Selected applications of photothermal and photoluminescence heterodyne techniques for process control in silicon wafer manufacturing

1997 ◽  
Vol 36 (2) ◽  
pp. 446 ◽  
Author(s):  
Andreas Ehlert
Keyword(s):  
Process Control ◽  
Silicon Wafer ◽  
Wafer Manufacturing

A Geometrically Defined All-Diamond Pad Conditioner

2005 ◽  
Author(s):  
Joakim Andersson ◽  
Markus Forsberg ◽  
Patrik Hollman ◽  
Staffan Jacobson
Keyword(s):  
Process Control ◽  
Silicon Wafer ◽  
Diamond Tool ◽  
Cvd Diamond ◽  
Anisotropic Etching ◽  
Diamond Layer ◽  
Tool Surface ◽  
New Type ◽  
Tip Position

This work presents a geometrically defined pad conditioner fabricated by anisotropic etching of silicon to produce a well-defined mold and subsequently CVD diamond layer is deposited on this mold. Finally, the silicon wafer is etched away, exhibiting the all-diamond tool surface. The new type of pad conditioner offers very sharp pyramidal tips, all equal in size. The excellent sharpness leads to high roughening capability while keeping the pad removal low. The precise tip position and height results in a unique uniformity of scratches produced, hence offering a new level of process control.

Silicon wafer manufacturing process

2021 ◽  
pp. 53-70
Author(s):  
Rabindra Satpathy ◽  
Venkateswarlu Pamuru
Keyword(s):  
Silicon Wafer ◽  
Manufacturing Process ◽  
Wafer Manufacturing

21413 The influence of wafer edge profile on polishing non-uniformity in silicon wafer manufacturing

2008 ◽  
Vol 2008.14 (0) ◽  
pp. 405-406
Author(s):  
Akira FUKUDA ◽  
Tetsuo FUKUDA ◽  
Hirokuni HIYAMA ◽  
Manabu TSUJIMURA ◽  
Toshiro DOI ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Edge Profile ◽  
Wafer Manufacturing ◽  
Wafer Edge
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