High-Speed Cu Electrodeposition and Reliability of Cu Pillar Bumps in High-Temperature Storage

2018 ◽  
Vol 165 (13) ◽  
pp. D647-D653 ◽  
Author(s):  
P. T. Lee ◽  
Y. S. Wu ◽  
C. Y. Lee ◽  
H. C. Liu ◽  
C. E. Ho
Keyword(s):  
High Temperature ◽  
High Speed ◽  
Cu Pillar ◽  
High Temperature Storage ◽  
Temperature Storage

scholarly journals Investigation on the Short-Term Aging-Resistance of Thermoplastic Polyurethane-Modified Asphalt Binders

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1189 ◽  
Author(s):  
Ruien Yu ◽  
Xijing Zhu ◽  
Maorong Zhang ◽  
Changqing Fang
Keyword(s):  
Thermal Properties ◽  
High Temperature ◽  
High Speed ◽  
Storage Stability ◽  
Thermoplastic Polyurethane ◽  
Short Term ◽  
Modified Asphalt ◽  
Aging Resistance ◽  
High Temperature Storage ◽  
Temperature Storage

In this reported work, thermoplastic polyurethane (TPU) was used as a reactive polymer modifying agent to prepare a modified-asphalt, using a high-speed shearing method. Physical performance tests of the TPU-modified asphalt were conducted before and after short-term aging, and the aging resistance was examined by the change in materials properties. In addition, low-temperature rheological properties, thermal properties, the high-temperature storage stability, and the aging mechanism of TPU-modified asphalt were also investigated. The results showed that the addition of TPU improved the aging resistance of base asphalt, which was evidenced by the increased penetration ratio and decreased softening point of the asphalt, after aging. Similarly, Fourier Transform infrared (FTIR) spectroscopy results verified that TPU improved the asphalt aging resistance. It was found that the TPU functional groups played a role in improving thermal properties, high-temperature storage stability, and in the dispersion of modified asphalt.

High temperature storage reliability investigation of the Al–Cu wire bond interface

2012 ◽  
Vol 52 (9-10) ◽  
pp. 1966-1970 ◽  
Author(s):  
R. Pelzer ◽  
M. Nelhiebel ◽  
R. Zink ◽  
S. Wöhlert ◽  
A. Lassnig ◽  
...  
Keyword(s):  
High Temperature ◽  
Wire Bond ◽  
High Temperature Storage ◽  
Bond Interface ◽  
Temperature Storage

High Temperature Storage and Gamma Radiation Effects on Mechanical Properties of Stacked Die Package

2014 ◽  
Vol 895 ◽  
pp. 567-570
Author(s):  
Azman Jalar ◽  
Wan Yusmawati Wan Yusoff ◽  
Norinsan Kamil Othman ◽  
Irman Abdul Rahman
Keyword(s):  
High Temperature ◽  
Gamma Radiation ◽  
Radiation Effects ◽  
Storage Period ◽  
Bending Test ◽  
Three Point Bending ◽  
Micromechanical Properties ◽  
3D Ct Scan ◽  
High Temperature Storage ◽  
Temperature Storage

Effect of gamma radiation (1.33 MeV) and high temperature storage of semiconductor package towards micromechanical properties has been investigated. The in-house fabricated Quad Flat No Lead was exposed to gamma radiation with the dose of 5 Gy. Afterwards, high temperature storage was performed at 150 °C for 10, 100 and 1000 hours. Subsequently, the three point bending technique was carried out to obtain the micromechanical properties of semiconductor package. The fracture of the packages caused by three point bending test was subjected to 3D CT scan to capture the image of the fracture. Irradiated package shows the decreasing in their strength with increasing doses of gamma radiation. However, the strength of the package was improved after high temperature storage for 10 hours and decreased as the storage period is extended. Further analysis exhibited that high temperature storage for 10 hours is reveal as good thermal treatment for package in radioactive environment application.

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