Layout Considerations of Logic Designs Using an N-layer 3D Nanofabric Process Flow

2020 ◽  
Author(s):  
Edouard Giacomin ◽  
Juergen Boemmels ◽  
Julien Ryckaert ◽  
Francky Catthoor ◽  
Pierre-Emmanuel Gaillardon
Keyword(s):  
Process Flow

Application of KOH Electrochemical Etch and Passive Voltage Contrast Techniques for Deep Sub-Micron CMOS Leaky Gate Detection

2000 ◽  
Author(s):  
Fred Y. Chang ◽  
Victer Chan
Keyword(s):  
Case Studies ◽  
Detection Technique ◽  
Cobalt Silicide ◽  
Process Technology ◽  
Process Flow ◽  
Voltage Contrast ◽  
Emission Detection ◽  
Wet Etch ◽  
Direct Confirmation

Abstract This paper describes a novel de-process flow by combining cobalt silicide / nitride wet etch with KOH electrochemical wet etch (ECW) to identify leaky gate in silicided deep sub-micron process technology. Traditionally, leaky gate identification requires direct confirmation by gate level electrical or emission detection technique. Ohtani [1] used KOH electrochemical etch application to identify nonsilicided leaky gate capacitor in DRAM without using the above confirmation. The result of the case study demonstrates the expanded application of ECW etch to both silicided 0.18um logic and SRAM devices. Voltage contrast at metal 1 to assist leaky gate localization is also proposed. By combining both techniques, the possibility for isolating gate related defects are greatly enhanced. Case studies also show the advantages of the proposed technique over conventional poly level voltage contrast in leaky gate identification especially with devices that use local interconnect and nitride liner process.

A New Deprocess Flow of Failure Analysis for MEMS Motion Sensor

2013 ◽  
Author(s):  
Chun-An Huang ◽  
Han-Yun Long ◽  
King-Ting Chiang ◽  
Li Chuang ◽  
Kevin Tsui
Keyword(s):  
Failure Analysis ◽  
Optical Microscopy ◽  
Motion Sensor ◽  
Thermal System ◽  
Layer By Layer ◽  
Sensor Failure ◽  
Process Flow ◽  
New Process ◽  
Cutting System ◽  
Successful Observation

Abstract This paper demonstrates a new de-process flow for MEMS motion sensor failure analysis, using layer by layer deprocessing to locate defect points. Analysis tools used in this new process flow include IR optical microscopy, thermal system, SEM and a cutting system to de-process of MEMS motion sensor and successful observation defect points.

Innovative process flow to achieve carbon nanotube based interconnects

2008 ◽  
Vol 205 (6) ◽  
pp. 1399-1401 ◽  
Author(s):  
J. C. Coiffic ◽  
M. Fayolle ◽  
P. Faucherand ◽  
M. Levis ◽  
H. Le Poche ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Process Flow ◽  
Innovative Process

The proposition of Process flow model for Scrum and eXtreme Programming

2021 ◽  
Author(s):  
Soukaina Merzouk ◽  
Abdessamad Cherkaoui ◽  
Abdelaziz Marzak ◽  
Nawal Sael ◽  
Fatima-Zahra Guerss
Keyword(s):  
Flow Model ◽  
Extreme Programming ◽  
Process Flow

Intensification of the Process Flow in the Pilot Plant of an Internally Heat-Integrated Distillation Column (HIDiC)

2008 ◽  
Vol 34 (1) ◽  
pp. 70-75 ◽  
Author(s):  
Kinpei Horiuchi ◽  
Masaru Nakaiwa ◽  
Koichi Iwakabe ◽  
Keigo Matsuda ◽  
Masayuki Toda
Keyword(s):  
Pilot Plant ◽  
Distillation Column ◽  
Process Flow

Merging event logs: Combining granularity levels for process flow analysis

2017 ◽  
Vol 71 ◽  
pp. 211-227 ◽  
Author(s):  
Lihi Raichelson ◽  
Pnina Soffer ◽  
Eric Verbeek
Keyword(s):  
Flow Analysis ◽  
Process Flow ◽  
Event Logs
Sign in / Sign up

Export Citation Format

Share Document