Power Density Optimization of 700kHz GaN-based Auxiliary Power Module for Electric Vehicles

2020 ◽  
pp. 1-1
Author(s):  
Adhistira Madhyasta Naradhipa ◽  
Sangjin Kim ◽  
Daeki Yang ◽  
Sewan Choi ◽  
Inyong Yeo ◽  
...  
Keyword(s):  
Power Density ◽  
Electric Vehicles ◽  
Power Module ◽  
Auxiliary Power

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

2021 ◽  
Vol 143 (4) ◽  
Author(s):  
Aniket Ajay Lad ◽  
Kai A. James ◽  
William P. King ◽  
Nenad Miljkovic
Keyword(s):  
Design Optimization ◽  
Power Density ◽  
Building Blocks ◽  
Optimization Methods ◽  
Population Based ◽  
Global Optimum ◽  
Heat Sinks ◽  
Geometrical Parameters ◽  
Power Module ◽  
Reduced Order

Abstract The recent growth in electronics power density has created a significant need for effective thermal management solutions. Liquid-cooled heat sinks or cold plates are typically used to achieve high volumetric power density cooling. A natural tradeoff exists between the thermal and hydraulic performance of a cold plate, creating an opportunity for design optimization. Current design optimization methods rely on computationally expensive and time consuming computational fluid dynamics (CFD) simulations. Here, we develop a rapid design optimization tool for liquid cooled heat sinks based on reduced-order models for the thermal-hydraulic behavior. Flow layout is expressed as a combination of simple building blocks on a divided coarse grid. The flow layout and geometrical parameters are incorporated to optimize designs that can effectively address heterogeneous cooling requirements within electronics packages. We demonstrate that the use of population-based searches for optimal layout selection, while not ensuring a global optimum solution, can provide optimal or near-optimal results for most of the test cases studied. The approach is shown to generate optimal designs within a timescale of 60–120 s. A case study based on cooling of a commercial silicon carbide (SiC) electronics power module is used to demonstrate the application of the developed tool and is shown to improve the performance as compared to an aggressive state-of-the-art single-phase liquid cooling solution by reducing the SiC junction-to-coolant thermal resistance by 25% for the same pressure drop.

Research on Power Electronic Integrated Module for SMPs

2004 ◽  
Vol 1 (4) ◽  
pp. 225-230
Author(s):  
Chen Qiaoliang ◽  
Zeng Xiangjun ◽  
Yang Xu ◽  
Wang Zhaoan
Keyword(s):  
Power Density ◽  
Simulation Analysis ◽  
Three Dimensional ◽  
Power Supplies ◽  
Power Module ◽  
Novel Structure ◽  
Higher Power ◽  
Parasitic Parameters ◽  
Conventional Structure ◽  
Switching Mode

A novel structure for a power module used in switching mode power supplies (SMPs) is presented in this paper. The power module employs the three-dimensional terrace structure resulting in lowered parasitic parameters and a higher power density. Based on this structure, the characteristics of the power module, such as parasitic parameters and thermal management performance are evaluated through simulation analysis and experimental research. The measured results for a 1kw prototype demonstrate that the power module based on an aluminum substrate has higher power density, smaller volume and better thermal performance when compared to a module using a conventional structure.

Thermal Resistance Analysis and Simulation of IGBT Module with High Power Density

2013 ◽  
Vol 303-306 ◽  
pp. 1902-1907 ◽  
Author(s):  
Yi Bo Wu ◽  
Guo You Liu ◽  
Ning Hua Xu ◽  
Ze Chun Dou
Keyword(s):  
Thermal Resistance ◽  
Power Density ◽  
High Power ◽  
Resistance Management ◽  
Equivalent Circuit Model ◽  
Element Model ◽  
Equivalent Model ◽  
High Power Density ◽  
Power Module ◽  
Igbt Module

As the IGBT power modules have promising potentials in the application of the field of traction or new energy, the higher power density and higher current rating of the IGBT module become more and more attractive. Thermal resistance is one of the most important characteristics in the application of power semiconductor module. A new 1500A/3300V IGBT module in traction application is developed successfully by Zhuzhou CSR Times Electric Co., Ltd (Lincoln). Thermal resistance management of this IGBT module with high power density is performed in this paper. Based on thermal nodes network, an equivalent circuit model for thermal resistance of power module is highlighted from which the steady state thermal resistance can be optimized by theoretical analysis. Furthermore, thermal numerical simulation of 1500A/3300V IGBT module is accomplished by means of finite element model (FEM). Finally, the thermal equivalent model of the IGBT module is verified by simulation results.

High Power Density, 48V Electrified Drivetrain Technology for Future Hybrid and Electric Vehicles

2019 ◽  
Author(s):  
William Drury ◽  
Chintanbhai Patel ◽  
Andrew Atkins ◽  
Anthony Wearing
Keyword(s):  
Power Density ◽  
Electric Vehicles ◽  
High Power ◽  
High Power Density
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