Sizing of Heat Spreaders Above Dielectric Layers

2001 ◽  
Vol 123 (3) ◽  
pp. 173-181 ◽  
Author(s):  
Calvin Chen ◽  
Marc Hodes ◽  
Lou Manzione
Keyword(s):  
Finite Element Analysis ◽  
Thermal Design ◽  
Power Device ◽  
Heat Spreader ◽  
Element Analysis ◽  
Arbitrary Length ◽  
Design Engineers ◽  
Dielectric Layers ◽  
Heat Spreaders ◽  
Length Width

A means to properly size rectangular heat spreaders between a dielectric layer connected to thermal ground and a power device is developed by modeling the problem as a thermal resistance network. Generalized formulas and nondimensional charts to optimize heat spreader thickness and footprint are presented. The power device and heat spreader are assumed to be (concentric) rectangular solids of arbitrary length, width and thickness. The nondimensional results are validated by finite element analysis (FEA) and examples demonstrate the utility of the methodology to thermal design engineers.

Thermal Design of a Satellite Borne FPGA

2011 ◽  
Vol 52-54 ◽  
pp. 1411-1414 ◽  
Author(s):  
Bo Chen
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Heat Sink ◽  
Thermal Design ◽  
Junction Temperature ◽  
Element Analysis

Thermal design and analysis of a satellite borne FPGA is described in this paper. Thermal-conductive glue, vias and an aluminum bar were used to the FPGA and the PCB under the FPGA in order to help conduct the heat of the FPGA to heat sink. The results of finite element analysis showed that the case temperature of the FPGA decreased from 132.5°C to 55.4°C and the junction temperature decreased from 136.1°C to59.0 °C after the thermal design, which matches the requirements of thermal design.

Placement Optimization for Thermal Performance of Embedded Power Chip Microwave Modules Using BP-GA

2011 ◽  
Vol 189-193 ◽  
pp. 639-642
Author(s):  
Sheng Zhang ◽  
Zhao Hua Wu ◽  
Hong Yan Huang ◽  
Pin Chen ◽  
Tang Wen Bi
Keyword(s):  
Finite Element Analysis ◽  
Temperature Field ◽  
Thermal Field ◽  
Thermal Design ◽  
Internal Temperature ◽  
Element Analysis ◽  
Thermal Distribution ◽  
Placement Optimization ◽  
Field Distributions ◽  
Embedded Power

In the thermal design of Embedded Power Chip Microwave Modules, the placement of chips on substrate has a significant effect on internal temperature field, thus, influence the reliability of the modules. In this paper, Based on BP-GA, the optimization for chips placement of EPCM is achieved by corresponding optimization program. To demonstrate the effectiveness of the results, ANSYS, finite element analysis (FEA) is carried out to assess the thermal field distribution of the optimization for chips placement. The result shows that the thermal field distributions of the optimization are consistent with the FEA results. The internal highest temperature of the initial placements is 90.369°C. After optimization, the internal highest temperature is 86.128°C, the highest temperature be reduced more than 5°C. It can effectively deal with the problem about optimize the thermal placement of EPCM chips, and improves the internal thermal distribution.

scholarly journals TEACHING FINITE ELEMENT ANALYSIS FOR DESIGN ENGINEERS

2011 ◽  
Author(s):  
Paul M. Kurowski
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Product Design ◽  
Engineering Students ◽  
Undergraduate Curriculum ◽  
Design Tool ◽  
Element Analysis ◽  
Design Engineers ◽  
The Finite Element Analysis ◽  
Cost Efficient

The Finite Element Analysis (FEA) is becoming increasingly popular among design engineers using it as one of many product design tools. Safe and cost efficient use of FEA as a product design tool requires training, different from that presently found in undergraduate curriculum of mechanical engineering students. The specific requirements of design engineers for training in the field of FEA have been addressed by the author in a number of professional development courses in FEA, catering specifically to the needs of design engineers. This paper discuses tools and methods used in the development and delivery of these courses and their applicability to the undergraduate courses taught in Canadian Engineering schools.

Fundamental Study on Thermal Characteristics of Heat Spreaders

2011 ◽  
Author(s):  
Yasushi Koito ◽  
Yusaku Nonaka ◽  
Toshio Tomimura
Keyword(s):  
Thermal Management ◽  
Theoretical Study ◽  
Thermal Characteristics ◽  
Thermal Design ◽  
Design Parameters ◽  
Heat Spreader ◽  
Fundamental Study ◽  
Discharge Characteristics ◽  
Heat Spreaders ◽  
Large Heat

A heat spreader is one of the solutions for thermal management of electronic and photonic systems. By placing the heat spreader between a small heat source and a large heat sink, the heat flux is spread from the former to the latter, resulting in a lower thermal spreading resistance between them. There are many types of heat spreaders known today having different heat transfer modes, shapes and sizes. This paper describes the theoretical study to present the fundamental data for the rational use and thermal design of heat spreaders. Two-dimensional disk-shaped mathematical model of the heat spreader is constructed, and the dimensionless numerical analysis is performed to investigate the thermal spreading characteristics of the heat spreaders. From the numerical results, the temperature distribution and the heat flow inside the heat spreaders are visualized, and then the effects of design parameters are clarified. The discussion is also made on the discharge characteristics of the heat spreaders. Moreover, a simple equation is proposed to evaluate the heat spreaders.

A Novel Approach for Assessment of Pressurised Equipment for Slow Depressurisation During Fire

2018 ◽  
Author(s):  
Kaveh Ebrahimi ◽  
Saeid Rahimi Mofrad ◽  
Barry Millet ◽  
Kenneth Kirkpatrick ◽  
George Miller
Keyword(s):  
Finite Element Analysis ◽  
Cold Climate ◽  
Process Industry ◽  
Design Codes ◽  
Element Analysis ◽  
Economic Issues ◽  
Design Engineers ◽  
Novel Approach ◽  
Risk Of Rupture ◽  
Cold Case

Majority of modern design codes and regulations for pressurised equipment mandate that pressurised equipment are equipped with depressurising facilities so that in the event of an over-pressurising scenario or during emergency shut-downs the equipment can be safely depressurised. In the process industry, depressurisation calculations are usually done in accordance with the requirements of API 521 standard. For equipment with a wall thickness greater than 25mm, this standard recommends that depressurising facilities are designed to reduce the pressure of a vapour containing system exposed to external pool fire from the initial internal pressure to the final safe pressure within 15 minutes. There are cases where the depressurising time is even further shortened from 15 minutes by design engineers, e.g. for LPG applications or jet fire scenario. Once depressurisation facilities are sized for the fire-case, depressurising calculations are carried out in order to determine the minimum metal temperatures at coincident pressures reached in the equipment in a non-fire depressurising scenario (called cold-case). This will enable design engineers to analyse equipment for potential brittle fracture of equipment during cold-case depressurisation. Whilst the above mentioned methodology is usually adequate for majority of applications, there may be occasions that achieving API 521 recommended fire-case depressurisation time would require a large depressurising valve. This can potentially cause: • Significantly fast depressurising (and subsequent auto-refrigeration) in the cold-case leading to very low metal temperatures and the need for costly materials, particularly in cold climate environments; • Damage to equipment internals due to high depressurising rate; • Overloading the existing flare network in a brown field project. Increasing the depressurising time can alleviate the operational and/or economic issues arising from rapid depressurisations. However, slower-than-usual depressurisation increases the risk of rupture during fire-case, as equipment will be subject to heat for a longer period of time whilst still pressurised. This paper describes a methodology and identifies the necessary steps for assessment of pressurised equipment for slow depressurisations. The method is based on the provisions in the latest editions of API 521, API 579-1/ASME FFS-1 and Finite Element Analysis (FEA). A sample high pressure vessel is analysed in this paper for both cold and fire depressurisation.

Finite Element Analysis of Four-Leg Capacitive Accelerometer

2012 ◽  
Vol 184-185 ◽  
pp. 1562-1565
Author(s):  
Shu Min Ma ◽  
Chao Chen ◽  
Tao Wang ◽  
Huan Zhang ◽  
Hong Xi Zhou
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Analysis Method ◽  
Element Analysis ◽  
Capacitive Accelerometer ◽  
Finite Element Analysis Method ◽  
The Finite Element Analysis ◽  
Sense Element ◽  
Length Width ◽  
Maximal Displacement

MEMS are the manufacturing of a wide variety of items that are mechanical and electronic in nature. This paper describes a capacitive accelerometer technology using sense element structures. The sense element consists of a symmetrically flat plate of mass supported by four L shaped cantilevers, beams and frameworks. Capacitor plates located on the surface are used to detect the displacement. By using the finite element analysis method to build a model, analyzing the maximal displacement of mass, resonant frequency and stress of cantilever beam with different length, width and thickness.

Phase Change Materials Applied in Thermal Design

2013 ◽  
Vol 750-752 ◽  
pp. 1211-1214
Author(s):  
Shu Yang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Solar Energy ◽  
Phase Change ◽  
Phase Change Material ◽  
Phase Change Materials ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Element Analysis ◽  
Change Material

Phase change material has been widely used in the fields of solar energy, aerospace, aviation, and buildings. In this paper, paraffin is applied in the thermal design of electronic equipment, in order to maintain a constant working circumstance. Finite-element analysis is implemented to analyze the feasibility of this thermal design.

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