Low-Power Memory Circuits

Author(s):  
Martin Margala
Keyword(s):  
1992 ◽  
Vol 39 (6) ◽  
pp. 1679-1684 ◽  
Author(s):  
M.N. Liu ◽  
S. Whitaker
Keyword(s):  

Circuit World ◽  
2019 ◽  
Vol 45 (4) ◽  
pp. 196-207
Author(s):  
Shilpi Birla

Purpose Major area of a die is consumed in memory components. Almost 60-70% of chip area is being consumed by “Memory Circuits”. The dominant memory in this market is SRAM, even though the SRAM size is larger than embedded DRAM, as SRAM does not have yield issues and the cost is not high as compared to DRAM. At the same time, the other attractive feature for the SRAM is speed, and it can be used for low power applications. CMOS SRAM is the crucial component in microprocessor chips and applications, and as the said major portion of the area is dedicated to SRAM arrays, CMOS SRAM is considered to be the stack holders in the memory market. Because of the scaling feature of CMOS, SRAM had its hold in the market over the past few decades. In recent years, the limitations of the CMOS scaling have raised so many issues like short channel effects, threshold voltage variations. The increased thrust for alternative devices leads to FinFET. FinFET is emerging as one of the suitable alternatives for CMOS and in the region of memory circuits. Design/methodology/approach In this paper, a new 11 T SRAM cell using FinFET technology has been proposed, the basic component of the cell is the 6 T SRAM cell with 4 NMOS access transistors to improve the stability and also makes it a dual port memory cell. The proposed cell uses a header scheme in which one extra PMOS transistor is used which is biased at different voltages to improve the read and write stability thus, helps in reducing the leakage power and active power. Findings The cell shows improvement in RSNM (read static noise margin) with LP8T by 2.39× at sub-threshold voltage 2.68× with D6T SRAM cell, 5.5× with TG8T. The WSNM (write static noise margin) and HM (hold margin) of the SRAM cell at 0.9 V is 306 mV and 384  mV. It shows improvement at sub-threshold operation also. The leakage power is reduced by 0.125× with LP8T, 0.022× with D6T SRAM cell, TG8T and SE8T. The impact of process variation on cell stability is also discussed. Research limitations/implications The FinFet has been used in place of CMOS even though the FinFet has been not been a matured technology; therefore, pdk files have been used. Practical implications SRAM cell has been designed which has good stability and reduced leakage by which we can make an array and which can be used as SRAM array. Social implications The cell can be used for SRAM memory for low power consumptions. Originality/value The work has been done by implementing various leakage techniques to design a stable and improved SRAM cell. The advantage of this work is that the cell has been working for low voltage without degrading the stability factor.


2007 ◽  
Vol 54 (6) ◽  
pp. 2004-2011 ◽  
Author(s):  
Tai-Hua Chen ◽  
Jinhui Chen ◽  
Lawrence T. Clark ◽  
Jonathan E. Knudsen ◽  
Giby Samson

2016 ◽  
Vol 48 ◽  
pp. 109-119 ◽  
Author(s):  
Hailong Jiao ◽  
Yongmin Qiu ◽  
Volkan Kursun
Keyword(s):  

2017 ◽  
Vol 64 (4) ◽  
pp. 847-857 ◽  
Author(s):  
Hao Cai ◽  
You Wang ◽  
Lirida Alves De Barros Naviner ◽  
Weisheng Zhao

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