HBr based inductively coupled plasma etching of high aspect ratio nanoscale trenches in InP: Considerations for photonic applications

2009 ◽  
Vol 27 (6) ◽  
pp. 2351 ◽  
Author(s):  
N. Sultana ◽  
Wei Zhou ◽  
Tim P. LaFave ◽  
Duncan L. MacFarlane
Keyword(s):  
Aspect Ratio ◽  
Plasma Etching ◽  
High Aspect Ratio ◽  
Inductively Coupled Plasma ◽  
Inductively Coupled Plasma Etching ◽  
Inductively Coupled

A new method of manufacturing high aspect ratio structures using SU8 negative photoresist

2010 ◽  
Vol 1272 ◽  
Author(s):  
Saydulla Persheyev ◽  
Mervyn John Rose
Keyword(s):  
Aspect Ratio ◽  
Plasma Etching ◽  
High Aspect Ratio ◽  
Inductively Coupled Plasma ◽  
Biomedical Applications ◽  
Original Method ◽  
Negative Photoresist ◽  
High Demand ◽  
Plasma System ◽  
Inductively Coupled

AbstractSU8 Negative photoresist is finding high demand in applications such as MEMS sensors and waveguides. The possibility of photolithographic patterning and high physical and dielectric properties are attracting ever more users among workers in the electronics industry and increasingly in biomedical applications. In our work we employ an original method of exposing of SU8 and create high aspect ratio structures on glass and other substrates. Dry plasma etching results of negative epoxy-based photoresist by Inductively Coupled Plasma system using gases O2 and CF4 are presented.

Inductively coupled plasma etching for delineation of InAs/GaSb pixels

2012 ◽  
Author(s):  
Jean Nguyen ◽  
John Gill ◽  
Sir B. Rafol ◽  
Alexander Soibel ◽  
Arezou Khoshakhlagh ◽  
...  
Keyword(s):  
Plasma Etching ◽  
Inductively Coupled Plasma ◽  
Inductively Coupled Plasma Etching ◽  
Inductively Coupled

Manufacture of High Aspect Ratio Bulk Titanium Micro-Parts by Inductively Coupled Plasma Etching

2008 ◽  
Author(s):  
Gang Zhao ◽  
Qiong Shu ◽  
Yue Li ◽  
Jing Chen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Inductively Coupled Plasma ◽  
Etching Rate ◽  
Sidewall Roughness ◽  
Inductively Coupled ◽  
Icp Etching ◽  
Novel Technology ◽  
Micro Parts ◽  
Etching Mask

A novel technology is developed to fabricate high aspect ratio bulk titanium micro-parts by inductively coupled plasma (ICP) etching. An optimized etching rate of 0.9 μm/min has been achieved with an aspect ratio higher than 10:1. For the first time, SU-8 is used as titanium etching mask instead of the traditional hard mask such as TiO2 or SiO2. With an effective selectivity of 3 and a spun-on thickness beyond 100 μm, vertical etching sidewall and low sidewall roughness are obtained. Ultra-deep titanium etching up to 200 μm has been realized, which is among the best of the present reports. Titanium micro-springs and planks are successfully fabricated with this approach.

Inductively coupled plasma etching of HgCdTe using a CH4-based mixture

2005 ◽  
Vol 34 (6) ◽  
pp. 740-745 ◽  
Author(s):  
E. Laffosse ◽  
J. Baylet ◽  
J. P. Chamonal ◽  
G. Destefanis ◽  
G. Cartry ◽  
...  
Keyword(s):  
Plasma Etching ◽  
Inductively Coupled Plasma ◽  
Inductively Coupled Plasma Etching ◽  
Inductively Coupled
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