Thermal Stress Analysis of SMT PQFP Packages and Interconnections
Keyword(s):
An elasto-plastic analysis of the thermal stresses and strains in a surface mounted plastic-quad-flat-pack (PQFP) assembly by using a 3-D finite element method is presented in this paper. Detailed stress and strain distributions and whole-field displacements of the assembly are also provided for a better understanding of its mechanical behavior during thermal cycling. It was found that the stresses and strains in the PQFP solder joint are smaller than those in the plastic-leaded-chip-carrier (PLCC) solder joint. The results presented herein should be useful in the design for reliability of this class of surface mount assemblies.
2013 ◽
pp. 118-122
Keyword(s):
1987 ◽
Vol 109
(1)
◽
pp. 40-46
◽
2017 ◽
Vol 2640
(1)
◽
pp. 104-114
Keyword(s):
2020 ◽
Vol 20
(06)
◽
pp. 2050039
2014 ◽
Vol 64
(1-2)
◽
pp. 462-470
◽
2014 ◽
Vol 119
◽
pp. 52-61
◽