Scanning Thermal Microscopy of Carbon Nanotubes

2000 ◽  
Author(s):  
Li Shi ◽  
Sergei Plyasunov ◽  
Adrian Bachtold ◽  
Paul L. McEuen ◽  
Arunava Majumdar
Keyword(s):  
Carbon Nanotubes ◽  
Thermal Imaging ◽  
Heat Dissipation ◽  
Energy Transport ◽  
Imaging Technique ◽  
Mechanical Deformation ◽  
Phonon Transport ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy ◽  
Nanoelectronic Circuits

Abstract This paper reports the use of scanning thermal microscopy (SThM) for studying heat dissipation and phonon transport in nanoelectronic circuits consisting of carbon nanotubes (CNs). Thermally designed and batch fabricated SThM probes were used to resolve the phonon temperature distribution in the CN circuits with a spatial resolution of 50 nm. Heat dissipation at poor metal-CN contacts could be readily found by the thermal imaging technique. Important questions regarding energy transport in nanoelectronic circuits, such as where is heat dissipated, whether the electrons and phonons are in equilibrium, how phonons are transported, and what are the effects of mechanical deformation on the transport and dissipation properties, are addressed in this work.

scholarly journals Scanning Thermal Microscopy and Ballistic Phonon Transport in Lateral Spin Valves

2021 ◽  
Vol 127 (3) ◽  
Author(s):  
G. Stefanou ◽  
F. Menges ◽  
B. Boehm ◽  
K. A. Moran ◽  
J. Adams ◽  
...  
Keyword(s):  
Phonon Transport ◽  
Spin Valves ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy

Nanoscale Thermal Imaging of Thermionic Devices Using Scanning Thermal Microscopy

2001 ◽  
Author(s):  
Kwong-Luck Tan ◽  
Andrew Miner ◽  
Xiaofeng Fan ◽  
Chris LaBounty ◽  
Gehong Zheng ◽  
...  
Keyword(s):  
Temperature Measurement ◽  
Cross Section ◽  
Temperature Control ◽  
Thermal Imaging ◽  
Relative Size ◽  
Cooling Curves ◽  
Scanning Thermal Microscopy ◽  
Cross Sectional ◽  
Cooling Performance ◽  
Thermal Microscopy

Abstract Ever increasing importance of cooling and precise temperature control in microelectronics and optoelectronics has driven recent development of integrated thermoelectric and thermionic cooling structures. Previous studies have investigated SiGe/Si superlattice thermionic coolers experimentally using thermocouples that were 50 μm in diameter. However, the relative size of these thermocouples as compared to the devices sizes (30–100 μm) makes surface and cross-section temperature measurement of the SiGe/Si superlattice thermionic coolers not possible. In this work, a sub 100 nm probe was used to measure the surface and cross-sectional temperature of the SiGe/Si superlattice thermionic coolers using scanning thermal microscopy. Two sets of superlattice thermionic coolers were used in this study and their cooling curves (temperature vs current) are presented. Each set consists of six devices of different sizes. A comparison of device cooling performance is examined. A mechanism for studying thermionic cooling in the superlattice coolers is discussed through an analysis of the cooler cross-section temperature profile.

Scanning Thermal Microscopy Study of Dissipation in Current-Carrying Carbon Nanotubes

2001 ◽  
Author(s):  
L. Shi ◽  
P. Kim ◽  
S. Plyasunov ◽  
A. Bachtold ◽  
P. L. McEuen ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Electric Fields ◽  
Temperature Drop ◽  
Thermal Conductance ◽  
Power Input ◽  
Large Temperature ◽  
Scanning Thermal Microscopy ◽  
Comparable Amount ◽  
Thermal Microscopy ◽  
Imaging Results

Abstract The temperature distribution of current-carrying carbon nanotubes (CNs) have been measured by scanning thermal microscopy. The thermal imaging results support that multiwall (MW) CNs and semiconducting single wall (SW) CNs are diffusive and dissipative, while metallic SWCNs change from non dissipative at low electric fields to dissipative at high fields due to optical phonon emission. The temperature rise in a 4.5 μm long MWCN was of order 40 K for a power input of 22 μW and increased linearly with power input. There existed a large temperature drop at the tube-substrate interface due to a weak contact thermal conductance about 0.1 W/m-K. For the MWCN, comparable amount of Joule heat was lost from the tube bulk to the substrate and from the tube to the metal contacts.

Near-field thermal imaging of optically excited gold nanostructures: scaling principles for collective heating with heat dissipation into the surrounding medium

Nanoscale ◽  
2018 ◽  
Vol 10 (3) ◽  
pp. 941-948 ◽  
Author(s):  
Susil Baral ◽  
Ali Rafiei Miandashti ◽  
Hugh H. Richardson
Keyword(s):  
Thermal Imaging ◽  
Heat Dissipation ◽  
Imaging Technique ◽  
Near Field ◽  
Surrounding Medium ◽  
Gold Nanostructures

In this paper, we introduce a new optical temperature and thermal imaging technique combining near-field microscopy and Er3+ photoluminescence thermometry.

Scanning thermal microscopy of carbon nanotubes using batch-fabricated probes

2000 ◽  
Vol 77 (26) ◽  
pp. 4295-4297 ◽  
Author(s):  
Li Shi ◽  
Sergei Plyasunov ◽  
Adrian Bachtold ◽  
Paul L. McEuen ◽  
Arunava Majumdar
Keyword(s):  
Carbon Nanotubes ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy

Remote Investigation of Buildings' Heat Losses by Thermal Imaging Technique

2009 ◽  
Vol 5 (1) ◽  
pp. 31-35
Author(s):  
F.F. Sizov ◽  
◽  
V.V. Zabudsky ◽  
A.G. Golenkov ◽  
S.L. Kravchenko ◽  
...  
Keyword(s):  
Thermal Imaging ◽  
Imaging Technique ◽  
Heat Losses

scholarly journals Scanning Thermal Microscopy of Ultrathin Films: Numerical Studies Regarding Cantilever Displacement, Thermal Contact Areas, Heat Fluxes, and Heat Distribution

Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 491
Author(s):  
Christoph Metzke ◽  
Fabian Kühnel ◽  
Jonas Weber ◽  
Günther Benstetter
Keyword(s):  
Thermal Properties ◽  
Ultrathin Films ◽  
Hexagonal Boron Nitride ◽  
Thermal Contact ◽  
Heat Transfer Process ◽  
Heat Propagation ◽  
Heat Fluxes ◽  
Detailed Knowledge ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy

New micro- and nanoscale devices require electrically isolating materials with specific thermal properties. One option to characterize these thermal properties is the atomic force microscopy (AFM)-based scanning thermal microscopy (SThM) technique. It enables qualitative mapping of local thermal conductivities of ultrathin films. To fully understand and correctly interpret the results of practical SThM measurements, it is essential to have detailed knowledge about the heat transfer process between the probe and the sample. However, little can be found in the literature so far. Therefore, this work focuses on theoretical SThM studies of ultrathin films with anisotropic thermal properties such as hexagonal boron nitride (h-BN) and compares the results with a bulk silicon (Si) sample. Energy fluxes from the probe to the sample between 0.6 µW and 126.8 µW are found for different cases with a tip radius of approximately 300 nm. A present thermal interface resistance (TIR) between bulk Si and ultrathin h-BN on top can fully suppress a further heat penetration. The time until heat propagation within the sample is stationary is found to be below 1 µs, which may justify higher tip velocities in practical SThM investigations of up to 20 µms−1. It is also demonstrated that there is almost no influence of convection and radiation, whereas a possible TIR between probe and sample must be considered.

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