Dynamic Brittle Fracture Captured With Peridynamics

2011 ◽  
Author(s):  
Youn D. Ha ◽  
Florin Bobaru
Keyword(s):  
Brittle Fracture ◽  
Crack Path ◽  
Process Zone ◽  
Stress Waves ◽  
Crack Branching ◽  
Peridynamic Model ◽  
Branching Angle ◽  
Dynamic Brittle Fracture ◽  
Crack Paths ◽  
Secondary Cracking

The bond-based peridynamic model is able to capture many of the essential characteristics of dynamic brittle fracture observed in experiments: crack branching, crack-path instability, asymmetries of crack paths, successive branching, secondary cracking at right angles from existing crack surfaces, etc. In this paper we investigate the influence of the stress waves on the crack branching angle and the velocity profile. We observe that crack branching in peridynamics evolves as the phenomenology proposed by the experimental evidence [1]: when a crack reaches a critical stage (macroscopically identified by its stress intensity factor) it splits into two or more branches, each propagating with the same speed as the parent crack, but with a much reduced process zone.

scholarly journals Comparison of peridynamic and phase-field models for dynamic brittle fracture in glassy materials

2020 ◽  
Author(s):  
Javad Mehrmashhadi ◽  
Mohammadreza Bahadori ◽  
Florin Bobaru
Keyword(s):  
Brittle Fracture ◽  
Phase Field ◽  
Phase Field Model ◽  
Propagation Speed ◽  
Experimental Tests ◽  
Crack Branching ◽  
Fracture Crack ◽  
Crack Propagation Speed ◽  
Dynamic Brittle Fracture ◽  
Crack Paths

We report computational results obtained with three different models for dynamic brittle fracture. The results are compared against recent experimental tests on dynamic fracture/crack branching in glass induced by impact. Two peridynamic models (one using the meshfree discretization, the other being the LS-DYNA’s discontinuous-Galerkin implementation) and a phase-field model lead to interesting and important differences in terms of reproducing the experimentally observed fracture behavior and crack paths. We monitor the crack branching location, the angle of crack branching, the crack propagation speed, and some particular features seen in the experimental crack paths: small twists/kinks near the far edge of the sample. We discuss the models’ performance and provide possible reasons behind the failure of some of the models to correctly predict the observed behavior.

Confirming the continuum theory of dynamic brittle fracture for fast cracks

Nature ◽  
10.1038/16891 ◽  
1999 ◽  
Vol 397 (6717) ◽  
pp. 333-335 ◽  
Author(s):  
Eran Sharon ◽  
Jay Fineberg
Keyword(s):  
Brittle Fracture ◽  
Continuum Theory ◽  
Dynamic Brittle Fracture ◽  
The Continuum

CURVING OF NORMAL TENSION CRACK PATH IN BRITTLE FRACTURE

2021 ◽  
Vol 57 (4) ◽  
pp. 569-580
Author(s):  
V. D. Kurguzov ◽  
A. G. Demeshkin
Keyword(s):  
Brittle Fracture ◽  
Crack Path ◽  
Tension Crack

scholarly journals Damage progression from impact in layered glass modeled with peridynamics

2012 ◽  
Vol 2 (4) ◽  
Author(s):  
Florin Bobaru ◽  
Youn Ha ◽  
Wenke Hu
Keyword(s):  
Spatial Resolution ◽  
Damage Evolution ◽  
Dynamic Interaction ◽  
Stress Waves ◽  
Three Dimensions ◽  
Contact Conditions ◽  
Peridynamic Model ◽  
Simulation Results ◽  
Simple Contact ◽  
Computational Resources

AbstractDynamic fracture in brittle materials has been difficult to model and predict. Interfaces, such as those present in multi-layered glass systems, further complicate this problem. In this paper we use a simplified peridynamic model of a multi-layer glass system to simulate damage evolution under impact with a high-velocity projectile. The simulation results are compared with results from recently published experiments. Many of the damage morphologies reported in the experiments are captured by the peridynamic results. Some finer details seen in experiments and not replicated by the computational model due to limitations in available computational resources that limited the spatial resolution of the model, and to the simple contact conditions between the layers instead of the polyurethane bonding used in the experiments. The peridynamic model uncovers a fascinating time-evolution of damage and the dynamic interaction between the stress waves, propagating cracks, interfaces, and bending deformations, in three-dimensions.

Phase field approximation of dynamic brittle fracture

2014 ◽  
Vol 54 (5) ◽  
pp. 1141-1161 ◽  
Author(s):  
Alexander Schlüter ◽  
Adrian Willenbücher ◽  
Charlotte Kuhn ◽  
Ralf Müller
Keyword(s):  
Brittle Fracture ◽  
Phase Field ◽  
Field Approximation ◽  
Dynamic Brittle Fracture

A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures

2005 ◽  
Author(s):  
Hisashi Tanie ◽  
Takeshi Terasaki ◽  
Yasuhiro Naka
Keyword(s):  
Fatigue Life ◽  
Crack Propagation ◽  
Solder Joints ◽  
Crack Path ◽  
New Method ◽  
Semiconductor Structures ◽  
Element Size ◽  
Solder Mask ◽  
Conventional Methods ◽  
Crack Paths

Conventionally, the fatigue life of solder joints in semiconductor structures is estimated using Coffin-Manson’s law. However, as the structures have become miniaturized or thinner, accurately estimate fatigue life has become difficult using conventional methods. This is because the fatigue life is strongly affected by crack propagation in miniaturized or thinner joints, and the conventional methods cannot evaluate this phenomenon well. We have therefore developed a new method for evaluating fatigue life that takes into account the influence of crack propagation in micro-solder joints. In micro-solder joints, a solder crack path might propagate not only at the solder and land interface itself, but also near the interface. Many crack-propagation have been proposed, but a model that can reproduce a crack path has yet to be proposed. The fatigue life of a solder in our crack-propagation model is evaluated based on the damage that accumulates during crack propagation, and the crack paths are automatically calculated. Using this model, we analyzed the crack path of a ball grid array (BGA) structure, and we determined that the model could reproduce the above-mentioned characteristic crack paths. When the fatigue life is calculated using a finite element method, one of the most difficult issues is correcting for the effect of element size. We determined the calculated life dependency on element size, and we developed a formula for approximating this dependency in the proposed model. We then used this formula to calculate the fatigue life of three different size BGA solder joints that were subjected to mechanical fatigue testing. The calculated lives were found to correspond with the measured lives. Furthermore, we applied this method to evaluate the differences in the fatigue life of a solder-mask-defined (SMD) structure and a non-solder-mask-defined (NSMD) structure. Both are typical structures of BGA solder joints. We determined that the fatigue life of the NSMD structure was longer than that of the SMD structure. The main cause for this difference is that the crack-propagation life of the NSMD structure was longer than that of the SMD structure, even though the crack-initiation lives of both structures were the same.

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