Two Different Types of Axially-Grooved Heat Pipes and Thermal Performance Comparison

Author(s):  
Yong Chi ◽  
Yong Tang ◽  
Le-Lun Jiang ◽  
Zhen-Ping Wan ◽  
Min-Qiang Pan

Heat pipes have been widely applied to the cooling of microelectronics chips at present. In this paper, to conduct a comparative study on heat pipe performance with different groove structures, two types of axially-grooved heat pipe were manufactured by spinning and secondary broaching respectively. The heat pipe A formed by spinning has homogeneous 55 U-shaped grooves on the inner wall. The grooves with depth of 220μm, width of 200μm and groove angle of 15° are smooth. While the inner wall of the heat pipe B fabricated by secondary broaching is scored and the grooves are heterogeneous. The comparison of heat transfer performance and start-up of two heat pipes are analyzed and investigated under different orientations and heat loads. Experimental results show that the heat pipe formed by spinning has a stronger level of heat transfer capabilities than heat pipe formed by secondary broaching. The maximum heat transfer rate for the heat pipe formed by spinning is almost 70Watts, while the one for the heat pipe fabricated by secondary broaching is only 20Watts. The minimum thermal resistance of the heat pipe A and B was 0.020°C/W and 0.068°C/W respectively. At positive inclination angles in gravity-assisted condition, the thermal performance of both two heat pipe have not obvious difference with at horizontal orientation. But at negative inclination angles in anti-gravity condition, the gravity will play an important role on grooved heat pipes.

2021 ◽  
pp. 199-199
Author(s):  
Lakshmi Reddy ◽  
Srinivasa Bayyapureddy Reddy ◽  
Kakumani Govindarajulu

Heat pipe is a two phase heat transfer device with high effective thermal conductivity and transfer huge amount of heat with minimum temperature gradient in between evaporator and condenser section. This paper objective is to predict the thermal performance in terms of thermal resistance (R) and heat transfer coefficient (h) of screen mesh wick heat pipe with DI water-TiO2 as working fluid. The input process parameters of heat pipe such as heat load (Q), tilt angle (?) and concentration of nanofluid (?) were modeled and optimized by utilizing Response Surface Methodology (RSM) with MiniTab-17 software to attain minimum thermal resistance and maximum heat transfer coefficient. The minimum thermal resistance of 0.1764 0C/W and maximum heat transfer coefficient of 1411.52 W/m2 0C was obtained under the optimized conditions of 200 W heat load, 57.20 tilt angle and 0.159 vol. % concentration of nano-fluid.


2005 ◽  
Author(s):  
Yao-Chen Chan ◽  
Wei-Keng Lin

In traditional heat pipe performance test, to keep an adiabatic temperature at a constant value, the evaporator wall temperature would be slowly increased when the thermal power was step input to the evaporator of the heat pipe. The maximum heat transfer rate (Qmax) was then defined that when the evaporator wall temperature rapidly increased at a certain amount of power input to the heat pipe. However, it is not easy to distinguish this sharp increased curve and sometimes result in the wrong Qmax data. In addition, it took too long for waiting the evaporator temperature approach to a steady state, thus this process could not use be for the fully check Qmax of the heat pipe. In this paper, we propose a novel quick test method to predict the maximum heat dissipation of the heat pipes namely Dynamic-Temperature-Tracing (D.T.T). The concept of the D.T.T was when we tracing the evaporator and the adiabatic wall temperature, these two temperature curves should be the same trend before the dry-out phenomena was occurred. Theoretically, when the dry-out start to occur in the heat pipe, the adiabatic temperature profile was no longer kept the same temperature profile as that of the evaporator. Hence, the maximum heat dissipate ability of the heat pipe was then easy to obtained at this measuring adiabatic temperature. The data were also compared with those obtained from the traditional standard method at the same equivalent evaporator length, condenser length and adiabatic temperature. In this experiments, sinter powder and groove heat pipes with diameter 6mm 8mm and 200mm length were selected as the capillary wick structure. Comparing with traditional method results, the errors of maximum heat transfer rate are less than 15%. The results also shown D.T.T. method is much fast and reliable compare with the traditional test method.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.


Author(s):  
Maryam Shafahi ◽  
Kevin Anderson ◽  
Ali Borna ◽  
Michael Lee ◽  
Alex Kim ◽  
...  

This paper reviews the improvement in the heat pipe’s performance using nanofluid as the working fluid. The use of nanofluid enhances heat transfer in the heat pipe due to its improved thermo-physical properties, such as a higher thermal conductivity. Nanofluids proved to be the innovative approach to a variety of applications, such as electronics, medical instruments, and heat exchangers. The influence of different nanoparticles on heat pipe’s performance has been studied. Utilizing nanofluid as the working fluid leads to a significant reduction in heat pipe thermal resistance, an increase in maximum heat transfer, and an improvement of heat pipe thermal performance.


2020 ◽  
Vol 184 ◽  
pp. 01026 ◽  
Author(s):  
B.Ch Nookaraju ◽  
B. Hemanth Sai ◽  
K.V.N.S Himakar ◽  
N. Limba Reddy ◽  
N Sateesh

Heat pipes are used to transfer heat, which are hollow cylindrical shape device filled with small amount of working fluid, which can change its phase. The rate of heat transfer in heat pipes compared to normal heat exchanging devices is more. Depending on the applications of heat transfer various heat pipes are being designed. Methanol fluid is used with 50% fill ratio. It is made of copper with outer diameter of 15.88mm and inner diameter of 14.88mm. It consists of a screen mesh made of copper powder inside it with thickness of 0.5mm. Due to heat input methanol changes its phase from liquid to vapor. The vapor loses its heat and changes its phase back to liquid in the condenser. At the condenser section the vapour gives up it heat and changes its phase from vapour to liquid. The screen mesh assists the flow of condensed working fluid through capillary action. Optimized the results by “Taguchi method” using “Minitab software”. The Thermal analysis was done with the optimum conditions, which were obtained as a result from the optimization method by Ansys Fluent software. Then finally compared the thermal parameters obtained from experiments with the Thermal analysis result. It is found the maximum heat transfer rate is optimized using meshed wick heat pipe conditions.


Author(s):  
Ning Zhang ◽  
Pankaj R. Chandra ◽  
Ryan Robledo ◽  
Sree Harsha Balijepalli

Computers are crucial to nearly every endeavor in the modern world. Some computers, particularly those used in military applications, are required to endure extreme conditions with limited maintenance and few parts. Units such as these will hereafter be referred to as “rugged computers.” This series of experiments aims to produce improvements to rugged computers currently in service. Using heat pipes and finned heat sinks on an enclosed box, a computer’s Central Processing Unit (CPU) is able to reject heat without suffering contamination from unforgiving environments. A modular prototype was designed to allow for three distinct cases; a case with no heat pipes and fins, a cast with heat-pipes mounted internally with exterior fins and a case with heat-pipes extended externally with exterior fins. Each case was tested at three different heat loads, with a copper plate heated by a silicone heat strip simulating the heat load generated by a CPU. Each case/load combination was run many times to check for repeatability. The aim of this research is to discover the ideal case for maximum heat transfer from the CPU to the external environment. In addition to the experiments, numerical simulation of these modular prototypes with different designs of heat pipes were conducted in this research. Creating an accurate model for computer simulations will provide validation for the experiments and will prove useful in testing cases not represented by the modular prototype. The flow and heat transfer simulations were conducted using Autodesk CFD. The aim here is to create a model that accurately reflects the experimentally-verified results from the modular prototype’s cases and loads, thereby providing a base from whence further designs can branch off and be simulated with a fair degree of accuracy.


Volume 3 ◽  
2004 ◽  
Author(s):  
R. Kempers ◽  
A. Robinson ◽  
C. Ching ◽  
D. Ewing

A study was performed to experimentally characterize the effect of fluid loading on the heat transport performance of wicked heat pipes. In particular, experiments were performed to characterize the performance of heat pipes with insufficient fluid to saturate the wick and excess fluid for a variety of orientations. It was found that excess working fluid in the heat pipe increased the thermal resistance of the heat pipe, but increased maximum heat flux through the pipe in a horizontal orientation. The thermal performance of the heat pipe was reduced when the amount of working fluid was less than required to saturate the wick, but the maximum heat flux through the heat pipe was significantly reduced at all orientations. It was also found in this case the performance of this heat pipe deteriorated once dry-out occurred.


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