Effect of a magnetic field on the banding phenomenon in aluminium–silicon eutectic alloy

1968 ◽  
Vol 46 (14) ◽  
pp. 1589-1595 ◽  
Author(s):  
E. A. Falquero ◽  
W. Saunders ◽  
W. V. Youdelis
Keyword(s):  
Magnetic Field ◽  
Eutectic Alloy ◽  
Solidification Rate ◽  
Magnetic Field Effect ◽  
Impurity Level ◽  
Directionally Solidified ◽  
Band Formation ◽  
Band Spacing ◽  
Solidification Speed ◽  
Solid Liquid Interface

The effect of a magnetic field on the frequency of transverse band formation in directionally solidified Al–Si eutectic alloy is investigated for a range of solidification speeds. The band spacing for both field and no-field ingots is found to be linearly dependent on the solidification rate, but for a given solidification speed a magnetic field of 30 000 Oe, applied perpendicular to the solidification direction, reduced the band spacing by approximately 35%. The results are explained in terms of the effects of the solidification rate and magnetic field on the impurity concentration ahead of the solid–liquid interface, a fluctuating impurity level being the direct cause of the banding phenomenon. It is shown that the magnetic-field effect on band spacing is consistent with the theories (previously published) developed to account for the observed effects of a magnetic field on alloy diffusion and solidification.

Submicron Conductor Array Fabricated from a Recrystallized Eutectic Thin Film

1982 ◽  
Vol 13 ◽  
Author(s):  
H. E. Cline
Keyword(s):  
Thin Film ◽  
Eutectic Alloy ◽  
Solidification Rate ◽  
Eutectic Structure ◽  
Alloy Thin Film ◽  
Directionally Solidified ◽  
Two Phase ◽  
Glass Substrates ◽  
Solid Liquid Interface ◽  
Solid Liquid

ABSTRACTA submicron conductor array was fabricated without using lithography by selectively etching a recrystallized A1-A12Cu eutectic alloy thin film. The 2 micron thick eutectic films were deposited on glass substrates and directionally solidified with both a quartz-iodine lamp and a scanning laser at rates between .0016 and .14 cm/sec. The resulting structure consisted of alternate parallel stripes of the two eutectic phases with a spacing between .5 and 4 microns that was controlled by the solidification rate. An array of submicron Al- rich conductors was fabricated by selectively etching away the Al2 Cu phase. At solidification rates greater than .004 cm/sec using the lamp heater the solid-liquid interface became non-planar while with the laser the structure was well alligned at the highest rates used, .14 cm/sec. At the maximum theoretical solidification rate that produces a two phase aligned eutectic structure the width of the Al wires would be 100A.

Microstructure and Solid/Liquid Interface Evolutions of Directionally Solidified Fe-Al-Ta Eutectic Alloy

2019 ◽  
Vol 34 (3) ◽  
pp. 656-661 ◽  
Author(s):  
Chunjuan Cui ◽  
Songyuan Wang ◽  
Meng Yang ◽  
Haijun Su ◽  
Yagang Wen ◽  
...  
Keyword(s):  
Eutectic Alloy ◽  
Liquid Interface ◽  
Directionally Solidified ◽  
Solid Liquid Interface ◽  
Solid Liquid

Effect of a High Magnetic Field on the Microstructure of Directionally Solidified NiAl-Cr(Mo)-Si Near-Eutectic Alloy at Different Withdrawal Rates

2017 ◽  
Vol 898 ◽  
pp. 407-412 ◽  
Author(s):  
Huan Liu ◽  
Wei Dong Xuan ◽  
Xing Fu Ren ◽  
Bao Jun Wang ◽  
Jian Bo Yu ◽  
...  
Keyword(s):  
Magnetic Field ◽  
High Magnetic Field ◽  
Eutectic Alloy ◽  
Magnetic Force ◽  
Volume Fraction ◽  
Withdrawal Rate ◽  
Directionally Solidified ◽  
Combined Action ◽  
Columnar To Equiaxed Transition ◽  
The Magnetic Field

The effect of a 6T high magnetic field on the microstructure of directionally solidified NiAl-Cr (Mo)-Si near-eutectic alloy was investigated at the withdrawal rates of 2, 10 and 50 μm/s. The results showed that the microstructure evolved from planar eutectic to primary NiAl dendrites + cellular eutectic and then to dendritic eutectic with the increasing withdrawal rate. When the magnetic field was imposed, the well-aligned eutectic lamellae were disturbed and transformed into a wavy one at 2 μm/s. When the withdrawal rate increased to 10 μm/s, the application of the magnetic field destroyed the primary NiAl dendrite array and caused the occurrence of columnar-to-equiaxed transition (CET) of the NiAl dendrites. The volume fraction of primary dendrites also decreased. In addition, the width of intercellular/interdendritic regions decreased in cellular/dendritic eutectic structures when directionally solidified under the magnetic field. The above results should be attributed to the combined action of the thermoelectric magnetic force and the thermoelectric magnetic convection.

Magnetic field induced band formation and crystal orientation in directionally solidified Cu-20 wt.% Sn peritectic alloys

2018 ◽  
Vol 121 (3) ◽  
pp. 38002
Author(s):  
Fei Xia ◽  
Zhenyuan Lu ◽  
Annie Gagnoud ◽  
Yves Fautrelle ◽  
Rene Moreau ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Crystal Orientation ◽  
Directionally Solidified ◽  
Band Formation
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