Interparticle Bonding Process of Metal Powder by Cyclic Unidirectional Sliding

2018 ◽  
Vol 2018 (0) ◽  
pp. J0460103
Author(s):  
Sho TAKEDA ◽  
Hiroyuki MIKI ◽  
Julien FONTAINE ◽  
Matthieu GUIBERT ◽  
Hiroyuki KOSUKEGAWA ◽  
...  
Keyword(s):  
Metal Powder ◽  
Bonding Process ◽  
Interparticle Bonding

Mechanism of interparticle bonding of metal powder by repetitive unidirectional friction process

2017 ◽  
Vol 2017 (0) ◽  
pp. OS1623
Author(s):  
Sho TAKEDA ◽  
Hiroyuki MIKI ◽  
Julien FONTAINE ◽  
Matthieu GUIBERT ◽  
Takamichi MIYAZAKI ◽  
...  
Keyword(s):  
Metal Powder ◽  
Friction Process ◽  
Interparticle Bonding

ANCORSTEEL 4600V

Alloy Digest ◽  
2012 ◽  
Vol 61 (6) ◽  
Keyword(s):  
Fracture Toughness ◽  
Physical Properties ◽  
Tensile Properties ◽  
Metal Powder ◽  
Heat Treating ◽  
Powder Metal

Abstract Ancorsteel 4600V alloy is a water-atomized low-alloy sinter-hardening metal powder. This datasheet provides information on composition, physical properties, hardness, and tensile properties as well as fracture toughness. It also includes information on heat treating and powder metal forms. Filing Code: SA-655. Producer or source: Hoeganaes Corporation.

Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

2014 ◽  
Author(s):  
Jinglong Li ◽  
Motohiko Masuda ◽  
Yi Che ◽  
Miao Wu
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Die Bonding ◽  
Generic Analysis

Abstract Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

scholarly journals Carbon Particle In-Situ Alloying of the Case-Hardening Steel 16MnCr5 in Laser Powder Bed Fusion

Metals ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 896
Author(s):  
Matthias Schmitt ◽  
Albin Gottwalt ◽  
Jakob Winkler ◽  
Thomas Tobie ◽  
Georg Schlick ◽  
...  
Keyword(s):  
Laser Beam ◽  
Mechanical Strength ◽  
Carbon Content ◽  
Metal Powder ◽  
Case Hardening ◽  
Powder Bed Fusion ◽  
Powder Bed ◽  
Carbon Particles ◽  
Case Hardening Steel

The carbon content of steel affects many of its essential properties, e.g., hardness and mechanical strength. In the powder bed fusion process of metals using a laser beam (PBF-LB/M), usually, pre-alloyed metal powder is solidified layer-by-layer using a laser beam to create parts. A reduction of the carbon content in steels is observed during this process. This study examines adding carbon particles to the metal powder and in situ alloying in the PBF-LB/M process as a countermeasure. Suitable carbon particles are selected and their effect on the particle size distribution and homogeneity of the mixtures is analysed. The workability in PBF-LB is then shown. This is followed by an evaluation of the resulting mechanical properties (hardness and mechanical strength) and microstructure in the as-built state and the state after heat treatment. Furthermore, potential use cases like multi-material or functionally graded parts are discussed.

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