Effect of locally deposited nanosilica particles on interlaminar fracture toughness of high glass-transition temperature epoxy carbon fiber-reinforced composites

2019 ◽  
Vol 53 (25) ◽  
pp. 3599-3614 ◽  
Author(s):  
Bryan M Louis ◽  
Florian Klunker ◽  
Paolo Ermanni

This study explores the toughening of fiber-reinforced composite laminates to prevent against mode 1 delamination by using a selective placement of nanosilica particles in only the out-of-tow interlaminar regions of the laminate. In place of a conventional homogenous particle distribution throughout the laminate, “selective toughening” through controlled particle deposition is examined with the objective to increase the nanosilica toughening efficiency. Using a laboratory-scale manufacturing route conceptually similar to a combined prepreg and resin-film process, uni-directional carbon fiber composite laminates containing high glass-transition temperature amine-cured Dow D.E.R. 330 epoxy are produced from both particle distribution configurations. Comparisons are made by double cantilever beam testing for mode 1 delamination fracture energy G1C and by examination of the fracture surfaces. The results show that further nanosilica toughening efficiency is possible with local deposition and toughening compared to the conventional homogenous particle distribution throughout the laminate. For the same total nanosilica particle content in the laminate, the delamination toughening effects are maintained or improved when locally toughened in only the out-of-tow interlaminar regions. For mode 1 delamination initiation and propagation, fracture energy increases in the range of 60% over the untoughened laminates are found for the laminates with a local particle distribution. By comparison, those laminates with a conventional homogeneous particle distribution saw increase of 20–35% over the untoughened laminates. The implications of the localized toughening approach are discussed to provide further guidance in optimizing the use of nanosilica particles and particle toughening in general in composite laminates.

Materials ◽  
2021 ◽  
Vol 14 (6) ◽  
pp. 1394
Author(s):  
Chenping Zhang ◽  
Xiaohui Zhang ◽  
Yugang Duan ◽  
Yu Xia ◽  
Yueke Ming ◽  
...  

Drilling of carbon fiber-reinforced plastics (CFRPs) is a challenging task in aviation and aerospace field. Damages, which can reduce the strength of the structure, often occur during secondary machining operations due to the applied cutting force and generated heat. The main objective of this study was to investigate the drilling performance and the deformation resistance of CFRPs subjected to cryogenic treatment based on glass transition temperature (Tg). Therefore, a cryogenic machining approach was adopted by fixing the workpiece inside a cryogenic box to drill CFRPs. The machining performance was briefly evaluated. Moreover, a through-hole drilling method was promoted to analyze the mechanism of different deformation mechanical properties. The results showed that the cryogenic machining approach improved the machining performance of CFRPs. Nevertheless, the residual intensity of cryo-treated specimen decreased (about 7.14%) due to the Tg-based viscoelasticity. These results demonstrate the great potential of this approach in advanced industrial applications and further pave the way for efficient secondary machining operation of CFRP components.


Author(s):  
M. I. Valueva ◽  
I. V. Zelenina ◽  
M. A. Zharinov ◽  
M. A. Khaskov

The article presents results of studies of experimental carbon plastics based on thermosetting PMRpolyimide binder. Сarbon fiber reinforced plastics (CFRPs) are made from prepregs prepared by melt and mortar technologies, so the rheological properties of the polyimide binder were investigated. The heat resistance of carbon plastics was researched and its elastic-strength characteristics were determined at temperatures up to 320°С. The fundamental possibility of manufacturing carbon fiber from prepregs based on polyimide binder, obtained both by melt and mortar technologies, is shown. CFRPs made from two types of prepregs have a high glass transition temperature: 364°C (melt) and 367°C (solution), with this temperature remaining at the 97% level after boiling, and also at approximately the same (86–97%) level of conservation of elastic strength properties at temperature 300°С.


Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1734
Author(s):  
Erick Franieck ◽  
Martin Fleischmann ◽  
Ole Hölck ◽  
Larysa Kutuzova ◽  
Andreas Kandelbauer

We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was cured under isothermal temperatures close to general process conditions (165–185 °C). The material conversion was determined by measuring the ion viscosity. The change of the ion viscosity as a function of time and temperature was used to characterize the cross-linking behavior, following two separate approaches (model based and isoconversional). The determined kinetic parameters are in good agreement with those reported in the literature for EMCs and lead to accurate cure predictions under process-near conditions. Furthermore, the kinetic models based on dielectric analysis (DEA) were compared with standard offline differential scanning calorimetry (DSC) models, which were based on dynamic measurements. Many of the determined kinetic parameters had similar values for the different approaches. Major deviations were found for the parameters linked to the end of the reaction where vitrification phenomena occur under process-related conditions. The glass transition temperature of the inline molded parts was determined via thermomechanical analysis (TMA) to confirm the vitrification effect. The similarities and differences between the resulting kinetics models of the two different measurement techniques are presented and it is shown how dielectric analysis can be of high relevance for the characterization of the curing reaction under conditions close to series production.


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