scholarly journals A Novel Heat Sink Design and Prototyping for LED Desk Lamps

2015 ◽  
Vol 2015 ◽  
pp. 1-8
Author(s):  
Li-Ming Chu ◽  
Wei-Chin Chang ◽  
Ting Hsuan Huang
Keyword(s):  
Heat Sink ◽  
Light Emitting Diode ◽  
Base Plate ◽  
Life Time ◽  
Heat Sinks ◽  
Light Emitting ◽  
Lighting Device ◽  
Different Types ◽  
Heat Sink Design ◽  
Chimney Effect

Light-emitting diode (LED) is a modern lighting device. If the heat dissipating mechanism of LED desk lamp is not well designed, the induced high temperature will cause the reduction of illumination and life time of lamp. Therefore, the heat sink design becomes a key technology for LED lighting device. This study developed a methodology to design and analyze a heat sink for LED cooling. Four different types of heat sinks with fins in longitudinal or transverse directions and with or without vents on the base plate were compared. By using the CFD software FLUENT, heat flux and temperature around the heat sink were analyzed, and the surface temperature distribution was also investigated. The simulation outcomes were compared with experiments results to verify analysis accuracy. The comparisons show only slight differences, and the deviations were less than 4.0%. For cooling LED desk lamp, the design of using 12 vents on both sides of heat sink through natural convection to create the chimney effect was adopted; consequently, the temperature dropped 5°C in average. This design can also reduce the material of heat sink, LED lamp weight, and production cost.

scholarly journals Modelling and Numerical Simulations of Heat Distribution for LED Heat Sink

2016 ◽  
Vol 2016 ◽  
pp. 1-8 ◽  
Author(s):  
Jianxin Zhu ◽  
Lixia Sun
Keyword(s):  
Heat Sink ◽  
Optimization Design ◽  
Evaluation Method ◽  
Light Emitting Diode ◽  
Vertical Direction ◽  
Heat Sinks ◽  
Heat Distribution ◽  
Spherical Coordinate ◽  
Light Emitting ◽  
Implicit Finite Difference

Light-emitting diode (LED) has higher efficiency and longer lifetime when compared with the conventional lighting. However, the efficiency and lifetime will be degraded greatly when it is operated at a high temperature. Now, both previous simulation and experimental results have already indicated that the heat transfer in vertical direction of the LED lamp by conduction is the most critical component. In this paper, a simplified numerical simulation model is built to estimate the heat distribution of the LED heat sink in the spherical coordinate system, which would be useful for its shape optimization design. With this model, some mathematical treatments are provided to a heat conduction equation, in order to rapidly compute the static heat distribution and the temperature of different designs of LED heat sinks. The built rapid heat sink evaluation method, implicit finite difference method (IFDM), is unconditionally stable. Several heat distribution simulations could demonstrate that our built mathematical model conforms well to the reality and our method is full of feasibility and effectiveness.

Improved Radial Plane Fins Heat Sink for Light-Emitting Diode Lamps Cooling

2019 ◽  
Vol 12 (4) ◽  
Author(s):  
António M. G. Lopes ◽  
Vítor A. F. Costa
Keyword(s):  
Heat Sink ◽  
Numerical Study ◽  
Light Emitting Diode ◽  
Heat Sinks ◽  
Electronic Components ◽  
Turning Operation ◽  
Light Emitting ◽  
Radial Plane ◽  
Convection Cooling ◽  
Main Ideas

Abstract A numerical study is conducted concerning the improvement of radial plane fins heat sinks for natural convection cooling of light-emitting diode (LED) lamps. The main objective is to maintain the temperature of the heat sink base below a prescribed threshold for a given released heat flux at the heat sink, minimizing its mass and maintaining at a reasonably simple level the manufacturing processes and operations required for its production. Starting from a previously optimized heat sink for the same purpose, constituted by complete rectangular radial plane fins, the present study aims at further improvements by considering incomplete rectangular radial plane fins. The main objective of this study is to find the best profile for the turning operation to obtain the radial plane fins lighter configuration. It is found that this can be achieved by removing part of the upper internal corners of the rectangular fins, more specifically shaping a curved cut, leading to heat sink mass reduction up to 32.4%. The geometry of the improved heat sink is of cylindrical nature, obtained from cutting an aluminum extruded bar comprising a cylindrical central core and a number of uniformly distributed rectangular radial plane fins, followed by a simple turning operation to remove their upper internal corners. Even if results concern a particular LED lamp, the main ideas and approach prevail to improve other types of heat sinks for general light and/or electronic components cooling.

Understanding Longitudinal Fin Heat Sink Orientation Sensitivity for Light Emitting Diode (LED) Lighting Applications

2003 ◽  
Author(s):  
James Petroski
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Radiant Energy ◽  
Cylindrical Tube ◽  
Heat Sinks ◽  
Radiant Heat Transfer ◽  
Light Sources ◽  
Light Emitting

Light Emitting Diodes (LEDs) have progressed in recent years from emitting indicator level lighting to emitting enough light for illumination applications. This has opened a new field for LED applications, resulting in significant advantages over conventional light sources and creating some application challenges unique to LEDs. Conventional lighting methods provide little guidance for LED thermal problems since these usually involve a very high temperature source, such as a filament or an arc, and radiant heat transfer dissipates the thermal energy. LED junction temperatures are limited to much lower values and hence the heat transfer system cannot depend upon radiant energy transfer. This means the cooling methods for lighting now shift from primarily radiation to conduction and natural convection, and this paradigm shift lighting designers must recognize when moving to LEDs. In this paper, the development of a LED-based spot module heat sink in a free convective cooling system is discussed. The rationale for choosing a cylindrical tube, longitudinal fin (CTLF) heat sink is shown, as is the performance of five different configurations of the heat sink in various orientations. The requirement for using heat sinks in various orientations comes from lighting applications, where the light may be installed in various directions, such as vertical up, vertical down, horizontal, or at almost any other angle. Heat sink test results are plotted for Nussult number versus standard and modified channel Rayleigh number, showing a similar correlation to the parallel plate heat sinks investigated first by Elenbaas. A different correlation for the isolated-plate limit section is proposed for CTLF heat sinks, as well as a proposed area of operation on these Nu-Ra curves for orientation-insensitive heat sinks. Finally, explanations for the different levels of sensitivities observed in different areas of the Nu-Ra curves are offered.

scholarly journals Forced Convection upon Heat Sink of AL-Cu for Design Optimization by Experimental and CFD Analysis for Cooling of ICs in CPU

2019 ◽  
Vol 9 (2) ◽  
pp. 251-255
Keyword(s):  
Heat Sink ◽  
Base Plate ◽  
Power Input ◽  
Heat Sinks ◽  
Specific Power ◽  
Cfd Analysis ◽  
Cfd Simulations ◽  
Average Temperature ◽  
Specific Power Input ◽  
Heat Sink Design

A heat sink device is used with specific power input at 100V and 20W by the heater attached at the base plate of copper and then obtaining the average temperature of Heat sink by the help of 10 thermocouples .Two specimens of heat sinks were designed and were tested for mass flow rate and heat transfer coefficient. With base of 1.5mm&2.5mmtip thickness and another specimen with dimensions as tip0.5mm and1.00mmbase thickness are used By experimenting and CFD simulations,optimization of heat sink design was done.Then correlation and Validation foe both the specimen was done and were found satisfactory results.

scholarly journals Forced Convection upon Heat Sink of AL-Cu for Design Optimization by Experimental and CFD Analysis for cooling of ICs in CPU.

2019 ◽  
Vol 8 (4) ◽  
pp. 11172-11176
Keyword(s):  
Heat Sink ◽  
Base Plate ◽  
Power Input ◽  
Heat Sinks ◽  
Specific Power ◽  
Cfd Analysis ◽  
Cfd Simulations ◽  
Average Temperature ◽  
Specific Power Input ◽  
Heat Sink Design

A heat sink device is used with specific power input at 100V and 20W by the heater attached at the base plate of copper and then obtaining the average temperature of Heat sink by the help of 10 thermocouples .Two specimens of heat sinks were designed and were tested for mass flow rate and heat transfer coefficient. With base of 1.5mm&2.5mmtip thickness and another specimen with dimensions as tip0.5mm and1.00mmbase thickness are used By experimenting and CFD simulations,optimization of heat sink design was done.Then correlation and Validation foe both the specimen was done and were found satisfactory results.

scholarly journals Thermal performance of heat sink with fluid pockets for high power light emitting diode

2017 ◽  
Vol 14 (4) ◽  
pp. 4846-4862
Author(s):  
Sangmesh ◽  
◽  
Gopalakrishna Keshava Narayana ◽  
Manjunath Shiraganhalli Honnaiah ◽  
Krishna Venkatesh ◽  
...  
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Light Emitting Diode ◽  
Light Emitting

Study on the Factors Influencing Spreading Resistance of Heat Sinks

2011 ◽  
Vol 301-303 ◽  
pp. 165-169
Author(s):  
Da Yong Gao ◽  
Jian Xin Zhang ◽  
Ping Juan Niu
Keyword(s):  
Heat Source ◽  
Heat Sink ◽  
Electronic Devices ◽  
Great Influence ◽  
Base Plate ◽  
Critical Value ◽  
Area Ratio ◽  
Heat Sinks ◽  
Spreading Resistance ◽  
Factors Influencing

The spreading resistance is a very important parameter in the applications of heat sink. The design of electronic devices will fail without considering the influence of the spreading resistance. In this paper, a simple thermal model was simulated by Computational Fluid Dynamics software. Some factors, which have great influence on the spreading resistance, have been analyzed. The spreading resistance decreases significantly with the increasing of the area ratio between the heat source and the base-plate. While the ratio being 1, the spreading resistance reaches the mix value. The greater the thermal conductivity of heat sink, the lower the spreading resistance. With the increasing of the thickness of base-plate, the spreading resistance reduces. However, if the thickness exceeds the critical value, the spreading resistance will increase. And the spreading resistance reaches the mix value while the centers of heat source and the base-plate are overlapped.

Thermally Optimum Natural Convection Cooled Longitudinal-Plate Heat Sinks With Horizontal Base Plates

2001 ◽  
Author(s):  
K. K. Sikka ◽  
C. George
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Base Plate ◽  
Heat Sinks ◽  
Geometrical Parameters ◽  
Plate Heat ◽  
Horizontal Orientation ◽  
Fin Spacing ◽  
Base Plates ◽  
Weakly Dependent

Abstract Longitudinal-plate fin heat sinks are optimized under natural convection conditions for the horizontal orientation of the heat sink base plate. The thermal performance of the heat sinks is numerically modeled. The fin height, thickness and spacing and heat sink width are systematically varied. The numerical results are validated by experimentation. Results show that the thermal resistance of a heat sink minimizes for a certain number of fins on the base plate. The fin spacing-to-length ratio at which the minimum occurs is weakly dependent on the fin height and thickness and heat sink width. The flow fields reveal that the minimum occurs for the heat sink geometry in which the number of fins are maximized such that the flow velocity as the air exits the fins is fully developed. A correlation of the heat transfer with the heat sink geometrical parameters is also developed.

Low Cost Cooling Device for High Power LED Lamps

2020 ◽  
Author(s):  
Pamela Martinez-Vega ◽  
Araceli Lopez-Badillo ◽  
J. Luis Luviano-Ortiz ◽  
Abel Hernandez-Guerrero ◽  
Jaime G. Cervantes
Keyword(s):  
Reference Model ◽  
Light Emitting Diode ◽  
Low Cost ◽  
Cost Effective ◽  
Heat Sinks ◽  
Modern World ◽  
Type Model ◽  
Light Emitting

Abstract The modern world progressively demands more energy; according to forecasts energy consumption will grow at an average annual rate of 3 percent. Therefore, it is necessary to purchase products or devices that are efficient and environmentally friendly. Technology in LED (Light Emitting Diode) lighting is presented as an alternative to energy saving, since LEDs have proven to be extremely efficient, have a long service life and their cost-effective ratio is very good. However, the heat emitted by the LED chip must be dissipated effectively, since the overheating of the chip reduces the efficiency and lifetime of the lamp. Therefore, heat sinks that are reliable, efficient and inexpensive should be designed and built. The present work proposes new designs for heat sinks in LED lamps, some of the models in the design of the fins refer to the Fibonacci series. The models proposed in the present work that have a significant advantage are the Type 1E Model (5.2% mass savings and better thermal efficiency of 8.33%), GR Type 1 Model (3.12% lighter and 3.33% more efficient) and the GRL Type Model (4. 51% mass savings and 5.55% thermally more efficient) compared to the Type 2 Reference Model proposed by Jang et al. [12].

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