Non-Fourier Effects at High Heat Flux

1973 ◽  
Vol 95 (2) ◽  
pp. 284-286 ◽  
Author(s):  
M. J. Maurer ◽  
H. A. Thompson

This brief investigates analytically non-Fourier effects in high flux conditions using the relaxation model for heat conduction. Unlike the Fourier model, the relaxation model predicts an instantaneous jump in the surface temperature of solids subjected to a step change in the surface heat flux. Under sufficiently high flux, 107 w/cm2, this jump in temperature may be several hundred degrees in magnitude, resulting in severe thermal stresses at the surface.

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Abas Abdoli ◽  
George S. Dulikravich ◽  
Genesis Vasquez ◽  
Siavash Rastkar

Two-layer single phase flow microchannels were studied for cooling of electronic chips with a hot spot. A chip with 2.45 × 2.45 mm footprint and a hot spot of 0.5 × 0.5 mm in its center was studied in this research. Two different cases were simulated in which heat fluxes of 1500 W cm−2 and 2000 W cm−2 were applied at the hot spot. Heat flux of 1000 W cm−2 was applied on the rest of the chip. Each microchannel layer had 20 channels with an aspect ratio of 4:1. Direction of the second microchannel layer was rotated 90 deg with respect to the first layer. Fully three-dimensional (3D) conjugate heat transfer analysis was performed to study the heat removal capacity of the proposed two-layer microchannel cooling design for high heat flux chips. In the next step, a linear stress analysis was performed to investigate the effects of thermal stresses applied to the microchannel cooling design due to variations of temperature field. Results showed that two-layer microchannel configuration was capable of removing heat from high heat flux chips with a hot spot.


1977 ◽  
Vol 80 (1) ◽  
pp. 153-177 ◽  
Author(s):  
R. A. Antonia ◽  
H. Q. Danh ◽  
A. Prabhu

Measurements of both the velocity and the temperature field have been made in the thermal layer that grows inside a turbulent boundary layer which is subjected to a small step change in surface heat flux. Upstream of the step, the wall heat flux is zero and the velocity boundary layer is nearly self-preserving. The thermal-layer measurements are discussed in the context of a self-preserving analysis for the temperature disturbance which grows underneath a thick external turbulent boundary layer. A logarithmic mean temperature profile is established downstream of the step but the budget for the mean-square temperature fluctuations shows that, in the inner region of the thermal layer, the production and dissipation of temperature fluctuations are not quite equal at the furthest downstream measurement station. The measurements for both the mean and the fluctuating temperature field indicate that the relaxation distance for the thermal layer is quite large, of the order of 1000θ0, where θ0is the momentum thickness of the boundary layer at the step. Statistics of the thermal-layer interface and conditionally sampled measurements with respect to this interface are presented. Measurements of the temperature intermittency factor indicate that the interface is normally distributed with respect to its mean position. Near the step, the passive heat contaminant acts as an effective marker of the organized turbulence structure that has been observed in the wall region of a boundary layer. Accordingly, conditional averages of Reynolds stresses and heat fluxes measured in the heated part of the flow are considerably larger than the conventional averages when the temperature intermittency factor is small.


1998 ◽  
Vol 120 (1) ◽  
pp. 253-258 ◽  
Author(s):  
J. H. Lienhard ◽  
D. S. Napolitano

For heat fluxes ranging above 10 MW/m2 or so, solid surfaces usually experience large thermal stresses and degradation of mechanical properties. The resulting mechanical failure of such surfaces is a primary limitation to the design of thermal systems at extremely high heat flux. This investigation considers the elastic stresses in circular plates subjected to extremely high heat fluxes. A gaussian distributed heat load is applied to one surface of the plate and the heat flux at which yielding occurs is identified. Several candidate materials are examined, accounting for the temperature dependence of yield strength and other properties. The mechanical boundary conditions on the plate are varied. Figures of merit are given for the high flux performance of a number of materials.


2020 ◽  
pp. 35-42
Author(s):  
Yuri P. Zarichnyak ◽  
Vyacheslav P. Khodunkov

The analysis of a new class of measuring instrument for heat quantities based on the use of multi-valued measures of heat conductivity of solids. For example, measuring thermal conductivity of solids shown the fallacy of the proposed approach and the illegality of the use of the principle of ambiguity to intensive thermal quantities. As a proof of the error of the approach, the relations for the thermal conductivities of the component elements of a heat pump that implements a multi-valued measure of thermal conductivity are given, and the limiting cases are considered. In two ways, it is established that the thermal conductivity of the specified measure does not depend on the value of the supplied heat flow. It is shown that the declared accuracy of the thermal conductivity measurement method does not correspond to the actual achievable accuracy values and the standard for the unit of surface heat flux density GET 172-2016. The estimation of the currently achievable accuracy of measuring the thermal conductivity of solids is given. The directions of further research and possible solutions to the problem are given.


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