Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm

2013 ◽  
Vol 4 (2) ◽  
Author(s):  
Avram Bar-Cohen
Keyword(s):  
Thermal Management ◽  
Heat Generation ◽  
Electronic System ◽  
Electronic Systems ◽  
Electronic Components ◽  
Management Technology ◽  
Significant Barrier ◽  
Cooling Technology ◽  
Device Technology

The thermal management challenges facing electronic system developers and the need, as well as challenges, associated with the development of a Gen-3 embedded cooling paradigm are examined. We argue that the inherent limitations of the prevailing “remote cooling” technology have resulted in commercial and military electronic systems that are thermally-limited, performing well below the inherent electrical capability of the device technology they exploit. To overcome these limitations and remove a significant barrier to continued Moore's law progression in electronic components and systems, DARPA is pursuing the aggressive development of thermal management “embedded” in the chip, substrate, and/or package to directly cool the heat generation sites. The options and challenges associated with the development of this “Gen-3” thermal management technology are described.

scholarly journals Liquid metal heat sink for laptop computers

2017 ◽  
Author(s):  
◽  
Chengyi Gu
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Heat Generation ◽  
Heat Sink ◽  
Electronic Systems ◽  
Pump Efficiency ◽  
Liquid Cooling ◽  
Laptop Computer ◽  
Conventional Cooling ◽  
Cooling Loop

With the rapid miniaturization of the electronic systems, heat generation in the components becomes a major concern for thermal management. The high density of heat generation can be a bottleneck to attain higher performance and reliability of computers. Because conventional cooling methods such as finned heat sink are often incapable of providing adequate cooling for sophisticated electronic systems, new systems like heat pipes or liquid cooling systems are being studied. This work focused on the novel design of a liquid metal and heat sink cooling loop targeted for laptop computer thermal management. The liquid metal was driven by an electromechanical pump, offering no moving parts and quiet operation. To better understand the design process, theoretical analysis for fluid flow and heat transfer performance of liquid metal and heat sink are conducted. Furthermore, in order to demonstrate the feasibility of this new concept, a series of experiments on the fabricated module under different heater powers and pump power are performed. A thermal resistance value of 0.53 ?/W was experimentally determined, making the performance similar to competing technologies. Performance was impeded by a low pump efficiency, a known impediment with electromagnetic pumps.

Cooling Methods for High-Power Electronic Systems

2011 ◽  
Vol 29 (1) ◽  
pp. 79-86 ◽  
Author(s):  
Andrei Blinov ◽  
Dmitri Vinnikov ◽  
Tõnu Lehtla
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Cooling System ◽  
Electronic System ◽  
Electronic Systems ◽  
Power Electronic ◽  
Automotive Systems ◽  
Mass Size ◽  
And Performance ◽  
Cooling Methods

Cooling Methods for High-Power Electronic Systems Thermal management is a crucial step in the design of power electronic applications, especially railroad traction and automotive systems. Mass/size parameters, robustness and reliability of the power electronic system greatly depend on the cooling system type and performance. This paper presents an approximate parameter estimation of the thermal management system required as well as different commercially available cooling solutions. Advantages and drawbacks of different designs ranging from simple passive heatsinks to complex evaporative systems are discussed.

Experimental Study on Natural Convection From Vertical Cylinders With Branched Fins

2013 ◽  
Author(s):  
Kuen Tae Park ◽  
Byeongdong Kang ◽  
Hyun Jung Kim ◽  
Dong-Kwon Kim
Keyword(s):  
Natural Convection ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Electronic Components ◽  
Cooling Systems ◽  
Cooling Technology ◽  
Vertical Cylinders

Advances in semiconductor technology and trends in slim and light electronic systems have led to a significant increase in heat dissipation density of the electronic devices. Therefore, effective cooling technology is essential for reliable operation of electronic components. Among various cooling systems, natural convection heat sinks have been proven to be appropriate because of their inherent simplicity, reliability, and low long-term cost. The present study is focused on natural convective heat transfer from the cylindrical heat sink. Especially, the branched fins, which are motivated by the branched design of nature shown in trees and lungs, are used. The heating power and surface temperature are measured for various types of branched fins and numbers of fins. The result showed that the branched fin dissipates 20% more heat compared to the normal plate fins. Therefore, heat sinks with branched fins have a potential as a next-generation cooling device.

Two-phase evaporative battery thermal management technology for EVs/HEVs

2017 ◽  
Vol 18 (5) ◽  
pp. 875-882 ◽  
Author(s):  
Rahman Ataur ◽  
Mohammed Nurul Amin Hawlader ◽  
Helmi Khalid
Keyword(s):  
Thermal Management ◽  
Two Phase ◽  
Battery Thermal Management ◽  
Management Technology

Synchronreluktanz-Motorspindeln in Werkzeugmaschinen*/Synchronous reluctance motor spindles in machine tools – Energy-efficient drives increase accuracy and reduce cooling requirements of machining centers

2019 ◽  
Vol 109 (01-02) ◽  
pp. 72-80
Author(s):  
M. Weber ◽  
M. Helfert ◽  
F. Unterderweide ◽  
E. Abele ◽  
M. Weigold
Keyword(s):  
Thermal Management ◽  
Energy Efficient ◽  
Machine Tools ◽  
Production Management ◽  
Energy Savings ◽  
Cooling System ◽  
Holistic View ◽  
Synchronous Reluctance Motor ◽  
Management Technology ◽  
Reluctance Motor

Im Rahmen des vom Bundesministerium für Wirtschaft und Energie (BMWi) geförderten Projekts „ETA-Fabrik“ am Institut für Produktionsmanagement, Technologie und Werkzeugmaschinen (PTW) der Technischen Universität Darmstadt konnte die Energieeffizienz von Motorspindeln als Hauptenergieverbraucher von Werkzeugmaschinen durch Einsatz der Synchronreluktanztechnologie gesteigert werden. In der Konsequenz ergeben sich weitere Energieeinsparpotenziale und produktionstechnische Vorteile durch eine gesamtenergetische Betrachtung der Werkzeugmaschine mit Kühlsystem und intelligentem Spindelthermomanagement.   As part of the ‘ETA-Fabrik’ project funded by the BMWi, the Institute of Production Management, Technology and Machine Tools (PTW) of the TU Darmstadt has used synchronous reluctance drives to increase the energy efficiency of motor spindles as main energy consumers of machine tools. Subsequently, new opportunities for energy savings and advantages for the manufacturing process arise by taking a holistic view on machine tools including the cooling system, proposing an intelligent spindle thermal management.

Sign in / Sign up

Export Citation Format

Share Document