Electroless Metallization Of Polyimides

Author(s):  
M. Romand ◽  
M. Charbonnier
2017 ◽  
Vol 164 (12) ◽  
pp. D764-D770 ◽  
Author(s):  
Andrea Testa ◽  
Roberto Bernasconi ◽  
Ryohei Yoshikawa ◽  
Issei Takenaka ◽  
Luca Magagnin ◽  
...  

Molecules ◽  
2021 ◽  
Vol 26 (18) ◽  
pp. 5571
Author(s):  
Piotr Rytlewski ◽  
Bartłomiej Jagodziński ◽  
Rafał Malinowski ◽  
Bogusław Budner ◽  
Krzysztof Moraczewski ◽  
...  

Polyurethane coatings containing copper(II) L-tyrosine and glass microspheres were laser irradiated and underwent electroless metallization. Various sizes of glass microspheres were incorporated into the polyurethane coating matrix in order to examine their effects on surface activation and electroless metallization. The surface of the coatings was activated by using ArF excimer laser emitting ultraviolet radiation (λ = 193 nm) using different number of laser pulses and their fluence. The effects of surface activation and metallization were evaluated mainly based on optical and scanning electron microcopies (SEM), energy-dispersive X-ray spectroscopy (EDX) and photoelectron spectroscopy (XPS). It was found that the presence of glass microspheres enabled the reduction in copper complex content, intensified the ablation process (higher cone-like structures created) and resulted in higher content of copper metallic seeds. On the other hand, the glass microspheres concentration, which was higher for lower size microspheres, was advantageous for obtaining a fully metallized layer.


2017 ◽  
pp. 321-350
Author(s):  
Piotr Rytlewski ◽  
Bartłomiej Jagodziński ◽  
Krzysztof Moraczewski

2020 ◽  
Vol 505 ◽  
pp. 144429 ◽  
Author(s):  
Piotr Rytlewski ◽  
Bartłomiej Jagodziński ◽  
Rafał Malinowski ◽  
Bogusław Budner ◽  
Krzysztof Moraczewski ◽  
...  

Author(s):  
A. Viehbeck ◽  
C. A. Kovac ◽  
S. L. Buchwalter ◽  
M. J. Goldberg ◽  
S. L. Tisdale

1998 ◽  
Vol 546 ◽  
Author(s):  
Hercules P. Neves ◽  
Thomas D. Kudrle ◽  
Jia-Ming Chen ◽  
Scott G. Adams ◽  
Michel Maharbiz ◽  
...  

AbstractWe propose electroless metallization as a method for conformal metal deposition microelectromechanical systems (MEMS). The intrinsically conformal nature of electroless deposition makes it ideal for coating high aspect ratio (greater than 50:1) structures frequently fabricated with micromachining techniques We take advantage of the selective nature of the deposition to obtain self-aligned electrical isolation. We minimize the metal film roughness for potential applications in RF and optics. Given the specific MEMS metallization requirements, we determined the ideal concentrations of additives and surfactants in order to provide good electrical isolation, low roughness and high film reliability. Our depositions were done using seed layers as well as through direct chemical activation of the silicon surface. Characteristics such as resistivity [ 1 ], morphology [ 1 ], microstructure [ 2 ], and electrochemical behavior [ 3 ] have already been reported in the literature; our paper is focused on the specific requirements for MEMS applications.


Author(s):  
J. M. Calvert ◽  
W. J. Dressick ◽  
C. S. Dulcey ◽  
M. S. Chen ◽  
J. H. Georger ◽  
...  

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