The Characteristics of an Antibacterial TiAgN Thin Film Coated by Physical Vapor Deposition Technique

2015 ◽  
Vol 15 (8) ◽  
pp. 6020-6023 ◽  
Author(s):  
Byeong-Mo Kang ◽  
Woon-Jo Jeong ◽  
Gye-Choon Park ◽  
Dong-Joo Yoon ◽  
Ho-Geun Ahn ◽  
...  
2017 ◽  
Vol 123 (9) ◽  
Author(s):  
Rini Lahiri ◽  
Anupam Ghosh ◽  
Shyam Murli Manohar Dhar Dwivedi ◽  
Shubhro Chakrabartty ◽  
P. Chinnamuthu ◽  
...  

2011 ◽  
Vol 25 (19) ◽  
pp. 2567-2574 ◽  
Author(s):  
M. YEGANEH ◽  
M. SAREMI

Electron beam physical vapor deposition (EBPVD) is being used in coating components for many applications such as for producing nanostructures and integrated circuits (ICs) coating in electronic industry. In this work, copper was deposited on the SiO 2/p-type Si (100). Thin film characteristics are investigated by scanning electron microscopy and X-ray diffraction (XRD). Then oxidation behavior of deposits was evaluated by Dektak Surface Profiler and weight gain method at 200 and 300°C. Results showed that thin film copper deposited by EBPVD has better oxidation characteristics in comparison with copper foil.


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