Self Assembly of Thermo Electric Coolers Using Solder and Fluid Based Methods

Author(s):  
James Tuckerman ◽  
Gary Hendrick ◽  
Nathan B. Crane

Thermoelectric coolers (TECs) are solid state cooling devices that produce a temperature difference under an applied voltage. Thermo electric coolers are made by assembling P and N type Bismuth Telluride elements in series. Previous work has shown that microscale components can achieve higher performance in many applications than macroscale devices. [1, 2]. However, current assembly techniques cannot assemble and produce the smaller devices effectively. This paper will look at a water-based method to compare to prior solder-based assemblies.

2020 ◽  
Vol 38 (7) ◽  
pp. 769-775
Author(s):  
Nicolau Molina Bom ◽  
Érik Oda Usuda ◽  
Mariana da Silva Gigliotti ◽  
Denílson José Marcolino de Aguiar ◽  
William Imamura ◽  
...  

2005 ◽  
Vol 127 (1) ◽  
pp. 108-114 ◽  
Author(s):  
Deyu Li ◽  
Scott T. Huxtable ◽  
Alexis R. Abramson ◽  
Arun Majumdar

Low-dimensional nanostructured materials are promising candidates for high efficiency solid-state cooling devices based on the Peltier effect. Thermal transport in these low-dimensional materials is a key factor for device performance since the thermoelectric figure of merit is inversely proportional to thermal conductivity. Therefore, understanding thermal transport in nanostructured materials is crucial for engineering high performance devices. Thermal transport in semiconductors is dominated by lattice vibrations called phonons, and phonon transport is often markedly different in nanostructures than it is in bulk materials for a number of reasons. First, as the size of a structure decreases, its surface area to volume ratio increases, thereby increasing the importance of boundaries and interfaces. Additionally, at the nanoscale the characteristic length of the structure approaches the phonon wavelength, and other interesting phenomena such as dispersion relation modification and quantum confinement may arise and further alter the thermal transport. In this paper we discuss phonon transport in semiconductor superlattices and nanowires with regards to applications in solid-state cooling devices. Systematic studies on periodic multilayers called superlattices disclose the relative importance of acoustic impedance mismatch, alloy scattering, and crystalline imperfections at the interfaces. Thermal conductivity measurements of mono-crystalline silicon nanowires of different diameters reveal the strong effects of phonon-boundary scattering. Experimental results for Si/SiGe superlattice nanowires indicate that different phonon scattering mechanisms may disrupt phonon transport at different frequencies. These experimental studies provide insight regarding the dominant mechanisms for phonon transport in nanostructures. Finally, we also briefly discuss Peltier coolers made from nanostructured materials that have shown promising cooling performance.


Author(s):  
Matthew R. Pearson ◽  
Charles E. Lents

Thermoelectric coolers are solid-state cooling devices which, in certain applications, can be used to reduce the operating temperature of electronics or increase their heat dissipation. However, the performance of the cooler is strongly influenced by the thermal system into which it is placed, and the cooler design should be optimized for a given system. In this work, the possible benefits of a thermoelectric cooler implemented within a realistic thermal system are quantified. Finite thermal conductances between the cooled device and the thermoelectric cooler, and between the thermoelectric cooler and the heat sink are considered. The entire problem is treated using dimensionless parameters, which reduces the number of independent parameters and enables generalized performance maps which clearly show the maximum benefit (in terms of a reduced device temperature or increased device heat dissipation) that a prescribed thermoelectric cooler can deliver to a particular application. The use of these dimensionless parameters also allows for optimization of thermoelectric cooler parameters without considering the cooler detailed design geometry.


2019 ◽  
Vol 7 (45) ◽  
pp. 14109-14115 ◽  
Author(s):  
Biaolin Peng ◽  
Jintao Jiang ◽  
Silin Tang ◽  
Miaomiao Zhang ◽  
Laijun Liu ◽  
...  

The electrocaloric (EC) effect in ferroelectric/antiferroelectric thin films has been widely investigated due to its potential applications in solid state cooling devices.


2022 ◽  
Vol 13 (1) ◽  
Author(s):  
Shixian Zhang ◽  
Quanling Yang ◽  
Chenjian Li ◽  
Yuheng Fu ◽  
Huaqing Zhang ◽  
...  

AbstractAlthough the elastocaloric effect was found in natural rubber as early as 160 years ago, commercial elastocaloric refrigeration based on polymer elastomers has stagnated owing to their deficient elastocaloric effects and large extension ratios. Herein, we demonstrate that polymer elastomers with uniform molecular chain-lengths exhibit enormous elastocaloric effects through reversible conformational changes. An adiabatic temperature change of −15.3 K and an isothermal entropy change of 145 J kg−1 K−1, obtained from poly(styrene-b-ethylene-co-butylene-b-styrene) near room temperature, exceed those of previously reported elastocaloric polymers. A rotary-motion cooling device is tailored to high-strains characteristics of rubbers, which effectively discharges the cooling energy of polymer elastomers. Our work provides a strategy for the enhancement of elastocaloric effects and could promote the commercialization of solid-state cooling devices based on polymer elastomers.


Electronics ◽  
2020 ◽  
Vol 10 (1) ◽  
pp. 60
Author(s):  
Mario Ponce-Silva ◽  
Daniel Salazar-Pérez ◽  
Oscar Miguel Rodríguez-Benítez ◽  
Luis Gerardo Vela-Valdés ◽  
Abraham Claudio-Sánchez ◽  
...  

The main contribution of this paper is to show a new AC/DC converter based on the rearrangement of the flyback converter. The proposed circuit only manages part of the energy and the rest is delivered directly from the source to the load. Therefore, with the new topology, the efficiency is increased, and the stress of the components is reduced. The rearrangement consist of the secondary of the flyback is placed in parallel with the load, and this arrangement is connected in series with the primary side and the rectified voltage source. The re-arranged flyback is only a reductive topology and with no magnetic isolation. It was studied as a power supply for LEDs. A low frequency averaged analysis (LFAA) was used to determine the behavior of the proposed circuit and an equivalent circuit much easier to analyze was obtained. To validate the theoretical analysis, a design methodology was developed for the re-arranged flyback converter. The designed circuit was implemented in a 10 W prototype. Experimental results showed that the converter has a THDi = 21.7% and a PF = 0.9686.


2021 ◽  
Vol 38 ◽  
pp. 489-498
Author(s):  
Ta-Chung Liu ◽  
Sutarsis Sutarsis ◽  
Xin-Yan Zhong ◽  
Wei-Chen Lin ◽  
Syun-Hong Chou ◽  
...  
Keyword(s):  

2021 ◽  
Vol 522 ◽  
pp. 120373
Author(s):  
Alexander G. Tskhovrebov ◽  
Alexander S. Novikov ◽  
Boris S. Tupertsev ◽  
Alexey A. Nazarov ◽  
Anastasia A. Antonets ◽  
...  

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