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(Invited) Water Transport Along Si/Si Direct Wafer Bonding Interfaces
ECS Meeting Abstracts
◽
10.1149/ma2018-02/29/944
◽
2018
◽
Keyword(s):
Water Transport
◽
Wafer Bonding
◽
Direct Wafer Bonding
Download Full-text
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Cited By
References
(Invited) Water Transport Along Si/Si Direct Wafer Bonding Interfaces
ECS Transactions
◽
10.1149/08605.0039ecst
◽
2018
◽
Vol 86
(5)
◽
pp. 39-47
Author(s):
François Rieutord
◽
Samuel Tardif
◽
Ivan Nikitskiy
◽
Frank Fournel
◽
Marwan Tedjini
◽
...
Keyword(s):
Water Transport
◽
Wafer Bonding
◽
Direct Wafer Bonding
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High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing
ECS Transactions
◽
10.1149/07509.0345ecst
◽
2016
◽
Vol 75
(9)
◽
pp. 345-353
◽
Cited By ~ 8
Author(s):
F. Kurz
◽
T. Plach
◽
J. Suss
◽
T. Wagenleitner
◽
D. Zinner
◽
...
Keyword(s):
Low Temperature
◽
High Precision
◽
Wafer Bonding
◽
Wafer Level
◽
3D Ics
◽
Direct Wafer Bonding
◽
Bonding Technology
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Low temperature GaAs/Si direct wafer bonding
Electronics Letters
◽
10.1049/el:20000507
◽
2000
◽
Vol 36
(7)
◽
pp. 677
◽
Cited By ~ 28
Author(s):
M. Alexe
◽
V. Dragoi
◽
M. Reiche
◽
U. Gösele
Keyword(s):
Low Temperature
◽
Wafer Bonding
◽
Direct Wafer Bonding
◽
Low Temperature Gaas
Download Full-text
An Atomic Force Microscopy Study on the Roughness of Silicon Wafers Correlated with Direct Wafer Bonding
Journal of The Electrochemical Society
◽
10.1149/1.1837009
◽
1996
◽
Vol 143
(7)
◽
pp. 2365-2371
◽
Cited By ~ 13
Author(s):
Brian E. Roberds
◽
Shari N. Farrens
Keyword(s):
Atomic Force Microscopy
◽
Wafer Bonding
◽
Microscopy Study
◽
Silicon Wafers
◽
Atomic Force Microscopy Study
◽
Force Microscopy
◽
Atomic Force
◽
Direct Wafer Bonding
Download Full-text
Point defects generated by direct-wafer bonding of silicon
Journal of Electronic Materials
◽
10.1007/s11664-002-0156-x
◽
2002
◽
Vol 31
(2)
◽
pp. 113-118
◽
Cited By ~ 3
Author(s):
L. Dózsa
◽
B. Szentpáli
◽
D. Pasquariello
◽
K. Hjort
Keyword(s):
Point Defects
◽
Wafer Bonding
◽
Direct Wafer Bonding
Download Full-text
New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers
ECS Transactions
◽
10.1149/1.2357057
◽
2019
◽
Vol 3
(6)
◽
pp. 79-90
◽
Cited By ~ 3
Author(s):
Bernard Aspar
◽
Chrystelle Lagahe-Blanchard
◽
Nicolas Sousbie
◽
Jacques Margail
◽
H. Moriceau
Keyword(s):
Wafer Bonding
◽
Direct Wafer Bonding
◽
New Generation
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Pb(Zr,Ti)O3-silicon heterostructures fabricated by direct wafer bonding
Integrated Ferroelectrics
◽
10.1080/10584589808012697
◽
1998
◽
Vol 19
(1-4)
◽
pp. 95-109
◽
Cited By ~ 6
Author(s):
Marin Alexe
◽
James F. Scott
◽
Alain Pignolet
◽
Dietrich Hesse
◽
Ulrich Gösele
Keyword(s):
Wafer Bonding
◽
Direct Wafer Bonding
◽
Silicon Heterostructures
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Silicon nanocrystallites in buried SiOx layers via direct wafer bonding
Applied Physics Letters
◽
10.1063/1.124467
◽
1999
◽
Vol 75
(5)
◽
pp. 641-643
◽
Cited By ~ 30
Author(s):
U. Kahler
◽
H. Hofmeister
Keyword(s):
Wafer Bonding
◽
Direct Wafer Bonding
◽
Silicon Nanocrystallites
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Vertical and lateral heterogeneous integration using direct wafer bonding
Compound Semiconductors 2001
◽
10.1201/9781482268980-47
◽
2002
◽
pp. 321-326
Keyword(s):
Wafer Bonding
◽
Heterogeneous Integration
◽
Direct Wafer Bonding
Download Full-text
Investigations on Bond Strength Development of Plasma Activated Direct Wafer Bonding with Annealing
ECS Transactions
◽
10.1149/05007.0277ecst
◽
2013
◽
Vol 50
(7)
◽
pp. 277-285
◽
Cited By ~ 4
Author(s):
T. Plach
◽
K. Hingerl
◽
D. Stifter
◽
V. Dragoi
◽
M. Wimplinger
Keyword(s):
Bond Strength
◽
Wafer Bonding
◽
Strength Development
◽
Direct Wafer Bonding
Download Full-text
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