622 Evaluation of Flip Chip Joint Using Finite Element Method

The Proceedings of The Computational Mechanics Conference ◽

10.1299/jsmecmd.2006.19.307 ◽

2006 ◽

Vol 2006.19 (0) ◽

pp. 307-308

Author(s):

Eiichi YAMADA ◽

Masazumi AMAGAI

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

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Reliability analysis of flip chip packages using contact finite element method

Journal of the Chinese Institute of Engineers ◽

10.1080/02533839.2004.9670861 ◽

2004 ◽

Vol 27 (2) ◽

pp. 165-172 ◽

Author(s):

Chun‐Te Lin ◽

Kuo‐Ning Chiang

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Reliability Analysis ◽

Flip Chip ◽

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Thermomechanical reliability study of flip-chip solder bumps: Using laser ultrasound technique and finite element method

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550036 ◽

2008 ◽

Author(s):

Jin Yang ◽

I. Charles Ume

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Laser Ultrasound ◽

Reliability Study ◽

Ultrasound Technique ◽

Solder Bumps ◽

Thermomechanical Reliability ◽

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Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606158 ◽

2002 ◽

Author(s):

D.W. Peterson ◽

J.N. Sweet ◽

S.N. Burchett ◽

A. Hsia

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Test Chip ◽

Flip Chip Assembly ◽

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Finite Element Method (FEM) simulation based analysis for optimal chip layout of a 2.5D flip chip package

2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) ◽

10.1109/s3s.2018.8640160 ◽

2018 ◽

Author(s):

Manish Nayini ◽

David Questad ◽

Mukta Farooq

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Fem Simulation ◽

Simulation Based ◽

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Thermomechanical Reliability Study of Flip Chip Solder Bumps: Using Laser Ultrasound Technique and Finite Element Method

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2009.2025889 ◽

2009 ◽

Vol 32 (4) ◽

pp. 729-739 ◽

Author(s):

Jin Yang ◽

I.C. Ume

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Laser Ultrasound ◽

Reliability Study ◽

Ultrasound Technique ◽

Solder Bumps ◽

Thermomechanical Reliability ◽

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Thermal performance of flip chip using finite element method

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689515 ◽

2002 ◽

Author(s):

A.Q. Yasir ◽

D.M. Pereira ◽

A.Y. Hassan ◽

K.N. Seetharamu

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Thermal Performance ◽

Flip Chip ◽

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Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

10.2172/463650 ◽

1996 ◽

Author(s):

D.W. Peterson ◽

J.N. Sweet ◽

S.N. Burchett ◽

A. Hsia

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Test Chip ◽

Flip Chip Assembly ◽

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Simulation of tuning graphene plasmonic behaviors by ferroelectric domains for self-driven infrared photodetector applications

Nanoscale ◽

10.1039/c9nr06508c ◽

2019 ◽

Vol 11 (43) ◽

pp. 20868-20875 ◽

Author(s):

Junxiong Guo ◽

Yu Liu ◽

Yuan Lin ◽

Yu Tian ◽

Jinxing Zhang ◽

...

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Interfacial Effect ◽

Infrared Photodetector ◽

The Finite Element Method ◽

Ferroelectric Domains ◽

We propose a graphene plasmonic infrared photodetector tuned by ferroelectric domains and investigate the interfacial effect using the finite element method.

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Groundwater Modeling by the Finite Element Method

10.1029/wm013 ◽

1989 ◽

Author(s):

Jonathan Istok

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Groundwater Modeling ◽

The Finite Element Method ◽

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OPTIMAL AND SUPERCONVERGENCE ESTIMATES OF THE FINITE ELEMENT METHOD FOR A SCALAR HYPERBOLIC EQUATION

Acta Mathematica Scientia ◽

10.1016/s0252-9602(18)30094-8 ◽

1994 ◽

Vol 14 (1) ◽

pp. 90-94 ◽

Author(s):

Aihui Zhou ◽

Qun Lin

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Hyperbolic Equation ◽

The Finite Element Method ◽

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