Thermal stress characteristics and impact on device keep-out zone for 3-D ICs containing through-silicon-vias

2012 Symposium on VLSI Technology (VLSIT) ◽

10.1109/vlsit.2012.6242482 ◽

2012 ◽

Author(s):

Tengfei Jiang ◽

Suk-Kyu Ryu ◽

Qiu Zhao ◽

Jay Im ◽

Ho-Young Son ◽

...

Keyword(s):

Thermal Stress ◽

Through Silicon Vias ◽

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Failure Mechanism of Copper Through-Silicon Vias Under Biased Thermal Stress

ECS Meeting Abstracts ◽

10.1149/ma2012-02/34/2749 ◽

2012 ◽

Keyword(s):

Thermal Stress ◽

Failure Mechanism ◽

Through Silicon Vias ◽

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Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898705 ◽

2011 ◽

Author(s):

Kuan H. Lu ◽

Suk-Kyu Ryu ◽

Qiu Zhao ◽

Klaus Hummler ◽

Jay Im ◽

...

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Thermal Stress ◽

Stress Determination ◽

Temperature Dependent ◽

Element Analysis ◽

Through Silicon Vias ◽

Silicon Vias ◽

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Thermal stress induced delamination of through silicon vias in 3-D interconnects

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490883 ◽

2010 ◽

Author(s):

Kuan H. Lu ◽

Suk-Kyu Ryu ◽

Qiu Zhao ◽

Xuefeng Zhang ◽

Jay Im ◽

...

Keyword(s):

Thermal Stress ◽

Through Silicon Vias ◽

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Nonlinear thermal stress & strain analysis of through silicon vias with different structures and polymer filling

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184505 ◽

2011 ◽

Author(s):

Jing Zhou ◽

Daquan Yu ◽

Ran He ◽

Feng WeiDai ◽

Xueping Guo ◽

...

Keyword(s):

Thermal Stress ◽

Strain Analysis ◽

Through Silicon Vias ◽

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Nonlinear thermal stress analyses and design guidelines for through silicon vias (TSVs) in 3D IC integration

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117209 ◽

2011 ◽

Author(s):

Ming-Che Hsieh ◽

Sheng-Tsai Wu ◽

Wei Li ◽

Ra-Min Tain ◽

John H. Lau ◽

...

Keyword(s):

Thermal Stress ◽

Design Guidelines ◽

3D Ic ◽

Through Silicon Vias ◽

Silicon Vias ◽

Stress Analyses

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Thermal stress in through-silicon-vias: Theory-of-elasticity approach

Microelectronics Reliability ◽

10.1016/j.microrel.2014.01.004 ◽

2014 ◽

Vol 54 (5) ◽

pp. 972-977 ◽

Author(s):

E. Suhir

Keyword(s):

Thermal Stress ◽

Theory Of Elasticity ◽

Through Silicon Vias ◽

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Temperature-dependant thermal stress analysis of through-silicon-vias during manufacturing process

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756532 ◽

2013 ◽

Author(s):

Meiying Su ◽

Xia Zhang ◽

Lixi Wan ◽

Daquan Yu ◽

Xiangmeng Jing ◽

...

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Manufacturing Process ◽

Through Silicon Vias ◽

Thermal Stress Analysis ◽

Temperature Dependant ◽

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Effects of thermal stress induced by mulitiple through silicon vias on mobility and keep out zone

Acta Physica Sinica ◽

10.7498/aps.64.176601 ◽

2015 ◽

Vol 64 (17) ◽

pp. 176601

Author(s):

Dong Gang ◽

Liu Dang ◽

Shi Tao ◽

Yang Yin-Tang

Keyword(s):

Thermal Stress ◽

Through Silicon Vias ◽

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Thermal stress characteristics and reliability impact on 3-D ICs containing through-silicon-vias

2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology ◽

10.1109/icsict.2012.6467715 ◽

2012 ◽

Author(s):

Tengfei Jiang ◽

Suk-Kyu Ryu ◽

Qiu Zhao ◽

Jay Im ◽

Ho-Young Son ◽

...

Keyword(s):

Thermal Stress ◽

Through Silicon Vias ◽

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Failure mechanism of copper through-silicon vias under biased thermal stress

Thin Solid Films ◽

10.1016/j.tsf.2013.05.039 ◽

2013 ◽

Vol 546 ◽

pp. 14-17 ◽

Author(s):

Seung-Ho Seo ◽

Joo-Sun Hwang ◽

Jun-Mo Yang ◽

Wook-Jung Hwang ◽

Jun-Yeob Song ◽

...

Keyword(s):

Thermal Stress ◽

Failure Mechanism ◽

Through Silicon Vias ◽

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