scholarly journals The Influence of Burial Depth and Soil Thermal Conductivity on Heat Transfer in Buried CO2 Pipelines for CCS: A Parametric Study

Author(s):  
Babafemi Olugunwa ◽  
Julia Race ◽  
Tahsin Tezdogan

Abstract Pipeline heat transfer modelling of buried pipelines is integral to the design and operation of onshore pipelines to aid the reduction of flow assurance challenges such as carbon dioxide (CO2) gas hydrate formation during pipeline transportation of dense phase CO2 in carbon capture and storage (CCS) applications. In CO2 pipelines for CCS, there are still challenges and gaps in knowledge in the pipeline transportation of supercritical CO2 due to its unique thermophysical properties as a single, dense phase liquid above its critical point. Although the design and operation of pipelines for bulk fluid transport is well established, the design stage is incomplete without the heat transfer calculations as part of the steady state hydraulic and flow assurance design stages. This paper investigates the steady state heat transfer in a buried onshore dense phase CO2 pipelines analytically using the conduction shape factor and thermal resistance method to evaluate for the heat loss from an uninsulated pipeline. A parametric study that critically analyses the effect of variation in pipeline burial depth and soil thermal conductivity on the heat transfer rate, soil thermal resistance and the overall heat transfer coefficient (OHTC) is investigated. This is done using a one-dimensional heat conduction model at constant temperature of the dense phase CO2 fluid. The results presented show that the influence of soil thermal conductivity and pipeline burial depth on the rate of heat transfer, soil thermal resistance and OHTC is dependent on the average constant ambient temperature in buried dense phase CO2 onshore pipelines. Modelling results show that there are significant effects of the ambient natural convection on the soil temperature distribution which creates a thermal influence region in the soil along the pipeline that cannot be ignored in the steady state modelling and as such should be modelled as a conjugate heat transfer problem during pipeline design.

Author(s):  
Nhat Minh Nguyen ◽  
Eric Monier-Vinard ◽  
Najib Laraqi ◽  
Valentin Bissuel ◽  
Olivier Daniel

Purpose The purpose of this paper is to supply an analytical steady-state solution to the heat transfer equation permitting to fast design investigation. The capability to efficiently transfer the heat away from high-powered electronic devices is a ceaseless challenge. More than ever, the aluminium or copper heat spreaders seem less suitable for maintaining the component sensitive temperature below manufacturer operating limits. Emerging materials, such as annealed pyrolytic graphite (APG), have proposed a new alternative to conventional solid conduction without the gravity dependence of a heat-pipe solution. Design/methodology/approach An APG material is typically sandwiched between a pair of aluminium sheets to compose a robust graphite-based structure. The thermal behaviour of that stacked structure and the effect of the sensitivity of the design parameters on the effective thermal performances is not well known. The ultrahigh thermal conductivity of the APG core is restricted to in-plane conduction and can be 200 times higher than its through-the-thickness conductivity. So, a lower-than-anticipated cross-plane thermal conductivity or a higher-than-anticipated interlayer thermal resistance will compromise the component heat transfer to a cold structure. To analyse the sensitivity of these parameters, an analytical model for a multi-layered structure based on the Fourier series and the superposition principle was developed, which allows predicting the temperature distribution over an APG flat-plate depending on two interlayer thermal resistances. Findings The current work confirms that the in-plane thermal conductivity of APG is among the highest of any conduction material commonly used in electronic cooling. The analysed case reveals that an effective thermal conductivity twice as higher than copper can be expected for a thick APG sheet. The relevance of the developed analytical approach was compared to numerical simulations and experiments for a set of boundary conditions. The comparison shows a high agreement between both calculations to predict the centroid and average temperatures of the heating sources. Further, a method dedicated to the practical characterization of the effective thermal conductivity of an APG heat-spreader is promoted. Research limitations/implications The interlayer thermal resistances act as dissipation bottlenecks which magnify the performance discrepancy. The quantification of a realistic value is more than ever mandatory to assess the APG heat-spreader technology. Practical implications Conventional heat spreaders seem less suitable for maintaining the component-sensitive temperature below the manufacturer operating limits. Having an in-plane thermal conductivity of 1,600 W.m−1.K−1, the APG material seems to be the next paradigm for solving endless needs of a thermal designer. Originality/value This approach is a practical tool to tailor sensitive parameters early to select the right design concept by taking into account potential thermal issues, such as the critical interlayer thermal resistance.


Materials ◽  
2018 ◽  
Vol 12 (1) ◽  
pp. 54 ◽  
Author(s):  
Zipeng Qin ◽  
Gang Li ◽  
Yan Tian ◽  
Yuwei Ma ◽  
Pengfei Shen

The effects of fly ash, sodium carbonate content, foaming temperature and foaming time on foam glass aperture sizes and their distribution were analyzed by the orthogonal experimental design. Results from the steady-state method showed a normal distribution of the number of apertures with change in average aperture, which ranges from 0.1 to 2.0 mm for more than 93% of apertures. For a given porosity, the thermal conductivity decreases with the increase of the aperture size. The apertures in the sample have obvious effects in blocking the heat flow transmission: heat flow is quickly diverted to both sides when encountered with the aperture. When the thickness of the sample is constant, the thermal resistance of the foam glass sample increases with increasing porosity, leading to better thermal insulation. Furthermore, our results suggest that the more evenly distributed and orderly arranged the apertures are in the foam glass material, the larger the thermal resistance of the material and hence, the better the thermal insulation.


2016 ◽  
Vol 846 ◽  
pp. 500-505
Author(s):  
Wei Jing Dai ◽  
Yi Xiang Gan ◽  
Dorian Hanaor

Effective thermal conductivity is an important property of granular materials in engineering applications and industrial processes, including the blending and mixing of powders, sintering of ceramics and refractory metals, and electrochemical interactions in fuel cells and Li-ion batteries. The thermo-mechanical properties of granular materials with macroscopic particle sizes (above 1 mm) have been investigated experimentally and theoretically, but knowledge remains limited for materials consisting of micro/nanosized grains. In this work we study the effective thermal conductivity of micro/nanopowders under varying conditions of mechanical stress and gas pressure via the discrete thermal resistance method. In this proposed method, a unit cell of contact structure is regarded as one thermal resistor. Thermal transport between two contacting particles and through the gas phase (including conduction in the gas phase and heat transfer of solid-gas interfaces) are the main mechanisms. Due to the small size of particles, the gas phase is limited to a small volume and a simplified gas heat transfer model is applied considering the Knudsen number. During loading, changes in the gas volume and the contact area between particles are simulated by the finite element method. The thermal resistance of one contact unit is calculated through the combination of the heat transfer mechanisms. A simplified relationship between effective thermal conductivity and loading pressure can be obtained by integrating the contact units of the compacted powders.


Materials ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2626
Author(s):  
Aurelia Blazejczyk ◽  
Cezariusz Jastrzebski ◽  
Michał Wierzbicki

This article introduces an innovative approach to the investigation of the conductive–radiative heat transfer mechanism in expanded polystyrene (EPS) thermal insulation at negligible convection. Closed-cell EPS foam (bulk density 14–17 kg·m−3) in the form of panels (of thickness 0.02–0.18 m) was tested with 1–15 µm graphite microparticles (GMP) at two different industrial concentrations (up to 4.3% of the EPS mass). A heat flow meter (HFM) was found to be precise enough to observe all thermal effects under study: the dependence of the total thermal conductivity on thickness, density, and GMP content, as well as the thermal resistance relative gain. An alternative explanation of the total thermal conductivity “thickness effect” is proposed. The conductive–radiative components of the total thermal conductivity were separated, by comparing measured (with and without Al-foil) and simulated (i.e., calculated based on data reported in the literature) results. This helps to elucidate why a small addition of GMP (below 4.3%) forces such an evident drop in total thermal conductivity, down to 0.03 W·m−1·K−1. As proposed, a physical cause is related to the change in mechanism of the heat transfer by conduction and radiation. The main accomplishment is discovering that the change forced by GMP in the polymer matrix thermal conduction may dominate the radiation change. Hence, the matrix conduction component change is considered to be the major cause of the observed drop in total thermal conductivity of EPS insulation. At the microscopic level of the molecules or chains (e.g., in polymers), significant differences observed in the intensity of Raman spectra and in the glass transition temperature increase on differential scanning calorimetry(DSC) thermograms, when comparing EPS foam with and without GMP, complementarily support the above statement. An additional practical achievement is finding the maximum thickness at which one may reduce the “grey” EPS insulating layer, with respect to “dotted” EPS at a required level of thermal resistance. In the case of the thickest (0.30 m) panels for a passive building, above 18% of thickness reduction is found to be possible.


2019 ◽  
Vol 18 (2) ◽  
pp. 85
Author(s):  
A. Miguelis ◽  
R. Pazetto ◽  
R. M. S. Gama

This work presents the solution of the steady-state heat transfer problem in a rectangular plate with an internal heat source in a context in which the thermal conductivity depends on the local temperature. This generalization of one of the most classical heat transfer problems is carried out with the aid of the Kirchhoff transformation and employs only well known tools, as the superposition of solutions and the Fourier series. The obtained results illustrate how the usual procedures may be extended for solving more realistic physical problems (since the thermal conductivity of any material is temperature-dependent). A general formula for evaluating the Kirchhoff transformation as well as its inverse is presented too. This work has a strong didactical contribution since such analytical solutions are not found in any classical heat transfer book. In addition, the main idea can be used in a lot of similar problems.


2019 ◽  
Vol 52 (12) ◽  
pp. 1572-1576
Author(s):  
S. M. Mahdavi ◽  
M. R. Neyshabouri ◽  
H. Fujimaki

Author(s):  
Navdeep Singh ◽  
Debjyoti Banerjee

Due to their very high thermal conductivity carbon nanotubes have been found to be an excellent material for thermal management. Experiments have shown that the heaters coated with carbon nanotubes increase the heat transfer by as much as 60%. Also when nanotubes are used as filler materials in composites, they tend to increase the thermal conductivity of the composites. But the increase in the heat transfer and the thermal conductivity has been found to be much less than the calculated values. This decrease has been attributed to the interfacial thermal resistance between the carbon nanotubes and the surrounding material. MD simulations were performed to study the interfacial thermal resistance between the carbon nanotubes and the liquid molecules. In the simulations, the nanotube is placed at the center of the simulation box and a temperature of 300K is imposed on the system. Then the temperature of the nanotube is raised instantaneously and the system is allowed to relax. From the temperature decay, the interfacial thermal resistance between the carbon nanotube and the liquid molecules is calculated. In this study the liquid molecules under investigation are n-heptane, n-tridecane and n-nonadecane.


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