SXG TSV structures for frequencies from 100MHz to 50GHz show low insertion loss (S21 less than −1dB up to 50GHz) and return loss (S11 lower than −15dB). These results indicate that these vertical interconnects exhibit good performance for high speed signal transmission. To understand the RF signal transmission in 3D interconnects, we used full wave electromagnetic simulation to investigate the electromagnetic field distribution associated with the ground TSV placement. We observed that the ground TSVs induced substantial overall field confinement, consistent with the experimental observation of improved signal transmission. Simulations also provided design guidance with respect to the substrate conductivity's impact on EM confinement and signal transmission.

High Frequency Signal Propagation in Through Silicon Vias

2012 ◽  
Vol 2012 (1) ◽  
pp. 000239-000243
Author(s):  
Srinidhi Raghavan Narasimhan ◽  
A. Ege Engin
Keyword(s):  
Wave Propagation ◽  
High Frequency ◽  
High Speed ◽  
Signal Propagation ◽  
Successful Implementation ◽  
High Frequency Signal ◽  
3D Ic ◽  
Through Silicon Vias ◽  
Integration Technology ◽  
Silicon Vias

The 3D IC integration technology and silicon interposers rely on through silicon vias (TSVs) for vertical interconnections. Hence, the medium carrying high frequency signals is lossy silicon (Si). Fundamental understanding of wave propagation through TSVs is essential for successful implementation of 3D IC integration technology as well as for the development of Si interposers at RF/microwave frequencies. The focus of this paper is characterization and modelling of TSVs and Si to explore high speed signal propagation through the lossy Si medium. To understand better the physical significance of the TSV, we will establish a framework for wave propagation through TSVs based on dielectric quasi-TEM, skin effect, and slow-wave modes similar to MIS micro-strip lines. For validation of the existence of these modes, full wave simulation results will be compared with simpler two dimensional transmission line simulators.

scholarly journals Core-Shell Sr2CeO4@SiO2 Filled COC‑Based Composites with Low Dielectric Loss for High-Frequency Substrates

Polymers ◽  
2021 ◽  
Vol 13 (22) ◽  
pp. 4006
Author(s):  
Qinlong Wang ◽  
Hao Wang ◽  
Caixia Zhang ◽  
Qilong Zhang ◽  
Hui Yang
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Loss ◽  
High Frequency ◽  
High Speed ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
Signal Transmission ◽  
Sol Gel ◽  
Normal Operation ◽  
Core Shell

High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr2CeO4@SiO2 was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO2 shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 vol%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m−1·K−1, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/℃. The COC/Sr2CeO4@SiO2 composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.

Integration of a K-Band Receiver Front-End Using a Copper Core Printed Circuit Board

2018 ◽  
Vol 2018 (1) ◽  
pp. 000384-000388
Author(s):  
Brian Curran ◽  
Jacob Reyes ◽  
Christian Tschoban ◽  
Ivan Ndip ◽  
Klaus-Dieter Lang ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Antenna Arrays ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Cost Effective ◽  
Circuit Board ◽  
Front End ◽  
High Bandwidth ◽  
Increasing Demand ◽  
K Band

Abstract Increasing demand for high bandwidth wireless satellite connections and telecommunications has resulted in interest in steerable antenna arrays in the GHz frequency range. These applications require cost-effective integration technologies for high frequency and high power integrated circuits (ICs) using GaAs, for example. In this paper, an integration platform is proposed, that enables GaAs ICs to be directly placed on a copper core inside cavities of a high frequency laminate for optimal cooling purposes. The platform is used to integrate a K-Band receiver front-end, composed of four GaAs ICs, with linear IF output power for input powers above −40dBm and a temperature of 42°C during operation.

3D Electromagnetic Modeling of Through Silicon Vias and Interposers in Electronic Packaging

2012 ◽  
Vol 2012 (1) ◽  
pp. 001057-001067
Author(s):  
Darryl Kostka ◽  
Antonio Ciccomancini Scogna
Keyword(s):  
High Speed ◽  
Signal Transmission ◽  
Form Factors ◽  
Point Of View ◽  
Electromagnetic Modeling ◽  
Electromagnetic Simulations ◽  
Full Wave ◽  
3D Ics ◽  
Silicon Vias ◽  
Delivery Networks

3D ICs promise “more than Moore” integration by packing a lot of functionality into small form factors. Interposers along with TSVs play an important role in 3D integration from an electrical, thermal and mechanical point of view. The goal of this paper is to electrically model TSVs and 3D interposers by means of three 3D full wave electromagnetic simulations. A comparative analysis of various configurations of signal delivery networks in 3D interposers for high speed signal transmission is presented.

Combined Back-EMF Estimator with High-Frequency Signal Injection for Wide Speed Range Sensorless Control of PMLSM

2013 ◽  
Vol 753-755 ◽  
pp. 1405-1408
Author(s):  
Hua Cai Lu ◽  
Xuan Yu Yao ◽  
Juan Ti
Keyword(s):  
High Frequency ◽  
High Speed ◽  
Sensorless Control ◽  
Estimation Method ◽  
Detection Algorithm ◽  
Estimation Accuracy ◽  
High Frequency Signal ◽  
Weighting Method ◽  
Transition Speed ◽  
Signal Injection

This paper describes a composite sensorless position and speed detection algorithm designed for permanent magnet linear synchronous motor (PMLSM). A high-frequency voltage signal injection method is used at starting and low speed, and a back-EMF integrate method is used at high speed, and the two kinds of method are fused by weighting method in the transition speed area. Simulation results show that estimation accuracy of this composite estimation method is satisfactory, and the sensorless control system based on this method has good dynamic response characteristics within full speed.

Study on High-Speed Switch Shifting Solenoid Current Control Technology for Automatic Transmission

2014 ◽  
Vol 1006-1007 ◽  
pp. 639-642
Author(s):  
Chun Fu Li ◽  
Yan Qin Li
Keyword(s):  
High Frequency ◽  
High Speed ◽  
Automatic Transmission ◽  
Current Control ◽  
Control Technology ◽  
Working Process ◽  
Frequency Signal ◽  
High Frequency Signal ◽  
Long Time ◽  
The Ideal

The purpose of the solenoid current control is to decrease holding current of the solenoid by selecting suitable frequency and duty, to keep the solenoid opening reliably for a long time and reduce power consumption and improve the solenoid close feature. In this paper, the high frequency signal in oil pressure holding process is determined by theoretical analysis and experimental study. The purpose of the study is to determine the ideal current in the working process of the solenoid.

Silicon Interposer Featuring Novel Electrical and Optical TSVs

2012 ◽  
Author(s):  
Paragkumar A. Thadesar ◽  
Muhannad S. Bakir
Keyword(s):  
Integrated Circuits ◽  
Heat Sink ◽  
Coefficient Of Thermal Expansion ◽  
Three Dimensional ◽  
System Level ◽  
Performance Improvements ◽  
Fine Pitch ◽  
3D Integrated Circuits ◽  
Photonic Interconnects ◽  
Silicon Vias

Three-dimensional (3D) integrated circuits (ICs) yield system level performance improvements by providing high-bandwidth communication as well as opportunity for heterogeneous integration. It is envisioned that an area array of 3D stacked ICs can be interconnected using dense fine-pitch electrical and photonic interconnects on a silicon interposer. This paper presents a mechanically robust “thick” silicon interposer with novel electrical through-silicon vias (TSVs) and optical TSVs. The novel electrical TSVs described include polymer-clad TSVs and polymer-embedded vias. An advantage of using thick silicon interposer is that microchannels can be integrated in the thick silicon interposer to transfer a coolant to the 3D ICs with interlayer microfluidic heat sink or for the direct integration of a microfluidic heat-sink in the silicon interposer. However, as the thickness of silicon interposer increases, TSV electrical parasitics increase. Moreover, the coefficient of thermal expansion (CTE) mismatch between the copper TSV and silicon causes reliability issues. To reduce TSV capacitance as well as to reduce TSV stresses, polymer-clad electrical TSVs were fabricated. Using the same photodefinable polymer used for the cladding of electrical TSVs, optical TSVs were fabricated and characterized.

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