scholarly journals Liquid metal heat sink for laptop computers

2017 ◽  
Author(s):  
◽  
Chengyi Gu
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Heat Generation ◽  
Heat Sink ◽  
Electronic Systems ◽  
Pump Efficiency ◽  
Liquid Cooling ◽  
Laptop Computer ◽  
Conventional Cooling ◽  
Cooling Loop

With the rapid miniaturization of the electronic systems, heat generation in the components becomes a major concern for thermal management. The high density of heat generation can be a bottleneck to attain higher performance and reliability of computers. Because conventional cooling methods such as finned heat sink are often incapable of providing adequate cooling for sophisticated electronic systems, new systems like heat pipes or liquid cooling systems are being studied. This work focused on the novel design of a liquid metal and heat sink cooling loop targeted for laptop computer thermal management. The liquid metal was driven by an electromechanical pump, offering no moving parts and quiet operation. To better understand the design process, theoretical analysis for fluid flow and heat transfer performance of liquid metal and heat sink are conducted. Furthermore, in order to demonstrate the feasibility of this new concept, a series of experiments on the fabricated module under different heater powers and pump power are performed. A thermal resistance value of 0.53 ?/W was experimentally determined, making the performance similar to competing technologies. Performance was impeded by a low pump efficiency, a known impediment with electromagnetic pumps.

Mathematical and simulation analysis of natural convection heat transfer for DC–DC converter

2020 ◽  
Vol 234 (20) ◽  
pp. 4136-4146
Author(s):  
Vipan Kumar ◽  
Harry Garg ◽  
Chetandeep Singh ◽  
Sucheta Kandoria ◽  
Vinod Karar
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Convection Heat Transfer ◽  
Maximum Temperature ◽  
Electronic Systems ◽  
Optimal Functioning ◽  
Converter Heat ◽  
Safe Operating

Thermal management of electronic systems is the utmost concern to achieve optimum efficiency under space and weight constraints. For the optimal functioning of a system, the heat generated by the electronic components needs to be dissipated efficiently. The passive cooling technique is extensively used in electronic systems, wherein the more contact surface area of a heat source and the surroundings are utilized. This paper focuses on mathematical and simulation analysis for different types of heat sink designs for the 30 W multi-output DC–DC converter. Heat sink with inverted trapezoidal fins has resulted in efficient thermal management of the converter at its safe operating temperature of 398 K. Results show that the maximum temperature attained by the converter was 352 K which was in the safe operating zone of the converter. A comparative study of the effectiveness of heat dissipation with respect to maximum temperature attained has been discussed. Mathematical verification of Rayleigh number for different heat sink designs has also been carried out for its critical value.

Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm

2013 ◽  
Vol 4 (2) ◽  
Author(s):  
Avram Bar-Cohen
Keyword(s):  
Thermal Management ◽  
Heat Generation ◽  
Electronic System ◽  
Electronic Systems ◽  
Electronic Components ◽  
Management Technology ◽  
Significant Barrier ◽  
Cooling Technology ◽  
Device Technology

The thermal management challenges facing electronic system developers and the need, as well as challenges, associated with the development of a Gen-3 embedded cooling paradigm are examined. We argue that the inherent limitations of the prevailing “remote cooling” technology have resulted in commercial and military electronic systems that are thermally-limited, performing well below the inherent electrical capability of the device technology they exploit. To overcome these limitations and remove a significant barrier to continued Moore's law progression in electronic components and systems, DARPA is pursuing the aggressive development of thermal management “embedded” in the chip, substrate, and/or package to directly cool the heat generation sites. The options and challenges associated with the development of this “Gen-3” thermal management technology are described.

scholarly journals Characterization of a Condenser for a High Performance Multi-Condenser Loop Heat Pipe

2011 ◽  
Author(s):  
Daniel F. Hanks ◽  
Teresa B. Peters ◽  
John G. Brisson ◽  
Evelyn N. Wang
Keyword(s):  
Heat Pipe ◽  
Thermal Management ◽  
Heat Sink ◽  
High Performance ◽  
Electronic Systems ◽  
Loop Heat Pipe ◽  
Particle Sizes ◽  
Vapor Interface ◽  
Liquid Vapor

We experimentally characterized a condenser design for a multi-condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The multi-layer stack of condensers utilizes a sintered wick design to stabilize the liquid-vapor interface and prevent liquid flooding of the lower condenser layers in the presence of a gravitational head. In addition a liquid subcooler is incorporated to suppress vapor flashing in the liquid return line. We fabricated the condensers using photo-chemically etched Monel frames with Monel sintered wicks with particle sizes up to 44 μm. We characterized the performance of the condensers in a custom experimental flow rig that monitors the pressure and temperatures of the vapor and liquid. The condenser dissipated the required heat load with a subcooling of up to 18°C, while maintaining a stable liquid-vapor interface with a capillary pressure of 6.2 kPa. In the future, we will incorporate the condenser into a loop heat pipe for a high performance air-cooled heat sink.

Experimental Characterization of a Unique Carbon Fiber Brush Heat Sink in Two-Phase Heat Transfer

2005 ◽  
Author(s):  
Harish Chengalvala ◽  
Amy S. Fleischer ◽  
G. F. Jones
Keyword(s):  
Heat Transfer ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Thermal Performance ◽  
Heat Sink ◽  
Management Strategies ◽  
Liquid Cooling ◽  
Two Phase ◽  
Two Phase Heat Transfer ◽  
Power Densities

The performance enhancements and footprint decreases of advanced electronic devices result in soaring power densities which may in turn lead to elevated operating temperatures. As elevated device temperatures lead to decreased device reliability and increased thermal stresses, it is necessary to employ aggressive thermal management techniques to maintain an acceptable junction temperature at high power densities. For this reason, interest is growing in a variety of liquid cooling techniques This study analyzes an advanced engineered-material heat sink which provides significant improvements in thermal management strategies for advanced electronics. The heat sink consists of a very large number of small cross-section fins fabricated from carbon pitch fibers. For these carbon pitch fibers, the high thermal conductivity reduces the temperature drop along the length of the fin creating a longer effective fin length than for copper fins. The longer length results in more heat transfer surface area and a more effective heat sink. In liquid cooling, the rough surface of the fin will provide multiple bubble nucleation sites, strongly promoting active two-phase heat transfer over the entire fin surface. This surface enhancement is expected to lead to significant increases in performance over conventional heat sinks. This experimental analysis characterizes the thermal performance of the carbon-fiber heat sink in two-phase closed loop thermosyphon operation using FC72 as the operating fluid. The influence of power load, thermosyphon fill volume and condenser operating temperature on the overall thermal performance is examined. The results of this experiment provide significant insight into the possible implementation and benefits of carbon fiber heat sink technology in two-phase flow leading to significant improvements in thermal management strategies for advanced electronics.

Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants

2015 ◽  
Author(s):  
Sheng-Fu Mei ◽  
Zhong-Shan Deng ◽  
Jing Liu
Keyword(s):  
Heat Capacity ◽  
Liquid Metal ◽  
Specific Heat ◽  
Specific Heat Capacity ◽  
High Power ◽  
Heat Sink ◽  
Micro Channel ◽  
Liquid Cooling ◽  
Continuous Increase ◽  
Convective Coefficient

The recent years have witnessed the tremendous development in electronics with high power density, such as highly integrated chips and high power LEDs. As a result, the continuous increase in power consumption of electronics is gradually leading to an urgent need for high performance cooling strategies. Among the existed cooling methods, liquid cooling has been proved to be a kind of effective cooling technology for the removal of a large amount of heat from high power devices. Traditional liquid cooling technique commonly refers to utilizing water as the coolant, which is low cost and owns a relatively higher specific heat capacity, however, lower convective coefficient. On the contrary, liquid metal owns much higher convective coefficient, however, lower specific heat capacity. In addition, the higher cost of liquid metal also limits its utilization with large quantity in electronic cooling areas. In this study, a hybrid mini/micro-channel heat sink, based on both of liquid metal and water, was demonstrated. The new system combines the advantages of the two coolants. Experimental studies were conducted to evaluate the capability of the cooling performances of the hybrid system under different operation conditions, including different flow rates, flow directions, pump failure and thermal shock. The experimental results indicate that the hybrid mini/micro channel heat sink owns better cooling performance than water-based heat sink.

Numerical Evaluation on the Heat Dissipation Capability of Liquid Metal Based Chip Cooling Device

2005 ◽  
Author(s):  
Zhong-Shan Deng ◽  
Jing Liu
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Heat Dissipation ◽  
Cooling System ◽  
Three Dimensional ◽  
Heat Transfer Process ◽  
Liquid Cooling ◽  
Chip Cooling ◽  
Cooling Enhancement ◽  
Liquid Cooling System

With the sharp improvement in computational speed of CPU, thermal management becomes a major concern in the current microelectronic industry. Conventional thermal management methods for CPU chip cooling are approaching their limit for quite a few newly emerging high integrity and high power processors. Therefore, liquid metal based chip cooling method has been proposed to accommodate to this request. In order to better understand the mechanisms of the cooling enhancement by the liquid metal based cooling technique, the three-dimensional heat transfer process thus involved in the cooling chip is numerically simulated in this study. A series of calculations with different flow rates and thermal parameters are performed. The cooling capability of the liquid metal is also compared with that of the water-cooling system. The results indicate that the liquid metal has powerful cooling capability, which is much better than that of the conventional liquid-cooling system.

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