HiTeMS: A Pan-European Project to Solve High Temperature Measurement Problems in Industry

In my previous article [1] I discussed some of the innovations that are taking place at the National Physical Laboratory (NPL) in improving high temperature measurement. Starting with the current defined temperature scale ITS-90 [2, 3], I introduced the concepts of high-temperature fixed points [4], new types of thermocouple for use to 1500°C [5, 6] and developments in self-validation for contact thermometry sensors [7] and showed that high temperature measurement is undergoing a quiet revolution throughout the measurement chain. Here I want to set the work at NPL in a broader context of developments in the European Union (EU), again led from NPL, through the European Metrology Research Programme project “HiTeMS: High Temperature Measurement Solutions for Industry”.

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Development of a High Temperature Interconnect Solution as an Alternative to High Lead or Gold Content Solders

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2016-hitec-196 ◽

2016 ◽

Vol 2016 (HiTEC) ◽

pp. 000196-000206

Author(s):

Martin Wickham ◽

Kate Clayton ◽

Ana Robador ◽

Chris Hunt ◽

Robin Pittson ◽

...

Keyword(s):

High Temperature ◽

Electronic Materials ◽

Research Programme ◽

National Physical Laboratory ◽

Electrical Performance ◽

Processing Temperature ◽

Gold Content ◽

Physical Laboratory ◽

Electronic Assemblies ◽

High Lead

AbstractA collaborative research programme between project partners Microsemi, the National Physical Laboratory (NPL) and Gwent Electronic Materials (GEM), has successfully developed innovative materials specifically designed to offer an alternative for high Pb or Au content materials to increase the operating temperature of electronic assemblies. Currently, for electronic assemblies to operate at high temperature, they must use a high lead solder or a very expensive gold based solder to withstand these temperatures. The ELCOSINT project has developed an inexpensive lead-free alternative for joining high temperature electronics suitable for operating at temperatures above 250°C utilising standard surface mount assembly processes. This paper summarises the work undertaken by the authors to develop and better understand this new family of electrical interconnection materials. The project brought together a materials supplier (GEM – Gwent Electronic Materials), an end-user (MSL - Microsemi) and an technology research organisation (NPL – National Physical Laboratory) to jointly develop, test and implement in production, the solution based on silver-loaded silicone materials. This paper focuses on the testing and materials evaluation undertaken at NPL to determine the long term performance of these alternative materials including high temperature ageing up to 300°C, thermal cycling and damp heat testing. Details of the shear strength and electrical performance of interconnects between the substrates and components during the test regimes are given. The manufacturing process is outlined including details of the test vehicles utilised. The processing temperature for the conductive adhesive is 250°C which offers additional advantages in potential improvements in component and substrate reliability compared to soldered solutions which would typically be processed at temperatures above 300°C.

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Dissemination of thermodynamic temperature above the freezing point of silver

Philosophical Transactions of The Royal Society A Mathematical Physical and Engineering Sciences ◽

10.1098/rsta.2015.0043 ◽

2016 ◽

Vol 374 (2064) ◽

pp. 20150043 ◽

Cited By ~ 5

Author(s):

M. Sadli ◽

G. Machin ◽

K. Anhalt ◽

F. Bourson ◽

S. Briaudeau ◽

...

Keyword(s):

Temperature Scale ◽

Freezing Point ◽

Research Programme ◽

Thermodynamic Temperature ◽

Joint Project ◽

Metrology Research ◽

Mise En Pratique ◽

High Temperature Fixed Points ◽

Freezing Point Of Silver ◽

Definition Of

The mise-en-pratique for the definition of the kelvin at high temperatures will formally allow dissemination of thermodynamic temperature either directly or mediated through high-temperature fixed points (HTFPs). In this paper, these two distinct dissemination methods are evaluated, namely source-based and detector-based. This was achieved by performing two distinct dissemination trials: one based on HTFPs, the other based on absolutely calibrated radiation thermometers or filter radiometers. These trials involved six national metrology institutes in Europe in the frame of the European Metrology Research Programme joint project ‘Implementing the new kelvin’ (InK). The results have shown that both dissemination routes are possible, with similar standard uncertainties of 1–2 K, over the range 1273–2773 K, showing that, depending on the facilities available in the laboratory , it will soon be possible to disseminate thermodynamic temperatures above 1273 K to users by either of the two methods with uncertainties comparable to the current temperature scale.

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316. Temperature control in the H.T.S.T. pasteurization process

Journal of Dairy Research ◽

10.1017/s002202990003226x ◽

1945 ◽

Vol 14 (1-2) ◽

pp. 1-20 ◽

Cited By ~ 4

Author(s):

J. A. Hall

Keyword(s):

Temperature Measurement ◽

Temperature Control ◽

Vapour Pressure ◽

Research Programme ◽

National Physical Laboratory ◽

Experimental Results ◽

The Other ◽

Measuring Instruments ◽

Speed Of Response ◽

Physical Laboratory

An investigation has been made into the accuracy and speed of response of temperature-measuring instruments suitable for use in the control of H.T.S.T. pasteurization. Thermocouples used in conjunction with a ‘d.c. amplifier’ recorder system are shown to be markedly superior to both vapour-pressure and mercury-in-steel thermometers. The accuracy of temperature measurement is about ±0.3°F. as against ±1°., while the lag constant is about 0.2 sec. as against about 3 sec. Response to small, rapid and transient changes of temperature is also shown to be greatly improved. The operation of control contacts by the thermocouple recorder was found to be reliable to well within the limit of accuracy of calibration, but the other types showed variations of the order of ±1°F., in addition to the uncertainties of calibration.The work described in this paper was undertaken at the request of the National Institute for Research in Dairying as part of the research programme of the National Physical Laboratory, and is published by permission of the Director of the Laboratory. The author wishes to acknowledge the help he has received from Dr A. T. R. Mattick and Miss E. R. Hiscox of the National Institute for Research in Dairying and from his colleagues Mr C. Wigley and Miss V. M. Leaver. Dr Mattick and Miss Hiscox supplied the experimental results given in the introduction, for the drafting of which they are largely responsible. Mr Wigley derived the equations used in computing the theoretical curves of Text-fig. 6 and Miss Leaver assisted with the observational work.

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High Temperature Measurement

Proceeding of Advanced Course in Measurement Techniques in Heat and MassTransfer ◽

10.1615/ichmt.1985.advcoursemeastechheatmasstransf.200 ◽

1985 ◽

Author(s):

K. D. Maglic

Keyword(s):

High Temperature ◽

Temperature Measurement ◽

High Temperature Measurement

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Study on characteristics of schottky temperature detector based on metal/n-ZnO/n-Si structures

Micro and Nanosystems ◽

10.2174/1876402912999200910165426 ◽

2020 ◽

Vol 12 ◽

Author(s):

Fang Wang ◽

Jingkai Wei ◽

Caixia Guo ◽

Tao Ma ◽

Linqing Zhang ◽

...

Keyword(s):

High Temperature ◽

Temperature Measurement ◽

Temperature Response ◽

Large Temperature ◽

Mems Devices ◽

Temperature Range ◽

Response Characteristics ◽

High Temperature Measurement ◽

Temperature Detector ◽

Schottky Structure

Background: At present, the main problems of Micro-Electro-Mechanical Systems (MEMS) temperature detector focus on the narrow range of temperature detection, difficulty of the high temperature measurement. Besides, MEMS devices have different response characteristics for various surrounding temperature in the petrochemical and metallurgy application fields with high-temperature and harsh conditions. To evaluate the performance stability of the hightemperature MEMS devices, the real-time temperature measurement is necessary. Objective: A schottky temperature detector based on the metal/n-ZnO/n-Si structures is designed to measure high temperature (523~873K) for the high-temperature MEMS devices with large temperature range. Method: By using the finite element method (FEM), three different work function metals (Cu, Ni and Pt) contact with the n-ZnO are investigated to realize Schottky. At room temperature (298K) and high temperature (523~873K), the current densities with various bias voltages (J-V) are studied. Results: The simulation results show that the high temperature response power consumption of three schottky detectors of Cu, Ni and Pt decreases successively, which are 1.16 mW, 63.63 μW and 0.14 μW. The response temperature sensitivities of 6.35 μA/K, 0.78 μA/K, and 2.29 nA/K are achieved. Conclusion: The Cu/n-ZnO/n-Si schottky structure could be used as a high temperature detector (523~873K) for the hightemperature MEMS devices. It has a large temperature range (350K) and a high response sensitivity is 6.35 μA/K. Compared with traditional devices, the Cu/n-ZnO/n-Si Schottky structure based temperature detector has a low energy consumption of 1.16 mW, which has potential applications in the high-temperature measurement of the MEMS devices.

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