A loadless 4T SRAM powered by gate leakage current with a high tolerance for fluctuations in device parameters

A novel loadless four-transistor static random access memory cell is proposed that consists of two N-type driver MOSFETs and two P-type access ones whose gate leakage currents from word-line are used for holding data in the cell. It is shown that the proposed cell has a higher tolerance for manufacturing device fluctuations compared with the conventional loadless 4T SRAM. Furthermore, it is free from bit-line disturb in contrast to the conventional cell. It is confirmed by simulation in 32nm technology node that the read static noise margin of the proposed cell reaches 138.7% of the six-transistor SRAM cell and that the hold static noise margin can be acceptable when the gate insulator thickness of the P-type access MOSFETs is made thinner than the N-type driver MOSFETs. The retention current for the proposed cell decreases to 66.7% of the 6TSRAM and the data rate in read increases to 125%.

A 9T FinFET SRAM cell for ultra-low power application in the subthreshold regime

Due to the scaling of the CMOS, the limitations of these devices raised the need for alternative nano-devices. Various devices are proposed like FinFET, TFET, CNTFET. Among these, the FinFET emerges as one of the promising devices which can replace the CMOS due to its low leakage in the nanometer regime. The electronics devices are nowadays more compact and efficient in terms of battery consumption. The CMOS SRAMs have been replaced by the FinFET SRAMs due to the scaling limitations of the CMOS. Two FinFET SRAM cells have been which power efficient are and having high stability. Performance comparison of these cells has been done to analyze the leakage power and the static noise margins. The simulation of the cells is done at 20 nm FinFET technology. It has been analyzed that the write margin of improved 9T SRAM cell achieves an improvement of 1.49x. The read margin is also showing a drastic improvement over the existing cells which has been compared in the paper. The hold margin was found to be better in the case of the proposed SRAM cell at 0.4 V. The gate length has been varied to find the effect on read margin with gate length.

Self-heating effect on logic performance of 6T-SRAM based on CFET device

CFET devices have become emerging and promising candidates for continuing Moore's law at sub-3 nm nodes owing to the area advantage of the N-P stacked structure, which markedly improves the integration of circuits. However, the introduction of vertical structure leads to severe thermal issues due to the self-heating effect, resulting in the degradation of the device and circuit performance. This paper mainly evaluates and analyzes the performance of the SRAM unit built using the CFET structure. The CFET-SRAM exhibits better performance than the conventional CMOS-SRAM in terms of access delay, even with the impact of self-heating. For the multi-fin-based CFET, although the total gate capacitance increases, the enhanced current improves the static noise margin significantly. However, as the number of channels expands, sheet-based CFET devices show more comprehensive superiority of area and performance.

Designing of Low-Power High-Speed Noise Immune CNTFET 1-Trit Unbalanced Ternary Subtractor

Ternary logic has been demonstrated as a superior contrasting option to binary logic. This paper presents a ternary subtractor circuit in which the input signal is converted into binary. The proposed design is implemented using Carbon Nanotube Field Effect Transistor (CNTFET), a forefront innovation. A correlation has been made in the proposed design on parameters like Power-Delay Product (PDP), Energy Delay Product (EDP), average power consumption, delay and static noise margin. Every one of these parameters is obtained by simulating the circuits on the HSPICE simulator. The proposed design indicates an improvement of 60.14%, 59.34%, 74.98% and 84.28%, respectively, in power consumption, delay, PDP and EDP individually in correlation with recent designs. The increased carbon nanotubes least affect the proposed subtractor design. In noise analysis, the proposed design outperformed all the existing designs.

SRAM CELL 6T AND 8T PARAMETRIC STABILITY ANALYSIS

As technology advances, the need for SRAM cells that may be utilised in high-speed applications grows. SRAM cells' static noise margin (SNM) is one of the most important variables to consider when designing a memory cell, and it is the main predictor of SRAM cell speed. The static noise margin will have an impact on the read and write margins. When it comes to the SRAM Cell's stability, the SNM is very important. For high-speed SRAMs, read/write margin analysis is critical since it affects how much data can be read and written. The simulation was run using Mentor Graphics' IC Station, which utilised 350nm technology rather than 180nm technology.

Restoration circuits for low power reduce swing of 6T and 8T SRAM cell with improved read and write margins

<span>This article clarifies about the variables that influence the static noise margin (SNM) of a static random-access memory. Track down the improved stability of proposed 8T SRAM cell which is superior to conventional 6T SRAM cell utilizing Swing Restored circuit with voltages Q and QB bar are peruse and Compose activity. This SRAM cell strategy on the circuit or engineering level is needed to improve read static noise margin (RSNM), write static noise margin (WSNM) and hold static noise margin (HSNM). This article relative investigation of conventional 6T, standard 8T and proposed 8T SRAM cells with improved stability and static noise margin is finished for 180 nm CMOS innovation. This paper is coordinated as follows: Introduction in area 1, The 6T SRAM cell are portrayed in segment 2. In area 3, proposed 8T SRAM cell is portrayed. In area 4, standard 8T SRAM cell. Segment 5 incorporates the simulation and results which give examination of different boundaries of 6T and 8T SRAM cells and segment 6 conclusions.</span>

Design and Analysis of SRAM Cell using Negative Bit-Line Write Assist Technique and Separate Read Port for High-Speed Applications

The present day electronic gadgets have semiconductor memory devices to store data. The static random access memory (SRAM) is a volatile memory, often preferred over dynamic random access memory (DRAM) due to higher speed and lower power dissipation. However, at scaling down of technology node, the leakage current in SRAM often increases and degrades its performance. To address this, the voltage scaling is preferred which subsequently affects the stability and delay of SRAM. This paper therefore presents a negative bit-line (NBL) write assist circuit which is used for enhancing the write ability while a separate (isolated) read buffer circuit is used for improving the read stability. In addition to this, the proposed design uses a tail (stack) transistor to decrease the overall static power dissipation and also to maintain the hold stability. The comparison of the proposed design has been done with state-of-the-art work in terms of write static noise margin (WSNM), write delay, read static noise margin (RSNM) and other parameters. It has been observed that there is an improvement of 48%, 11%, 19% and 32.4% in WSNM while reduction of 33%, 39%, 48% and 22% in write delay as compared to the conventional 6T SRAM cell, NBL, [Formula: see text] collapse and 9T UV SRAM, respectively.