202 MD Simulations on Porosity and Mechanical Properties of Al Thin Film sputtered on Si Substrate

2000 ◽  
Vol 2000.75 (0) ◽  
pp. _2-3_-_2-4_
Author(s):  
Takashi IIZUKA ◽  
Akira ONODA ◽  
Toshihiko HOSHIDE
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Md Simulations ◽  
Si Substrate ◽  
Al Thin Film

Modeling of Cohesive Zone and Crack Growth in Ni-Al Thin-Film Using MD-XFEM Based Approach

2010 ◽  
Author(s):  
Gaurav Singh ◽  
Vijay Kumar Sutrakar ◽  
D. Roy Mahapatra
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Cohesive Zone ◽  
Cohesive Zone Model ◽  
Solid Phase ◽  
Md Simulations ◽  
Failure Behavior ◽  
Mode I ◽  
Zone Model ◽  
Al Thin Film

Intermetallic alloys of Ni-Al have important applications in high temperature anti-corrosive coatings, engine and turbine related materials, and shape memory devices. Predicting failure behavior of these materials is difficult using purely continuum model, since several of the material constants are complicated functions of micro and nano-scale details. This includes solid-solid phase transformation. In the present paper, a framework for analyzing fracture in two-dimensional planar domain is developed using a molecular dynamic (MD) simulation and extended finite element method (XFEM). The framework is then applied to simulate fracture in Ni-Al thin-film. Effect of Ni Al crystallites of various sizes on the mechanical properties is analyzed using direct MD simulations. Initiation and growth of crack under slow (quasi-static) tensile loading in mode-I condition is considered. Mechanical properties at room temperature are estimated via MD simulations, which are further used in the XFEM at the continuum scale. A cohesive zone model for the macroscopic XFEM model is implemented, which directly bridges the molecular length-scale via MD framework. Numerical convergence studies are reported for mode-I crack in initially single crystal B2 Ni-Al thin film.

Effect of Al Thin Film on Microstructure and Mechanical Properties of Diffusion-Bonded LY12/TC4 Joints

2014 ◽  
Vol 616 ◽  
pp. 275-279
Author(s):  
Qiang Guo Luo ◽  
Xue Shu Hu ◽  
Qiang Shen ◽  
Lian Meng Zhang
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Shear Strength ◽  
Shear Fracture ◽  
Interfacial Microstructure ◽  
Microstructure And Mechanical Properties ◽  
Average Shear Strength ◽  
Tc4 Alloy ◽  
Thin Interlayer ◽  
Al Thin Film

LY12/TC4 joints have wide applications in many industrial areas such as aerospace, nuclear and chemical industries. In the present study, TC4 alloy and LY12 alloy with and without aluminum thin film was produced under low temperature of 380 oC. The microstructure and mechanical properties of the joints were investigated. The addition of the Al thin interlayer had largely improved the interfacial microstructure and shear strength of the joints. The average shear strength of LY12/Al/TC4 joints was 64.3 MPa which was 2.5 times larger than the LY12/TC4 joints’ strength. The shear fracture mainly occurred on the interface of LY12 and TC4 from the XRD result of fracture surfaces.

scholarly journals In Situ Study of Dislocation Behavior in Columnar Al Thin Film on Si Substrate During Thermal Cycling

1999 ◽  
Vol 594 ◽  
Author(s):  
Charles W. Allen ◽  
Herbert Schroeder ◽  
Jon M. Hiller
Keyword(s):  
Thin Film ◽  
Thermal Cycling ◽  
Grain Structure ◽  
Dislocation Model ◽  
Si Substrate ◽  
Transmission Electron ◽  
Dislocation Behavior ◽  
Columnar Grain ◽  
Al Thin Film

AbstractIn situ transmission electron microscopy (150 kV) has been employed to study the evolution of dislocation microstructures during relatively rapid thermal cycling of a 200 nm Al thin film on Si substrate. After a few thermal cycles between 150 and 500°C, nearly stable Al columnar grain structure is established with average grain less than a μm. On rapid cooling (3–30+ °C/s) from 500°C, dislocations first appear at a nominal temperature of 360–380°C, quickly multiplying and forming planar glide plane arrays on further cooling. From a large number of such experiments we have attempted to deduce the dislocation evolution during thermal cycling in these polycrystalline Al films and to account qualitatively for the results on a simple dislocation model.

scholarly journals MD Simulation of Hardness Property of Al Thin Film Sputtered on Si Substrate and Its Related to Porosity.

2001 ◽  
Vol 44 (3) ◽  
pp. 346-353 ◽  
Author(s):  
Takashi IIZUKA ◽  
Akira ONODA ◽  
Toshihiko HOSHIDE
Keyword(s):  
Thin Film ◽  
Md Simulation ◽  
Si Substrate ◽  
Hardness Property ◽  
Al Thin Film

Effect of Diffusion-Temperature on Microstructure and Mechanical Properties of Diffusion-Bonded TC4/Al Thin Film/1060 Al Joints

2017 ◽  
Vol 727 ◽  
pp. 972-976
Author(s):  
Guo Qiang Luo ◽  
Jia Yu He ◽  
Jian Zhang ◽  
Xue Shu Hu ◽  
Qiang Shen ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Shear Strength ◽  
Strength Test ◽  
Bonded Joints ◽  
Shear Strength Test ◽  
Ti Alloys ◽  
Microstructure And Mechanical Properties ◽  
Diffusion Temperature ◽  
Al Thin Film

Diffusion bonded joints of Ti alloys and Al alloys are widely applied in chemical, nuclear, aerospace industries. In the present study, TC4/Al thin film/1060 Al joints were bonded successfully by means of diffusion bonding under low temperature. The microstructure and mechanical properties of the joints were investigated by SEM,XRD and shear strength test. The results showed that the highest shear strength of TC4/Al thin film/1060 Al joints was 80.2 MPa. With the increasing of temperature, the shear strength increases firstly and then almost remains the same. Ti and Al elements diffused to each other in the bonding process and the intermetallic compounds can’t be found. The fracture of the joint had taken place in the 1060 Al/Al thin film rather than in the TC4/Al thin film and the fracture way of the joints was ductile fracture.

Microstructural and fractographic characterization of B4C-Al cermets tested under dynamic and static loading

1989 ◽  
Vol 47 ◽  
pp. 562-563
Author(s):  
Gyeung Ho Kim ◽  
Mehmet Sarikaya ◽  
D. L. Milius ◽  
I. A. Aksay
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Static Loading ◽  
Carbon Deposition ◽  
Full Density ◽  
Unique Combination ◽  
Strong Component ◽  
Reaction Products

Cermets are designed to optimize the mechanical properties of ceramics (hard and strong component) and metals (ductile and tough component) into one system. However, the processing of such systems is a problem in obtaining fully dense composite without deleterious reaction products. In the lightweight (2.65 g/cc) B4C-Al cermet, many of the processing problems have been circumvented. It is now possible to process fully dense B4C-Al cermet with tailored microstructures and achieve unique combination of mechanical properties (fracture strength of over 600 MPa and fracture toughness of 12 MPa-m1/2). In this paper, microstructure and fractography of B4C-Al cermets, tested under dynamic and static loading conditions, are described.The cermet is prepared by infiltration of Al at 1150°C into partially sintered B4C compact under vacuum to full density. Fracture surface replicas were prepared by using cellulose acetate and thin-film carbon deposition. Samples were observed with a Philips 3000 at 100 kV.

scholarly journals Optical, electrical and mechanical properties of TiN thin film obtained from a TiO2 sol-gel coating and rapid thermal nitridation

2021 ◽  
pp. 127089
Author(s):  
Arnaud Valour ◽  
Maria Alejandra Usuga Higuita ◽  
Gaylord Guillonneau ◽  
Nicolas Crespo-Monteiro ◽  
Damien Jamon ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Sol Gel ◽  
Tio2 Sol ◽  
Thermal Nitridation
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