scholarly journals Scanning Thermal Microscopy of Ultrathin Films: Numerical Studies Regarding Cantilever Displacement, Thermal Contact Areas, Heat Fluxes, and Heat Distribution

Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 491
Author(s):  
Christoph Metzke ◽  
Fabian Kühnel ◽  
Jonas Weber ◽  
Günther Benstetter
Keyword(s):  
Thermal Properties ◽  
Ultrathin Films ◽  
Hexagonal Boron Nitride ◽  
Thermal Contact ◽  
Heat Transfer Process ◽  
Heat Propagation ◽  
Heat Fluxes ◽  
Detailed Knowledge ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy

New micro- and nanoscale devices require electrically isolating materials with specific thermal properties. One option to characterize these thermal properties is the atomic force microscopy (AFM)-based scanning thermal microscopy (SThM) technique. It enables qualitative mapping of local thermal conductivities of ultrathin films. To fully understand and correctly interpret the results of practical SThM measurements, it is essential to have detailed knowledge about the heat transfer process between the probe and the sample. However, little can be found in the literature so far. Therefore, this work focuses on theoretical SThM studies of ultrathin films with anisotropic thermal properties such as hexagonal boron nitride (h-BN) and compares the results with a bulk silicon (Si) sample. Energy fluxes from the probe to the sample between 0.6 µW and 126.8 µW are found for different cases with a tip radius of approximately 300 nm. A present thermal interface resistance (TIR) between bulk Si and ultrathin h-BN on top can fully suppress a further heat penetration. The time until heat propagation within the sample is stationary is found to be below 1 µs, which may justify higher tip velocities in practical SThM investigations of up to 20 µms−1. It is also demonstrated that there is almost no influence of convection and radiation, whereas a possible TIR between probe and sample must be considered.

scholarly journals On the Limits of Scanning Thermal Microscopy of Ultrathin Films

Materials ◽  
2020 ◽  
Vol 13 (3) ◽  
pp. 518
Author(s):  
Christoph Metzke ◽  
Werner Frammelsberger ◽  
Jonas Weber ◽  
Fabian Kühnel ◽  
Kaichen Zhu ◽  
...  
Keyword(s):  
Silicon Dioxide ◽  
Ultrathin Films ◽  
Hexagonal Boron Nitride ◽  
Test Sample ◽  
Copper Iodide ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy ◽  
Force Microscopy ◽  
Transfer Processes ◽  
Atomic Force

Heat transfer processes in micro- and nanoscale devices have become more and more important during the last decades. Scanning thermal microscopy (SThM) is an atomic force microscopy (AFM) based method for analyzing local thermal conductivities of layers with thicknesses in the range of several nm to µm. In this work, we investigate ultrathin films of hexagonal boron nitride (h-BN), copper iodide in zincblende structure (γ-CuI) and some test sample structures fabricated of silicon (Si) and silicon dioxide (SiO2) using SThM. Specifically, we analyze and discuss the influence of the sample topography, the touching angle between probe tip and sample, and the probe tip temperature on the acquired results. In essence, our findings indicate that SThM measurements include artefacts that are not associated with the thermal properties of the film under investigation. We discuss possible ways of influence, as well as the magnitudes involved. Furthermore, we suggest necessary measuring conditions that make qualitative SThM measurements of ultrathin films of h-BN with thicknesses at or below 23 nm possible.

Realizing the nanoscale quantitative thermal mapping of scanning thermal microscopy by resilient tip–surface contact resistance models

2018 ◽  
Vol 3 (5) ◽  
pp. 505-516 ◽  
Author(s):  
Yifan Li ◽  
Nitin Mehra ◽  
Tuo Ji ◽  
Jiahua Zhu
Keyword(s):  
Thermal Properties ◽  
Contact Resistance ◽  
Quantitative Assessment ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy ◽  
Substrate Interface ◽  
Surface Contact ◽  
Surface Contact Resistance

Quantitative assessment of thermal properties by scanning thermal microscopy (SThM) is a demanded technology, but still not yet available due to the presence of unpredictable thermal contact resistance (TCR) at the tip/substrate interface.

Adhesive penetration of wood cell walls investigated by scanning thermal microscopy (SThM)

Holzforschung ◽  
2008 ◽  
Vol 62 (1) ◽  
pp. 91-98 ◽  
Author(s):  
Johannes Konnerth ◽  
David Harper ◽  
Seung-Hwan Lee ◽  
Timothy G. Rials ◽  
Wolfgang Gindl
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Surface Temperature ◽  
Cell Walls ◽  
Adhesive Contact ◽  
Wood Adhesive ◽  
Bond Line ◽  
Scanning Thermal Microscopy ◽  
Thermal Probe ◽  
Thermal Microscopy

Abstract Cross sections of wood adhesive bonds were studied by scanning thermal microscopy (SThM) with the aim of scrutinizing the distribution of adhesive in the bond line region. The distribution of thermal conductivity, as well as temperature in the bond line area, was measured on the surface by means of a nanofabricated thermal probe offering high spatial and thermal resolution. Both the thermal conductivity and the surface temperature measurements were found suitable to differentiate between materials in the bond region, i.e., adhesive, cell walls and embedding epoxy. Of the two SThM modes available, the surface temperature mode provided images with superior optical contrast. The results clearly demonstrate that the polyurethane adhesive did not cause changes of thermal properties in wood cell walls with adhesive contact. By contrast, cell walls adjacent to a phenol-resorcinol-formaldehyde adhesive showed distinctly changed thermal properties, which is attributed to the presence of adhesive in the wood cell wall.

scholarly journals Thermal contact resistance across a linear heterojunction within a hybrid graphene/hexagonal boron nitride sheet

2016 ◽  
Vol 18 (35) ◽  
pp. 24164-24170 ◽  
Author(s):  
Yang Hong ◽  
Jingchao Zhang ◽  
Xiao Cheng Zeng
Keyword(s):  
Heat Transfer ◽  
Thermal Properties ◽  
Boron Nitride ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Hexagonal Boron Nitride ◽  
Thermal Contact ◽  
Thermal Conductance ◽  
Vital Role ◽  
Interfacial Thermal Conductance

Interfacial thermal conductance plays a vital role in defining the thermal properties of nanostructured materials in which heat transfer is predominantly phonon mediated.

Heater Size Effect on Temperature Sensing With Wollaston Scanning Thermal Microprobes

2011 ◽  
Author(s):  
Liang Han ◽  
Yanliang Zhang ◽  
Theodorian Borca-Tasciuc
Keyword(s):  
Thermal Properties ◽  
Size Effect ◽  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Thermal Contact ◽  
Thermal Characterization ◽  
Temperature Sensing ◽  
Scanning Thermal Microscopy ◽  
Minimal Sample ◽  
Precise Quantification

Scanning thermal microscopy (SThM) is an attractive tool for high spatial resolution thermal characterization with minimal sample preparation1. However, complex thermal contact mechanisms often hinder precise quantification of the sample temperature or thermal properties.2

Nano-Localized Thermal Analysis and Mapping of Surface and Sub-Surface Thermal Properties Using Scanning Thermal Microscopy (SThM)

2016 ◽  
Vol 22 (6) ◽  
pp. 1270-1280 ◽  
Author(s):  
Maria J. Pereira ◽  
Joao S. Amaral ◽  
Nuno J. O. Silva ◽  
Vitor S. Amaral
Keyword(s):  
Thermal Conductivity ◽  
Thermal Analysis ◽  
Thermal Properties ◽  
Critical Role ◽  
Scanning Thermal Microscopy ◽  
Reliable Technique ◽  
Thermal Microscopy ◽  
Resistive Heater ◽  
Contrast Analysis ◽  
Conductivity Contrast

AbstractDetermining and acting on thermo-physical properties at the nanoscale is essential for understanding/managing heat distribution in micro/nanostructured materials and miniaturized devices. Adequate thermal nano-characterization techniques are required to address thermal issues compromising device performance. Scanning thermal microscopy (SThM) is a probing and acting technique based on atomic force microscopy using a nano-probe designed to act as a thermometer and resistive heater, achieving high spatial resolution. Enabling direct observation and mapping of thermal properties such as thermal conductivity, SThM is becoming a powerful tool with a critical role in several fields, from material science to device thermal management. We present an overview of the different thermal probes, followed by the contribution of SThM in three currently significant research topics. First, in thermal conductivity contrast studies of graphene monolayers deposited on different substrates, SThM proves itself a reliable technique to clarify the intriguing thermal properties of graphene, which is considered an important contributor to improve the performance of downscaled devices and materials. Second, SThM’s ability to perform sub-surface imaging is highlighted by thermal conductivity contrast analysis of polymeric composites. Finally, an approach to induce and study local structural transitions in ferromagnetic shape memory alloy Ni–Mn–Ga thin films using localized nano-thermal analysis is presented.

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