scholarly journals Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

1996 ◽  
Author(s):  
D.W. Peterson ◽  
J.N. Sweet ◽  
S.N. Burchett ◽  
A. Hsia
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Flip Chip ◽  
Test Chip ◽  
Flip Chip Assembly ◽  
Element Method

Simulation of tuning graphene plasmonic behaviors by ferroelectric domains for self-driven infrared photodetector applications

Nanoscale ◽  
2019 ◽  
Vol 11 (43) ◽  
pp. 20868-20875 ◽  
Author(s):  
Junxiong Guo ◽  
Yu Liu ◽  
Yuan Lin ◽  
Yu Tian ◽  
Jinxing Zhang ◽  
...  
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Interfacial Effect ◽  
Infrared Photodetector ◽  
The Finite Element Method ◽  
Ferroelectric Domains ◽  
Element Method

We propose a graphene plasmonic infrared photodetector tuned by ferroelectric domains and investigate the interfacial effect using the finite element method.

Sign in / Sign up

Export Citation Format

Share Document