scholarly journals The Reliability, Testing and Evaluation of Hybrid Microcircuits

1977 ◽  
Vol 4 (3-4) ◽  
pp. 213-217 ◽  
Author(s):  
A. H. George

Reliability aspects of Hybrid Microcircuits are considered, including a prediction model illustrating the detail knowledge of the technology and application necessary. Circuit, part and element data is presented for two different test circuits. Use is made of predicted circuit failure rates to establish an electrical endurance test programme together with the thermal stress levels likely to generate some failures in an acceptable time. Results of testing the circuits at more than one temperature are presented, evaluated and compared with prediction. Failure analysis enables the performance of add-on parts, circuit elements and bonds to be assessed. A second series of test circuits confirms an improved bonding system. The usefulness of reliability modelling prior to endurance testing is justified together with some degree of thermal overstress.

Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.


Author(s):  
John Butchko ◽  
Bruce T. Gillette

Abstract Autoclave Stress failures were encountered at the 96 hour read during transistor reliability testing. A unique metal corrosion mechanism was found during the failure analysis, which was creating a contamination path to the drain source junction, resulting in high Idss and Igss leakage. The Al(Si) top metal was oxidizing along the grain boundaries at a faster rate than at the surface. There was subsurface blistering of the Al(Si), along with the grain boundary corrosion. This blistering was creating a contamination path from the package to the Si surface. Several variations in the metal stack were evaluated to better understand the cause of the failures and to provide a process solution. The prevention of intergranular metal corrosion and subsurface blistering during autoclave testing required a materials change from Al(Si) to Al(Si)(Cu). This change resulted in a reduced corrosion rate and consequently prevented Si contamination due to blistering. The process change resulted in a successful pass through the autoclave testing.


Author(s):  
Jeremy A. Walraven ◽  
Edward I. Cole ◽  
Danelle M. Tanner ◽  
Seethambal S. Mani ◽  
Ernest J. Garcia ◽  
...  

Abstract Surface micromachined micromirror technologies are being employed for various commercial and government applications. One application of micromirror technologies in the commercial sector can be found in Digital Light Projection (DLP™) systems used for theater and home entertainment centers. DLP™ systems developed by Texas Instruments uses DMD™ technology (Digital Mirror Device), an array of micromirrors, to project light onto a screen [1]. This technology is also used by Infocus™ projection systems and widescreen tabletop televisions [2]. Here, the micromirrors act as individual pixels, reflecting light onto the screen with high ¡§digital¡¨ resolution. The most recent application of surface micromachined micromirror technology is optical switching [3], which uses micromirrors to switch optical signals from fiber to fiber for lightwave telecommunications [4]. Companies such as Lucent have fabricated entire optical micromirror switching systems based on their Microstar™ technology [5]. For government applications, surface micromachined micromirror arrays have been developed for potential use in a spectrometer system planned for NASA's Next Generation Space Telescope (NGST) [6]. Various processing technologies are used to fabricate surface micromachined micromirrors. The micromirror arrays developed by TI and Lucent [1,4] uses metal for their structural and reflective components. Micromirrors fabricated at Sandia National Laboratories use the SUMMiT™ (Sandia's Ultra-planar MEMS Multi-level Technology) process with metal deposited on the surface of mechanical polysilicon components to reflect light. Optical micromirror arrays designed and fabricated at Sandia for potential use in the NGST have undergone reliability testing and failure analysis. This paper will discuss the failure modes found in these micromirrors after reliability testing. Suggestions and corrective actions for improvements in device performance will also be discussed.


2013 ◽  
Vol 378 ◽  
pp. 61-64 ◽  
Author(s):  
Ting Peng ◽  
Xiao Ling Wang ◽  
Shuan Fa Chen

The Weibull distribution is an ideal model for failure analysis. In this work, it is applied to simulate pavement performance regression process. Then, pavement performance prediction model is constructed according to the Weibull distribution. Historical pavement performance data are used to evaluate the practical performance of the model. According to the experimental results, ideal performance is obtained. It provides more accurate results compared with the previous work.


1999 ◽  
Author(s):  
Chong K. Oh ◽  
Soh P. Neo ◽  
Jian H. Bi ◽  
Zong M. Wu ◽  
Lian C. Goh ◽  
...  

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