Improved Radial Plane Fins Heat Sink for Light-Emitting Diode Lamps Cooling

2019 ◽  
Vol 12 (4) ◽  
Author(s):  
António M. G. Lopes ◽  
Vítor A. F. Costa
Keyword(s):  
Heat Sink ◽  
Numerical Study ◽  
Light Emitting Diode ◽  
Heat Sinks ◽  
Electronic Components ◽  
Turning Operation ◽  
Light Emitting ◽  
Radial Plane ◽  
Convection Cooling ◽  
Main Ideas

Abstract A numerical study is conducted concerning the improvement of radial plane fins heat sinks for natural convection cooling of light-emitting diode (LED) lamps. The main objective is to maintain the temperature of the heat sink base below a prescribed threshold for a given released heat flux at the heat sink, minimizing its mass and maintaining at a reasonably simple level the manufacturing processes and operations required for its production. Starting from a previously optimized heat sink for the same purpose, constituted by complete rectangular radial plane fins, the present study aims at further improvements by considering incomplete rectangular radial plane fins. The main objective of this study is to find the best profile for the turning operation to obtain the radial plane fins lighter configuration. It is found that this can be achieved by removing part of the upper internal corners of the rectangular fins, more specifically shaping a curved cut, leading to heat sink mass reduction up to 32.4%. The geometry of the improved heat sink is of cylindrical nature, obtained from cutting an aluminum extruded bar comprising a cylindrical central core and a number of uniformly distributed rectangular radial plane fins, followed by a simple turning operation to remove their upper internal corners. Even if results concern a particular LED lamp, the main ideas and approach prevail to improve other types of heat sinks for general light and/or electronic components cooling.

scholarly journals Modelling and Numerical Simulations of Heat Distribution for LED Heat Sink

2016 ◽  
Vol 2016 ◽  
pp. 1-8 ◽  
Author(s):  
Jianxin Zhu ◽  
Lixia Sun
Keyword(s):  
Heat Sink ◽  
Optimization Design ◽  
Evaluation Method ◽  
Light Emitting Diode ◽  
Vertical Direction ◽  
Heat Sinks ◽  
Heat Distribution ◽  
Spherical Coordinate ◽  
Light Emitting ◽  
Implicit Finite Difference

Light-emitting diode (LED) has higher efficiency and longer lifetime when compared with the conventional lighting. However, the efficiency and lifetime will be degraded greatly when it is operated at a high temperature. Now, both previous simulation and experimental results have already indicated that the heat transfer in vertical direction of the LED lamp by conduction is the most critical component. In this paper, a simplified numerical simulation model is built to estimate the heat distribution of the LED heat sink in the spherical coordinate system, which would be useful for its shape optimization design. With this model, some mathematical treatments are provided to a heat conduction equation, in order to rapidly compute the static heat distribution and the temperature of different designs of LED heat sinks. The built rapid heat sink evaluation method, implicit finite difference method (IFDM), is unconditionally stable. Several heat distribution simulations could demonstrate that our built mathematical model conforms well to the reality and our method is full of feasibility and effectiveness.

scholarly journals A Novel Heat Sink Design and Prototyping for LED Desk Lamps

2015 ◽  
Vol 2015 ◽  
pp. 1-8
Author(s):  
Li-Ming Chu ◽  
Wei-Chin Chang ◽  
Ting Hsuan Huang
Keyword(s):  
Heat Sink ◽  
Light Emitting Diode ◽  
Base Plate ◽  
Life Time ◽  
Heat Sinks ◽  
Light Emitting ◽  
Lighting Device ◽  
Different Types ◽  
Heat Sink Design ◽  
Chimney Effect

Light-emitting diode (LED) is a modern lighting device. If the heat dissipating mechanism of LED desk lamp is not well designed, the induced high temperature will cause the reduction of illumination and life time of lamp. Therefore, the heat sink design becomes a key technology for LED lighting device. This study developed a methodology to design and analyze a heat sink for LED cooling. Four different types of heat sinks with fins in longitudinal or transverse directions and with or without vents on the base plate were compared. By using the CFD software FLUENT, heat flux and temperature around the heat sink were analyzed, and the surface temperature distribution was also investigated. The simulation outcomes were compared with experiments results to verify analysis accuracy. The comparisons show only slight differences, and the deviations were less than 4.0%. For cooling LED desk lamp, the design of using 12 vents on both sides of heat sink through natural convection to create the chimney effect was adopted; consequently, the temperature dropped 5°C in average. This design can also reduce the material of heat sink, LED lamp weight, and production cost.

Understanding Longitudinal Fin Heat Sink Orientation Sensitivity for Light Emitting Diode (LED) Lighting Applications

2003 ◽  
Author(s):  
James Petroski
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Radiant Energy ◽  
Cylindrical Tube ◽  
Heat Sinks ◽  
Radiant Heat Transfer ◽  
Light Sources ◽  
Light Emitting

Light Emitting Diodes (LEDs) have progressed in recent years from emitting indicator level lighting to emitting enough light for illumination applications. This has opened a new field for LED applications, resulting in significant advantages over conventional light sources and creating some application challenges unique to LEDs. Conventional lighting methods provide little guidance for LED thermal problems since these usually involve a very high temperature source, such as a filament or an arc, and radiant heat transfer dissipates the thermal energy. LED junction temperatures are limited to much lower values and hence the heat transfer system cannot depend upon radiant energy transfer. This means the cooling methods for lighting now shift from primarily radiation to conduction and natural convection, and this paradigm shift lighting designers must recognize when moving to LEDs. In this paper, the development of a LED-based spot module heat sink in a free convective cooling system is discussed. The rationale for choosing a cylindrical tube, longitudinal fin (CTLF) heat sink is shown, as is the performance of five different configurations of the heat sink in various orientations. The requirement for using heat sinks in various orientations comes from lighting applications, where the light may be installed in various directions, such as vertical up, vertical down, horizontal, or at almost any other angle. Heat sink test results are plotted for Nussult number versus standard and modified channel Rayleigh number, showing a similar correlation to the parallel plate heat sinks investigated first by Elenbaas. A different correlation for the isolated-plate limit section is proposed for CTLF heat sinks, as well as a proposed area of operation on these Nu-Ra curves for orientation-insensitive heat sinks. Finally, explanations for the different levels of sensitivities observed in different areas of the Nu-Ra curves are offered.

Pin-Fin Heat Sink With Horizontal Base and Blocked Edges

2008 ◽  
Author(s):  
D. Sahray ◽  
H. Shmueli ◽  
N. Segal ◽  
G. Ziskind ◽  
R. Letan
Keyword(s):  
Heat Transfer ◽  
Free Convection ◽  
Contact Resistance ◽  
Cross Section ◽  
Heat Input ◽  
Heat Sink ◽  
Numerical Study ◽  
Heat Sinks ◽  
Transfer Enhancement ◽  
Pin Fin

In the present work, horizontal-base pin fin heat sinks exposed to free convection in air are studied. They are made of aluminum, and there is no contact resistance between the base and the fins. For the same base dimensions the fin height and pitch vary. The fins have a constant square cross-section. The edges of the sink are blocked: the surrounding insulation is flush with the fin tips. The effect of fin height and pitch on the performance of the sink is studied experimentally and numerically. In the experiments, the heat sinks are heated using foil electrical heaters. The heat input is set, and temperatures of the base and fins are measured. In the corresponding numerical study, the sinks and their environment are modeled using the Fluent 6 software. The results show that heat transfer enhancement due to the fins is not monotonic. The differences between sparsely and densely populated sinks are analyzed for various fin heights. Also assessed are effects of the blocked edges as compared to the previously studied cases where the sink edges were exposed to the surroundings.

scholarly journals Thermal performance of heat sink with fluid pockets for high power light emitting diode

2017 ◽  
Vol 14 (4) ◽  
pp. 4846-4862
Author(s):  
Sangmesh ◽  
◽  
Gopalakrishna Keshava Narayana ◽  
Manjunath Shiraganhalli Honnaiah ◽  
Krishna Venkatesh ◽  
...  
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Light Emitting Diode ◽  
Light Emitting

Low Cost Cooling Device for High Power LED Lamps

2020 ◽  
Author(s):  
Pamela Martinez-Vega ◽  
Araceli Lopez-Badillo ◽  
J. Luis Luviano-Ortiz ◽  
Abel Hernandez-Guerrero ◽  
Jaime G. Cervantes
Keyword(s):  
Reference Model ◽  
Light Emitting Diode ◽  
Low Cost ◽  
Cost Effective ◽  
Heat Sinks ◽  
Modern World ◽  
Type Model ◽  
Light Emitting

Abstract The modern world progressively demands more energy; according to forecasts energy consumption will grow at an average annual rate of 3 percent. Therefore, it is necessary to purchase products or devices that are efficient and environmentally friendly. Technology in LED (Light Emitting Diode) lighting is presented as an alternative to energy saving, since LEDs have proven to be extremely efficient, have a long service life and their cost-effective ratio is very good. However, the heat emitted by the LED chip must be dissipated effectively, since the overheating of the chip reduces the efficiency and lifetime of the lamp. Therefore, heat sinks that are reliable, efficient and inexpensive should be designed and built. The present work proposes new designs for heat sinks in LED lamps, some of the models in the design of the fins refer to the Fibonacci series. The models proposed in the present work that have a significant advantage are the Type 1E Model (5.2% mass savings and better thermal efficiency of 8.33%), GR Type 1 Model (3.12% lighter and 3.33% more efficient) and the GRL Type Model (4. 51% mass savings and 5.55% thermally more efficient) compared to the Type 2 Reference Model proposed by Jang et al. [12].

LIFI COMMUNICATION SYSTEM USING KEYPAD

2022 ◽  
Vol 2 (1) ◽  
pp. 394-396
Author(s):  
Sapna Gupta ◽  
Gursharan Kaur ◽  
Ridima Mittal ◽  
Dev Garg
Keyword(s):  
Optical Communication ◽  
Data Transmission ◽  
Communication System ◽  
Light Emitting Diode ◽  
Transmission System ◽  
Electronic Components ◽  
Light Emitting ◽  
Data Transmission System ◽  
Wireless Fidelity

Over the years, the overdependence on Wireless Fidelity (Wi-Fi) for data transmission necessitated the need for an alternate and more reliable means of communication, hence, Light Fidelity (Li-Fi). It involves the use of Light Emitting Diode to transmit data by blinking (i.e. switching them on and off) at a speed not noticeable to the eye. This paper proposed the development of the Li-Fi system using off the shelf electronic components. This would make the system an indispensable means of communication in the nearest future. This data transmission system is different from those in existence because expensive components were not in the design, invariably reducing the overall cost of the implementation. Keywords: Light Fidelity (Li-Fi), Wireless Fidelity (Wi-Fi) Optical communication, Telecommunication

Numerical Study of Microchannel Heat Sinks With Non-Uniform Heat Flux Conditions

2011 ◽  
Author(s):  
Ling Ling ◽  
Yanfeng Fan ◽  
Ibrahim Hassan
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Numerical Study ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Bottom Surface ◽  
Nonuniform Heating ◽  
Uniform Heat Flux ◽  
Computational Domain ◽  
Uniform Heating

Higher heat flux is produced by Micro-Electro-Mechanical Systems (MEMS) because of their reduced size and increased clock speed. At the mean time, studies of non-uniform heating conditions which are more practical than uniform heating conditions are inadequate and needed urgently. Four nonuniform heating conditions are simulated in the paper. Three heat sinks with different widths of cross-linked channels locating above the center of hotspots are studied and compared to conventional straight microchannel heat sink. Half of the module geometry is chosen to be the computational domain. Two hotspots are placed at the bottom surface. The coolant is water, whose properties are dependent on temperature. Two inlet velocities, 0.5 m/s and 1 m/s, are tested for each heat sink. Temperature profile at the hotspots, pressure drop and total thermal resistance are selected as criteria of evaluating heat sink performance. All heat sinks have better performance when there is an upstream hotspot or the upstream hotspot is subjected to a higher heat flux. Cross-linked channel width of 0.5 mm has the best benefit to obtain better temperature uniformity without increasing the maximum temperature on the bottom surface.

Sign in / Sign up

Export Citation Format

Share Document