TSV/3DIC Profile Metrology Based on Infrared Microscope Image

2019 ◽  
Vol 34 (1) ◽  
pp. 937-942 ◽  
Author(s):  
Jing-Jou Tang ◽  
Young-Jinn Lay ◽  
Lih-Shyang Chen ◽  
Lian-Yong Lin
Author(s):  
Alexander Richards ◽  
Matthew Weschler ◽  
Michael Durller

Abstract To help solve the navigational problem, i.e., being able to successfully locate a circuit for probing or editing without destroying chip functionality, a near-infrared (NIR), near-ultraviolet (NUV), and visible spectrum camera system was developed that attaches to most focused ion beam (FIB) or scanning electron microscope vacuum chambers. This paper reviews the details of the design and implementation of the NIR/NUV camera system, as instantiated upon the FEI FIB 200, with a particular focus on its use for the visualization of buried structures, and also for non-destructive real time area of interest location and end point detection. It specifically considers the use of the micro-optical camera system for its benefit in assisting with frontside and backside circuit edit, as well as other typical FIB milling activities. The quality of the image obtained by the IR camera rivals or exceeds traditional optical based imaging microscopy techniques.


2012 ◽  
Vol 3 (13) ◽  
pp. 1774-1782 ◽  
Author(s):  
Marvin A. Malone ◽  
Antriksh Luthra ◽  
David Lioi ◽  
James V. Coe

2021 ◽  
Vol 11 (3) ◽  
pp. 790-794
Author(s):  
Yuxue Wei ◽  
Azhu Wang ◽  
Lingling Lv ◽  
Faqiang Xu ◽  
Jie Yang ◽  
...  

Synchrotron-based infrared microscope was used for the high-throughput screening of Fe3+/Nb5+ doped TiO2 photocatalysts for air purification.


2021 ◽  
Vol 50 (2) ◽  
pp. 20200153-20200153
Author(s):  
刘智颖 Zhiying Liu ◽  
吕知洋 Zhiyang Lv ◽  
高柳絮 Liuxu Gao

Sign in / Sign up

Export Citation Format

Share Document