Thermomechanical Reliability Study of Flip Chip Solder Bumps: Using Laser Ultrasound Technique and Finite Element Method
2009 ◽
Vol 32
(4)
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pp. 729-739
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2004 ◽
Vol 27
(2)
◽
pp. 165-172
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2003 ◽
Vol 42
(Part 1, No. 5B)
◽
pp. 3184-3188
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Keyword(s):
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2006 ◽
Vol 2006.19
(0)
◽
pp. 307-308
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