A018 Three-dimensional cutting edge distribution of abrasives on diamond grinding wheel working surface

The wafer grinding by use of fixed abrasive diamond wheels is required to create a high-quality wafer surface in a short time. In general, it is known that the grinding performance of diamond wheel is mainly dependent on grinding wheel specifications and grinding conditions. The cutting edge distribution or abrasive protrusion height in depth-wise of a specified wheel is one of the most important factors to determine the finishing surface roughness and the grinding force, which in turn determine the surface and subsurface quality of ground wafers. The overall purpose of this study is to understand the dynamic behavior of each diamond abrasive via modeling an actual diamond wheel and simulating of wafer grinding. In previous report [1], we have theoretically analyzed three-dimensional cutting edge distribution on the working surface of diamond wheels. This paper reports our recent achievements in the evaluation of 3-D cutting edge distribution in depth-wise of a specified wheel via the bearing ratio of its topography.

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Multi-Scale Observation of Microscopic Protrusion Topography of Diamond Grinding Wheel

First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B ◽

10.1115/mnc2007-21317 ◽

2007 ◽

Author(s):

J. Xie ◽

Z. L. Tian

Keyword(s):

Fractal Dimension ◽

Distribution Coefficient ◽

Cutting Edge ◽

Depth Of Cut ◽

Grinding Wheel ◽

Diamond Grit ◽

Diamond Grinding Wheel ◽

Multi Scale ◽

Diamond Grinding ◽

Pull Out

Multi-scale evaluation of microscopic grit protrusion topography on dressed wheel surface was conducted with reference to diamond grit protrusion height, its distribution coefficient, active grit protrusion number, grit pull-out number and protrusion fractal dimension. The aim is to evaluate dressing performance of diamond grinding wheel by the use of grit protrusion topography. First, dressing experiments of metal-bonded #40, #80 and #120 diamond grinding wheels were conducted with reference to different dressing parameters such as the depth of cut and moving speed. Second, grit protrusion height was measured and its distribution coefficient was analyzed. Then, the microscopic observation of grit protrusion feature was conducted to evaluate dressing results. Finally, fractal dimension was employed to analyze cutting edge integrality of diamond grit protrusion. The experimental results and theoretical analyses showed that average protrusion height is about 1/3 of diamond grit size and mainly depends on the depth of cut. The distribution coefficient of protrusion height can be used to evaluate the trimness of grit protrusion heights and active grit number. In addition, the fractal dimension of grit protrusion shape can display grit cutting edge integrity and its crack feature, namely the less fractal dimension, the better grit protrusion integrity and the better dressing result.

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Improvement of Ground Surface Roughness of Optical Materials by Means of Cutting Edge Truncation of Metal-Bonded Diamond Grinding Wheel(Superabrasive/new wheel grinding process)

Proceedings of International Conference on Leading Edge Manufacturing in 21st century LEM21 ◽

10.1299/jsmelem.2005.1.193 ◽

2005 ◽

Vol 2005.1 (0) ◽

pp. 193-198 ◽

Cited By ~ 1

Author(s):

Xijun KANG ◽

Jun'ichi TAMAKI ◽

Akihiko KUBO ◽

Jiwang YAN ◽

Toshirou IYAMA

Keyword(s):

Surface Roughness ◽

Optical Materials ◽

Ground Surface ◽

Cutting Edge ◽

Grinding Wheel ◽

Grinding Process ◽

Diamond Grinding Wheel ◽

Diamond Grinding ◽

Ground Surface Roughness

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The Three-Dimensional Surface Topographic Characterisation of Diamond Grinding Wheels

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.126-128.690 ◽

2010 ◽

Vol 126-128 ◽

pp. 690-695

Author(s):

David Lee Butler

Keyword(s):

Measurement Techniques ◽

Three Dimensional ◽

Surface Measurement ◽

Grinding Wheel ◽

Profile Measurement ◽

Detailed Knowledge ◽

Grinding Wheels ◽

Diamond Grinding ◽

Insight Into ◽

Dimensional Surface

Surface measurement using three-dimensional stylus instruments is a relatively new technique that offers numerous advantages over more traditional profilometry methods. The information generated is, unlike profile measurement, less subjective and more statistical providing additional insight into the surface structure. One application of surface measurement that has encountered problems when using the profilometry method is that of grinding wheel characterisation. The wheel surface texture (topography) and the conditions under which it is generated have a profound effect upon the grinding performance as characterised by the grinding forces, power consumption, temperature, and surface integrity of components. A detailed knowledge of the nature of the topography of the grinding wheel would provide further insight into surface interactions between the wheel and workpiece as well as enabling improved control of the grinding process in general. In this paper four diamond grinding wheels of 91 and 181 micron grit size were subjected to differing dressing conditions to produce varying final wheel topographies. Three-dimensional surface measurement techniques were employed to quantitatively characterise the topographic change and provide an aerial estimation of the number of cutting grains. The results demonstrate that the techniques can distinguish between a worn and dressed wheel. In addition, the parametric values generated from the various surfaces can aid the user in determining when re-dressing is required.

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Investigation of tribological conditions on grinding of bioceramic material using diamond grinding wheel under different cooling and lubrication environment

Journal of Manufacturing Processes ◽

10.1016/j.jmapro.2021.09.004 ◽

2021 ◽

Vol 71 ◽

pp. 550-564

Author(s):

N. Arunachalam ◽

P. Suya Prem Anand ◽

L. Vijayaraghavan

Keyword(s):

Grinding Wheel ◽

Diamond Grinding Wheel ◽

Diamond Grinding ◽

Cooling And Lubrication

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Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.389-390.36 ◽

2008 ◽

Vol 389-390 ◽

pp. 36-41

Author(s):

Feng Wei Huo ◽

Dong Ming Guo ◽

Ren Ke Kang ◽

Zhu Ji Jin

Keyword(s):

Surface Topography ◽

Sampling Interval ◽

Grinding Wheel ◽

Height Distribution ◽

Wheel Surface ◽

Diamond Grinding Wheel ◽

Diamond Grinding ◽

Cutting Surface ◽

Ultra Precision ◽

Cutting Direction

A 3D profiler based on scanning white light interferometry with a lateral sampling interval of 0.11μm was introduced to measure the surface topography of a #3000 diamond grinding wheel, and a large sampling area could be achieved by its stitching capability without compromising its lateral or vertical resolution. The protrusion height distribution of diamond grains and the static effective grain density of the grinding wheel were derived, and the wheel chatter and the deformation of the wheel were analyzed as well. The study shows that the grain protrusion height obeys an approximate normal distribution, the static effective grain density is much lower than the theoretical density, and only a small number of diamond grains are effective in the grinding process with fine diamond grinding wheel. There exists waviness on the grinding wheel surface parallel with the wheel cutting direction. The cutting surface of the grinding wheel is not flat but umbilicate, which indicates that the elastic deformation at the wheel edges is much larger than in the center region.

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