A Mobile Augmented Reality Framework for Inspection and Visualization During Fatigue Tests

2014 ◽  
Author(s):  
Guido Maria Re ◽  
Md. Kharshiduzzaman ◽  
Monica Bordegoni ◽  
Andrea Bernasconi ◽  
Luca Francesco Anodio ◽  
...  
Keyword(s):  
Augmented Reality ◽  
Crack Growth ◽  
Fatigue Test ◽  
Mobile Device ◽  
Fatigue Tests ◽  
Bonded Joints ◽  
Mobile Augmented Reality ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints ◽  
Points Of View

In this paper, a framework based on Augmented Reality (AR) and a mobile device is proposed for monitoring mechanical components during fatigue tests. This solution enables the user to move around and to inspect the component through AR from different points of view. In addition, the framework proposes a solution to estimate in real time the crack growth and to visualize it directly onto the component. A user application is developed according to the proposed framework and it is used for case studies of fatigue test for adhesively bonded joints.

scholarly journals Impact Fatigue of Adhesive Joints

2008 ◽  
Vol 399 ◽  
pp. 71-78 ◽  
Author(s):  
Vadim V. Silberschmidt ◽  
Juan Pablo Casas-Rodriguez ◽  
Ian A. Ashcroft
Keyword(s):  
Crack Growth ◽  
Growth Process ◽  
Bonded Joints ◽  
Impact Fatigue ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints ◽  
Tensile Fatigue ◽  
Damage Processes ◽  
Microstructural Studies ◽  
Loading Type

The paper presents results of studies into the effect of repetitive low-energy impacting (known as impact fatigue) on reliability and crack growth in adhesively bonded joints. This type of loading is compared to the standard tensile fatigue in order to assess severity of such loading regime. Another loading type studied is a combination of a small portion of repetitive impacts with tensile fatigue. Crack propagation in a joint exposed to these types of loading is studied experimentally and numerically (with finite elements). This analysis is accompanied by microstructural studies of various damage processes, active at different stages of the crack growth process.

Crack growth in adhesively bonded joints subjected to variable frequency fatigue loading

2003 ◽  
Vol 79 (12) ◽  
pp. 1161-1182 ◽  
Author(s):  
A. H. Al-Ghamdi ◽  
I. A. Ashcroft ◽  
A. D. Crocombe ◽  
M. M. Abdel-Wahab
Keyword(s):  
Crack Growth ◽  
Fatigue Loading ◽  
Variable Frequency ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints

Experimental Characterization of Crack Growth Behavior in Adhesive Interface under Impact Loading

2016 ◽  
Vol 715 ◽  
pp. 116-121 ◽  
Author(s):  
Sota Oshima ◽  
Hisayoshi Ishida ◽  
Ryota Tanegashima ◽  
Takayuki Kusaka ◽  
Tomo Takeda
Keyword(s):  
Fracture Toughness ◽  
Crack Growth ◽  
Impact Loading ◽  
Split Hopkinson Pressure Bar ◽  
Growth Behavior ◽  
Image Correlation ◽  
Crack Growth Behavior ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints

A novel experimental method has been developed to evaluate the mode I crack growth behavior of adhesively bonded joints under impact loading. The split Hopkinson pressure bar (SHPB) technique and the digital image correlation (DIC) technique was employed to evaluate the crack growth behavior. To reduce the dynamic effects by controlling loading input of the SHPB apparatus, the fracture toughness was determined precisely based on static evaluation formula. To contrive the testing set-up, high loading rate was kept until the arrest of crack. The fracture toughness of titanium alloy/epoxy adhesively bonded joints during crack propagation was obtained successfully by using present method.

Parameter Identification of a Damage Model for the Lifetime Prediction of Adhesively Bonded Joints

2015 ◽  
Vol 784 ◽  
pp. 300-307 ◽  
Author(s):  
Ulrich Kroll ◽  
Anton Matzenmiller
Keyword(s):  
Parameter Identification ◽  
Model Prediction ◽  
Damage Model ◽  
Fatigue Tests ◽  
Model Parameters ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints ◽  
Creep Fatigue ◽  
Identification Strategy

A damage model for thin adhesively bonded joints is presented, which predicts the time to creep-fatigue failure of the joint subjected to combined static and cyclic sustained loadings with constant or variable amplitudes. The influences of particular model parameters on the predicted lifetime are elaborated suggesting the proposed stepwise parameter identification strategy by means of creep and Wöhler fatigue tests until rupture. The parameters are identified and computationally optimized. As a conclusion, the model prediction is verified and validated.

New Electrical Potential Method for Measuring Crack Growth in Nonconductive Materials

2003 ◽  
Author(s):  
H. Nayeb-Hashemi ◽  
D. Swet ◽  
A. Vaziri
Keyword(s):  
Thin Layer ◽  
Crack Length ◽  
Crack Growth ◽  
Electric Potential ◽  
Electrical Resistance ◽  
Electrical Potential ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints ◽  
Adhesively Bonded Joint

D.C. electric potential technique has been used to monitor crack growth in conductive materials. A constant DC current is ppased through thesse materials and the crack length is measured through the changes in the electrical voltage at the crack mouth. However, this method is not applicable in crack growth measurement in nonconductive materials or adhesively bonded joints. For these materials, a new method is developed and is shown to provide a very accurate method for measuring the crack length. The surface of these materials is coated with a thin layer of carbon paint and the crack lenght is measured through the changes in the electrical resistance of the carbon paint, as the crack grows both in the base material and the thin layer carbon paint. In contrast to the D.C. electric potential technique where the position of the probes for measuring the crack length is very important for an accurate measurement of the crack length, the new technique is little sensitive to the probe location. Crack growth is measured in adhesively bonded joints subjected to creep loadings. A modified Compact tension specimen is cut in two pieces across its notch area. The pieces are then glued jusing an adhensive. The surface of the specimen is painted with a thin layer of carbon paint and the changes in its electrical resistance are monitored. It is shown that the carbon paint method provides a quiet sensitive method for monitoring the crack growth. The creep crack growth rate in the adhesively bonded joint is related to Mode I energy release rate, G1. It is shown that the crack grows in the middle of the adhesive layer rather than at the interface of the joint. Micromechanisms of the crack growth are studied using a scanning electron microscope. The damage consists of numerous crazed regions at the crack tip. Crack grows by the linkage of the crazed region.

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